Agent Mode Activation
Functional Verification Report
PASS means confirmed from live project data and, where required, immutable datasheet evidence. FAIL means live project data demonstrates a functional or manufacturing defect. UNVERIFIED means the required external evidence or physical mapping was unavailable. Datasheet indexing returned “immutable evidence not ready” for the TPIC6B595 and SN74AHCT125 queries, so claims requiring datasheet clauses are not promoted to PASS.Purpose and Implementation
PASS means confirmed from live project data and, where required, immutable datasheet evidence. FAIL means live project data demonstrates a functional or manufacturing defect. UNVERIFIED means the required external evidence or physical mapping was unavailable. Datasheet indexing returned “immutable evidence not ready” for the TPIC6B595 and SN74AHCT125 queries, so claims requiring datasheet clauses are not promoted to PASS.Table
| Item | Result | Evidence / consequence |
|---|---|---|
| U1 Raspberry Pi Pico 2 W symbol numbering | UNVERIFIED | Live symbol maps GPIO17/18/19 to physical pins 22/24/25, VSYS to 39, VBUS to 40, and grounds to the expected module positions. Required immutable manufacturer citation and symbol-to-footprint pad inspection were not available in this pass. |
| U2/U3 TPIC6B595 pin names and numbers | UNVERIFIED | Live symbol is: NC 1, VCC 2, SER IN 3, DRAIN0–3 4–7, /SRCLR 8, /G 9, GND 10/11, RCK 12, SRCK 13, DRAIN4–7 14–17, SER OUT 18, GND 19, NC 20. This is internally consistent, but the requested immutable datasheet clause and footprint-pad proof were unavailable because indexing was not ready. A wrong pad map would cross-connect logic, drains, or power. |
| U4 LM1117 pin names and numbers | UNVERIFIED | Live symbol maps GND=1, VO=2 and tab/pad 4, VI=3. Footprint-pad geometry and immutable datasheet clause were not retrieved. |
| U5 SN74AHCT125 pin names and numbers | UNVERIFIED | Live symbol uses standard quad-buffer order: /1OE 1, 1A 2, 1Y 3; /2OE 4, 2A 5, 2Y 6; GND 7; 3Y 8, 3A 9, /3OE 10; 4Y 11, 4A 12, /4OE 13, VCC 14. Datasheet evidence and footprint-pad proof were unavailable. |
| DS1/DS2 40101B-5 mapping | UNVERIFIED | The project part explicitly states that its geometry is user-controlled and that no external compatibility or datasheet claim is made. Current assignment is CA1=1, E=2, D=3, C=4, DP=5, B=6, A=7, CA2=8, F=9, G=10. No manufacturer source confirming CA1=1 / CA2=8 was found. If CA pins are wrong, +12 V may be applied to a segment pin while a common-anode pin is driven through a resistor/TPIC drain, causing incorrect display behavior and possible component overstress. |
| J1 Tensility 54-00164 pin/pad mapping | UNVERIFIED | Live nets use B=+12 V and A1/A2=GND; C is unused. The exact manufacturer contact-function and footprint-pad mapping was not established with immutable evidence. |
Table
| Check | Result | Evidence |
|---|---|---|
| Continuity/topology of all three paths | PASS | Confirmed from live schematic net membership listed above. |
| U1 3.3 V output meets AHCT input VIH | UNVERIFIED | The architecture is appropriate for TTL-threshold AHCT input, but exact U1 VOH and U5 VIH clauses were not retrieved. |
| U5 output meets TPIC VIH=0.85·VCC | UNVERIFIED | At VCC=5 V the stated receiver threshold is 4.25 V. Exact guaranteed U5 VOH under the relevant load and TPIC VIH clause could not be cited. |
| VOL/VIL margins | UNVERIFIED | Exact guaranteed driver VOL and receiver VIL values under applicable currents were not retrieved. |
| First-shifted byte physical destination | PASS | With U3 first in the serial chain and U2 downstream, after 16 clocks the earliest byte has propagated into U2, which drives DS1. The later byte remains in U3 and drives DS2. This assumes conventional MSB/LSB firmware ordering within each byte. |
I=(VS−VF)/R.Table
| Segment type | VS | VF assumption | R | Calculated current | 5–20 mA check |
|---|---|---|---|---|---|
| A–G, five dies | 11.5 V | 5×2.0 V | 220 Ω | 6.82 mA | PASS |
| A–G, five dies | 11.5 V | 5×1.8 V | 220 Ω | 11.36 mA | PASS |
| A–G, five dies | 12.0 V | 5×2.0 V | 220 Ω | 9.09 mA | PASS |
| A–G, five dies | 12.0 V | 5×1.8 V | 220 Ω | 13.64 mA | PASS |
| A–G, five dies | 12.5 V | 5×2.0 V | 220 Ω | 11.36 mA | PASS |
| A–G, five dies | 12.5 V | 5×1.8 V | 220 Ω | 15.91 mA | PASS |
| DP, one die | 11.5 V | 2.0 V | 1 kΩ | 9.50 mA | PASS |
| DP, one die | 11.5 V | 1.8 V | 1 kΩ | 9.70 mA | PASS |
| DP, one die | 12.0 V | 2.0 V | 1 kΩ | 10.00 mA | PASS |
| DP, one die | 12.0 V | 1.8 V | 1 kΩ | 10.20 mA | PASS |
| DP, one die | 12.5 V | 2.0 V | 1 kΩ | 10.50 mA | PASS |
| DP, one die | 12.5 V | 1.8 V | 1 kΩ | 10.70 mA | PASS |
Table
| Check | Result | Evidence |
|---|---|---|
| U2/U3 power and local decoupling | PASS | VCC pin 2 is on +5 V; GND pins 10/11/19 are on GND. C6 and C7 are each 100 nF from +5 V to GND and assigned by role to U2/U3. |
| U5 power and local decoupling | PASS | VCC pin 14 is on +5 V, pin 7 is GND, and C5 is 100 nF from +5 V to GND assigned to U5. |
| U4 basic connectivity | PASS | VI pin 3 is +12 V, VO pins 2/4 are +5 V, GND pin 1 is GND. C1/C2 are input bypass/bulk; C3 is output bulk. |
| LM1117 capacitor compliance | UNVERIFIED | C3 is specified as 10 µF tantalum with a project note requiring 0.3–22 Ω ESR, but the actual capacitor MPN/ESR over temperature is absent. C2/C3 are generic and polarity is not represented by the selected generic non-polarized symbol. |
| Tantalum derating | PASS for nominal voltage ratio; UNVERIFIED for vendor rule | C2: 12.5 V maximum request case on 25 V rating = 50% rated voltage. C3: 5 V on 16 V = 31.25%. Actual surge/temperature derating compliance requires capacitor MPN data. |
| LM1117 dropout/headroom | PASS for nominal architecture | 12 V input provides large voltage headroom for a 5 V output; exact dropout at assumed load was not cited. |
| LM1117 thermal performance | FAIL | Dissipation is approximately (12−5)×ILOAD. At 200 mA this is 1.4 W; at 300 mA it is 2.1 W; at 500 mA it is 3.5 W. These levels are severe for SOT-223 without a validated large thermal copper area. The observed dedicated +5 V thermal polygon was reported inactive, so the intended copper heat spreader cannot be credited. Exact junction temperature is UNVERIFIED because actual effective copper area, board thermal stack, ambient, and cited θJA curve were unavailable. |
| U1 VSYS voltage | PASS for 12 V powered case | U1 VSYS is tied to regulated +5 V, not +12 V. |
| No U1 pin above 5.5 V | UNVERIFIED | Signal pins connect only to U5 inputs, and power enters VSYS at +5 V. However, dual-source/backfeed behavior can alter +5 V and was not proven safe. |
Table
| State | Result | Rail behavior / concern |
|---|---|---|
| 12 V present, USB absent | FAIL | +12 V feeds displays and LM1117; +5 V feeds Pico VSYS, U5, U2, U3. Function is topologically correct, but LM1117 thermal performance is not adequate/validated for Wi-Fi load. |
| USB present, 12 V absent | FAIL | Pico VBUS can feed VSYS through its onboard power path, placing an approximately USB-derived voltage onto the board +5 V net and therefore U5/TPIC supplies and U4 output. The exact diode drop and resulting minimum rail were not cited, so logic compliance is UNVERIFIED. There is no external reverse-current limiting/isolation shown between +5 V and U4 output; reverse current into the unpowered LM1117 input is not bounded by a schematic component. |
