I’ll inspect the project structure and create a comprehensive test plan document covering electrical, thermal, mechanical, environmental, interface, automation, risks, and reliability recommendations.
I found no existing project files, so I’m drafting a new test plan grounded in the BOM: IP5328P power-bank SoC, USB-C, Micro-USB, dual USB-A outputs, LEDs, button, NTC, MOSFETs, inductor, and bulk/input/output capacitors.
Created and verified the comprehensive test plan: Comprehensive Test Plan — Powerbank board rnjs. It covers scope, objectives, functional/non-functional requirements, electrical/thermal/mechanical/environmental/interface tests, automation strategy, edge cases, risks, and reliability recommendations.
Open items:
Final numeric pass/fail limits still need the locked battery specification, rated PD/fast-charge profiles, and final IP5328P operating targets.
Suggested next steps:
Define the exact battery pack and rated output/input profiles.
Add test pads for the key rails and status/control nets.
Run ERC/DRC and update the plan with any design-specific issues found.
Create a production test fixture checklist from this plan.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant