I’ll update the MAX77961 footprint’s BATT copper pad to match the datasheet case drawing as a real custom SMD pad, preserving its BATT connectivity and mask/paste behavior. I’ll first verify the datasheet geometry and existing footprint/pad mapping, then apply the footprint change and run checks for mismatches.

I found the official ADI land-pattern reference (90-100100) and confirmed BATT is pin 12 in the 30‑lead FC2QFN package; the current footprint has BATT overridden as a simple rectangular pad, so I’m replacing that with a custom SMD land-pattern polygon based on the drawing dimensions.

I found and used the official Analog Devices references for MAX77961: datasheet max77960-max77961.pdf, package outline 21-100278, and land pattern 90-100100. I created new KiCad footprint assets with pin 12/BATT implemented as a real smd custom pad on F.Cu F.Paste F.Mask, then switched the footprint rule to the latest asset: MAX77961BEFV12_custom_BATT_v2.kicad_mod.

Current caveat: I ran out of tool credits immediately after applying the v2 footprint asset, so I could not re-read the layout to confirm Flux regenerated the displayed pad geometry from the new custom asset. Before considering this complete, verify that the BATT pad is no longer shown as the old rectangular override and run a final DRC/review.