Part Data Review and Update

Please change the BATT SMD pad in the MAX77961 footprint to the case drawing shown in the datasheet.

The BATT pad should follow the non-rectangular/custom open pin shape shown in the datasheet case drawing. Do not simply make it an extended rectangular pad if the shape in the datasheet is non-rectangular.

This should be a real custom SMD pad on the copper layer, not a silkscreen object or graphic element. Leave the pad connected to the BATT pin/net and maintain the correct solder mask and solder paste holes.

Please reproduce the BATT pad geometry as closely as possible to the datasheet drawing, including the extended/custom shape, and as shown there.

flux

0:08

Thought for a moment

I’ll update the MAX77961 footprint’s BATT copper pad to match the datasheet case drawing as a real custom SMD pad, preserving its BATT connectivity and mask/paste behavior. I’ll first verify the datasheet geometry and existing footprint/pad mapping, then apply the footprint change and run checks for mismatches.

flux

9:22

Thought for 4 sec

Created 6 tasks.

1/6 Retrieve guidance for datasheet extraction and layout/footprint rule editing

Thought for 4 sec

Thought for 3 sec

2/6 Inspect existing schematic/BOM/layout assets for MAX77961 BATT pad and datasheet URL

Thought for 3 sec

Reading assets.

Read BOM.

Read schematic.

Read layout.

Thought for 7 sec

3/6 Consult official datasheet case drawing for BATT pad geometry

Thought for 4 sec

Found 10 results for MAX77961BEFV12+ datasheet PDF official Analog Devices case drawing.

Thought for 9 sec

Read "Find the package/case drawing or land pattern for MAX77961 30 FC2QFN 4x4 package, especially the BATT pin 12 non-rectangular/custom open pad geometry. Extract all dimensions and coordinates for pin 12 BATT pad and nearby pins." in max77960-max77961.pdf.

Read "Find the pin configuration table for MAX77961BEFV12+ including pin 12 BATT package, pin count, package name and package code." in max77960-max77961.pdf.

Read max77960-max77961.pdf.

Thought for 1 min 21 sec

Thought for 23 sec

Read 90-100100.pdf.

Thought for 4 sec

Running code.

Code executed.

Thought for 15 sec

Thought for a moment

I found the official ADI land-pattern reference (90-100100) and confirmed BATT is pin 12 in the 30‑lead FC2QFN package; the current footprint has BATT overridden as a simple rectangular pad, so I’m replacing that with a custom SMD land-pattern polygon based on the drawing dimensions.

flux

2:52

Thought for 3 sec

4/6 Modify the BATT SMD pad copper geometry while preserving BATT net and mask/paste openings

Thought for 27 sec

Exporting project.

Thought for 6 sec

Managing assets.

Thought for 4 sec

Editing layout rules.

Thought for 2 sec

5/6 Validate footprint pad count/connectivity and DRC/ERC impacts

Thought for 3 sec

Reading assets.

Completed 3 design checks — found 1 issue.

Read layout.

Thought for 18 sec

Thought for 14 sec

Exporting project.

Thought for 6 sec

Managing assets.

Thought for 5 sec

Editing layout rules.

Thought for a moment

I found and used the official Analog Devices references for MAX77961: datasheet max77960-max77961.pdf, package outline 21-100278, and land pattern 90-100100. I created new KiCad footprint assets with pin 12/BATT implemented as a real smd custom pad on F.Cu F.Paste F.Mask, then switched the footprint rule to the latest asset: MAX77961BEFV12_custom_BATT_v2.kicad_mod.

Current caveat: I ran out of tool credits immediately after applying the v2 footprint asset, so I could not re-read the layout to confirm Flux regenerated the displayed pad geometry from the new custom asset. Before considering this complete, verify that the BATT pad is no longer shown as the old rectangular override and run a final DRC/review.

Verify BATT pad

Show pad coordinates

Check pad override

Export footprint

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