Yes — J1 is positioned on the left edge near the PCB centerline, with its Type‑C opening flush/overhanging the Ø39 mm board edge for the casing side opening. Its current center is about X = -13.03 mm, Y = -0.38 mm, and its body extends to X ≈ -20.91 mm, slightly past the Ø39 mm board edge at -19.5 mm, which matches a flush side-port style placement.
Note: the board is still flagged as extremely dense/unroutable overall, but this J1 edge placement is now aligned with your intent.
Done — I rotated J1 90° clockwise while keeping it centered on the left edge with the Type‑C opening flush/slightly overhanging the Ø39 mm board edge. The layout tool still warns the overall board is very dense, so we’ll need dual-layer placement or BOM reduction for the full board to be routable.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant