Temperature and Humidity Sensor Node Design

Work done
  • No tasks were completed; execution halted due to insufficient credits.
Pending tasks
  • Core Component Integration
    • Select and place a dual-radio MCU (Wi-Fi + BLE 5.x)
    • Add a digital temperature and humidity sensor with I²C pull-ups
    • Add a USB-C receptacle and configure CC pull-downs for sink
  • Power Subsystem and Protection
    • Route VBUS through an eFuse or protection IC (0.5 A–3 A)
    • Add a 5 V→3.3 V low-Iq regulator
    • Place 100 nF decoupling and low-ESR bulk capacitors
  • Signal Integrity and ESD Protection
    • Add bidirectional TVS diodes on USB D+ and D– (<1 pF)
    • Define solid ground scheme and add bulk decoupling
  • Connectivity and Layout Preparation
    • Connect I²C, boot, reset, programming pins; add status LED/test points
    • Plan RF keep-out zones, antenna clearance, via stitching, sensor vent
  • Final Review and Validation
    • Run ERC/DRC, verify power/thermal, update BOM, export schematic/PCB
Success criteria status
  • ✗ Schematic is empty; no components placed
  • ✗ No power, ESD, or signal-integrity measures implemented
  • ✗ No PCB layout exists for RF or grounding practices
Recommended next step Begin with Core Component Integration: select and place the dual-radio MCU supporting 802.11 b/g/n and BLE 5.x so we can build out the rest of the schematic.


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