| Both 12 V and USB present | UNVERIFIED / high risk | The Pico module includes its own VBUS/VSYS power-path behavior, but the external LM1117 hard-drives VSYS/+5 V. No explicit ideal-diode or source-selection element isolates the two sources. Absence of USB back-drive cannot be confirmed. |
| Power-on before first RCK | FAIL as deterministic-display requirement | /G is permanently low (outputs enabled). /SRCLR is pulled high, so it does not clear the shift register at startup. Before known data are shifted and latched, the output state is not guaranteed by schematic control; visible random/undefined segments may occur. |
Table
| Check | Result | Evidence |
|---|---|---|
| U5 used-channel enables | PASS | /1OE, /2OE, /3OE are tied to GND. |
| U5 unused channel | PASS | /4OE and 4A are tied to GND, so the unused input is not floating and its output is disabled only if /4OE high; here /4OE low means 4Y actively drives low. It is electrically defined but unnecessarily enabled. |
| TPIC output enables | PASS | Both /G pins are tied to GND, enabling drains. |
| /SRCLR bias | PASS | Shared SRCLR_N connects both TPIC /SRCLR pins through R20=10 kΩ to +5 V. |
| GPIO17/18/19 SPI suitability | UNVERIFIED | The chosen GPIOs are connected consistently, but the exact Pico 2 W alternate-function table and reset defaults were not retrieved with immutable citation. Firmware can generally select GPIO function, but this cannot be marked PASS under the requested evidence rule. |
Table
| Check | Result | Evidence |
|---|---|---|
| J2/J3 identical pin order | PASS | Both are: 1 +12 V, 2 GND, 3 +5 V, 4 DATA, 5 SRCK, 6 RCK. |
| Signals and rails provided | PASS | A second panel receives +12 V, GND, +5 V, DATA, SRCK, and RCK. Each logic signal shares the GND return on pin 2. |
| Can an otherwise identical panel run with U1/U4/U5/J1 absent? | PASS with electrical caveat | The headers provide both power rails and already level-shifted logic, so its TPICs/displays can operate without those upstream parts. It lacks local 12→5 V conversion, controller, input connector, and level shifting, by design. |
| Same-content behavior | UNVERIFIED | A parallel DATA/SRCK/RCK connection makes both panels receive the same serial stream, but loading, cable length, edge integrity, connector orientation, and firmware timing were not analyzed from physical interconnect specifications. |
Table
| Finding | Result | Classification |
|---|---|---|
| J3 overlaps DS1 on Top, 14.39 mm² | FAIL | Real assembly defect: component bodies overlap. |
| J3 overlaps J1 on Bottom, 2.89 mm² | FAIL | Real assembly/mechanical defect. |
| J1 edge placement | FAIL | Real connector-placement defect; a board-edge connector must align and orient to the board edge. |
| Three overlapping-copper findings involving J1/nearby traces | FAIL | Real short/manufacturing risk until geometry is inspected and corrected. |
| U1 VBUS missing-power ERC | PASS as intentional no-connect | Project role explicitly states VBUS is intentionally unused because the design powers the module through VSYS. This ERC item is intentional in the 12 V-only intended use, though the USB power-state request exposes a separate architecture risk. |
| Informational component overrides | UNVERIFIED | Overrides are not inherently defects; each affected shape needs manual visual comparison to the intended footprint/model. |
Executive result
1. Pin-map provenance
2. DATA, SRCK, RCK, and cascade
Live signal paths
3. Segment paths and currents
Drain assignment
Current calculations
4. Power and decoupling
5. Power-state cases
6. Enable and control logic
7. Expansion bus
8. Fresh ERC/DRC results
Ordered blockers and degradations
Prevents reliable operation or manufacture
Degrades behavior or verification confidence