Audited the schematic ground structure and confirmed there are no explicitly named split ground domains such as AGND or DGND.
Verified the project contains one named GND net plus many unnamed local ground-class nets tied to IC ground pins.
Updated the Change Log to accurately record the audit findings and the modification attempt.
Success criteria review
❌ All standard GND portals replaced with ground symbols
✅ Explicit split ground domains such as AGND and DGND remain intact
✅ Schematic integrity was reviewed enough to confirm no explicit split-ground domains were changed during the attempt
Next steps
An issue occurred while applying the bulk ground-symbol replacement, so I could not complete the actual portal swap in this run. If you want, I can continue with a narrower, staged replacement strategy once the schematic edit path is working again.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant