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U1
M3
U2
M2
IC2
U3
M1
IC3
U4
IC1
IC3 GND_3 - IC3 THERMAL_PAD
U4 PROG3 - C42 P1
IC3 GND_3 - IC3 THERMAL_PAD
U4 VPCC - C40 P1
IC3 GND_3 - IC3 THERMAL_PAD
R23 P2 - SW3 B
M3 IO38 - R19 P2
IC3 GND_3 - IC3 THERMAL_PAD
J5 DN1 - J5 DN2
U4 OUT_2 - U5 VIN
U4 OUT_2 - U5 VIN
J5 VBUS_1 - J5 VBUS_2
IC3 VDD_2 - C44 P1
IC3 GND_3 - IC3 THERMAL_PAD
U5 VOUT - M3 3V3
U5 VOUT - M3 3V3
U4 IN_2 - C43 P1
U4 VSS_2 - U4 EP
U4 CE - U4 SEL
J5 VBUS_1 - J5 VBUS_2
GND
U4 IN_2 - C43 P1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 VDD_2 - C44 P1
M3 IO2 - R23 P1
J5 GND_4 - U4 VSS_1
U4 PROG1 - C41 P1
R22 P2 - SW3 A
M3 IO39 - R20 P2
M3 IO4 - IC3 BCLK
U4 IN_2 - C43 P1
U4 STAT2 - M3 IO17
M3 IO13 - SW4 A
R21 P2 - M3 IO0
IC3 GND_3 - IC3 THERMAL_PAD
M3 IO6 - IC3 DIN
U4 VSS_2 - U4 EP
M3 IO11 - J6 DC
M3 IO9 - J6 DIN
J5 DP1 - J5 DP2
M3 IO8 - J6 CLK
U4 OUT_2 - U5 VIN
M3 IO15 - SW4 S1
M3 IO9 - J6 DIN
M3 IO14 - SW4 B
IC3 OUTP - J8 P1
M3 IO39 - R20 P2
R23 P2 - SW3 B
U4 PROG3 - C42 P1
M3 IO3 - SW3 S1
M3 IO12 - J6 RST
M3 IO10 - J6 CS
IC3 VDD_2 - C44 P1
J5 DP1 - J5 DP2
J5 CC1 - R17 P1
M3 IO38 - R19 P2
R21 P2 - M3 IO0
IC3 OUTN - J8 P2
J5 VBUS_4 - U4 IN_1
J5 DN1 - J5 DN2
U4 VSS_2 - U4 EP
IC3 GND_3 - IC3 THERMAL_PAD
R22 P2 - SW3 A
U4 STAT2 - M3 IO17
M3 IO2 - R23 P1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
M3 IO4 - IC3 BCLK
M3 IO8 - J6 CLK
J5 VBUS_4 - U4 IN_1
M3 IO13 - SW4 A
U5 VOUT - M3 3V3
IC3 VDD_2 - C44 P1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
U5 VOUT - M3 3V3
J5 CC2 - R18 P1
M3 IO10 - J6 CS
U4 PROG1 - C41 P1
U4 VBAT_SENSE - J7 PIN1
IC3 OUTP - J8 P1
U4 STAT1/~LBO - M3 IO18
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
M3 IO5 - IC3 LRCLK
U5 VOUT - M3 3V3
U4 THERM - C39 P1
R21 P2 - M3 IO0
M3 IO11 - J6 DC
M3 IO3 - SW3 S1
U5 VOUT - M3 3V3
IC3 GND_3 - IC3 THERMAL_PAD
U4 ~PG - M3 IO16
U4 VSS_2 - U4 EP
M3 IO12 - J6 RST
IC3 GND_3 - IC3 THERMAL_PAD
J5 CC1 - R17 P1
M3 IO14 - SW4 B
U4 CE - U4 SEL
M3 IO15 - SW4 S1
IC3 VDD_2 - C44 P1
GND
IC3 GND_3 - IC3 THERMAL_PAD
J5 DN1 - J5 DN2
U4 VSS_2 - U4 EP
U4 CE - U4 SEL
U4 ~PG - M3 IO16
U4 VBAT_SENSE - J7 PIN1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
U4 THERM - C39 P1
U4 VPCC - C40 P1
U4 VBAT_SENSE - J7 PIN1
U5 VOUT - M3 3V3
M3 IO5 - IC3 LRCLK
M3 IO1 - R22 P1
IC3 GND_3 - IC3 THERMAL_PAD
U5 VOUT - M3 3V3
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
M3 IO1 - R22 P1
IC3 GND_3 - IC3 THERMAL_PAD
U4 STAT1/~LBO - M3 IO18
U5 VOUT - M3 3V3
M3 IO6 - IC3 DIN
IC3 GND_3 - IC3 THERMAL_PAD
J5 GND_4 - U4 VSS_1
IC3 OUTN - J8 P2
J5 DP1 - J5 DP2
IC3 GND_3 - IC3 THERMAL_PAD
J5 CC2 - R18 P1
IC3 GND_3 - IC3 THERMAL_PAD
C33
Capacitance
1uF
C4
Capacitance
100nF
C26
Capacitance
10uF
C47
Capacitance
10uF
C22
Capacitance
100nF
C38
Capacitance
100nF
C46
Capacitance
10uF
C32
Capacitance
22uF
C13
Capacitance
10uF
C42
Capacitance
100nF
C30
Capacitance
10uF
C51
Capacitance
1uF
C1
Capacitance
100nF
C31
Capacitance
100nF
C44
Capacitance
10uF
C23
Capacitance
100nF
C35
Capacitance
100nF
C27
Capacitance
10uF
C25
Capacitance
100nF
C8
Capacitance
100nF
C29
Capacitance
10uF
C2
Capacitance
100nF
C7
Capacitance
100nF
C34
Capacitance
1uF
C10
Capacitance
10uF
C24
Capacitance
100nF
C16
Capacitance
1uF
C20
Capacitance
100nF
C43
Capacitance
10uF
C6
Capacitance
100nF
C36
Capacitance
100nF
C3
Capacitance
100nF
C40
Capacitance
100nF
C37
Capacitance
100nF
C50
Capacitance
1uF
C9
Capacitance
10uF
C11
Capacitance
10uF
C48
Capacitance
100nF
C39
Capacitance
100nF
C18
Capacitance
100nF
C19
Capacitance
100nF
C41
Capacitance
100nF
C15
Capacitance
22uF
C5
Capacitance
100nF
C12
Capacitance
10uF
C21
Capacitance
100nF
C17
Capacitance
1uF
C45
Capacitance
10uF
C14
Capacitance
100nF
C28
Capacitance
10uF
C49
Capacitance
22uF
H3
R7
Resistance
220 Ω
R18
Resistance
5.1kΩ
SW3
J5
R12
Resistance
4.7kΩ
R15
Resistance
220 Ω
R10
Resistance
5.1kΩ
R20
Resistance
4.7kΩ
H4
R14
Resistance
10kΩ
H2
R22
Resistance
220 Ω
R4
Resistance
4.7kΩ
R23
Resistance
220 Ω
R13
Resistance
4.7kΩ
R17
Resistance
5.1kΩ
J1
R8
Resistance
220 Ω
R21
Resistance
10kΩ
H1
R6
Resistance
10kΩ
R3
Resistance
5.1kΩ
R11
Resistance
5.1kΩ
R2
Resistance
5.1kΩ
R19
Resistance
4.7kΩ
R16
Resistance
220 Ω
J3
R1
Resistance
500 Ω
SW4
R5
Resistance
4.7kΩ
U5
J8
J7
J2
J6
J4

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Project Specification
Version: 0.2.0 Date: 2026-03-20 Author: Flux Status: Architecture Baseline Defined Tags: retro-radio, esp32-s3, wifi, bluetooth, battery, audio, wood-cabinet

1. Executive Summary
This project implements a retro-inspired connected tabletop radio inside a warm wood-look enclosure with an overall product width target of 220 mm. The electronics center on an ESP32-S3 wireless module for WiFi and Bluetooth connectivity, a compact center-front display, two front-panel knobs for primary interaction, a rechargeable single-cell Li-ion battery with charge-and-play power path, and a digital audio chain suitable for streaming playback. The board is intended to support early prototyping, enclosure integration, and a clean transition toward manufacturable PCB and product development.
2. Goals and Non-Goals
This revision establishes the first complete electrical and packaging baseline for the radio concept.
2.1 Goals
  • Deliver a complete schematic integrating wireless compute, audio output, display, user controls, and rechargeable battery management
  • Fit the electrical architecture within a product concept targeting 220 mm overall width and a single main PCB envelope of roughly 140 mm to 170 mm by 45 mm to 70 mm
  • Support WiFi and Bluetooth streaming-ready operation with a rechargeable battery option for a few hours of unplugged use
  • Preserve front-panel industrial design intent: two knobs, small centered display, restrained speaker fields, hidden antenna treatment
  • Establish a practical PCB baseline including board shape, mounting, placement zones, and RF/power/audio constraints
2.2 Non-Goals
  • Final acoustic tuning of speaker enclosure and passive radiator strategy
  • Final industrial CMF release data, tooling details, and production DFM for enclosure plastics/wood veneer
  • Full firmware implementation beyond architecture and hardware support requirements
  • Final battery pack industrial safety certification package
3. System Overview
The radio uses a single main logic board mounted within a wood-look tabletop enclosure. A USB-C power input feeds a single-cell Li-ion charger with power-path management so the system can operate while charging. A regulated 3.3 V rail powers the ESP32-S3 module, display, and low-voltage control circuitry. The battery/system input also supplies a speaker amplifier path for higher audio efficiency. The ESP32-S3 manages WiFi, Bluetooth, display rendering, user input, and audio streaming. A compact front display provides status, metadata, onboarding, and battery information while two front knobs act as the primary physical interface.
3.1 Block Diagram
System block diagram

Diagram


"USB-C node_5V Input" "ESD and Input Protection" "Li-ion Charger and Power Path" "VSYS and VBAT" "3.3V Regulation" "ESP32-S3 Module" "Center Display" "Two Front Knobs" "I2S Audio Amplifier" "Speakers" "Single Cell Li-ion Battery"
4. Requirements
The design requirements below describe what the product must achieve independent of exact implementation details.
4.1 Functional Requirements
  • The product shall present a retro-inspired tabletop radio appearance with a wood-look cabinet and a calm symmetrical front composition
  • The product shall target an overall enclosure width of approximately 220 mm
  • The product shall include two front-panel knobs as the primary user controls
  • The product shall include a small center digital display in place of an analog band scale
  • The product shall support WiFi connectivity for streaming-ready operation
  • The product shall support Bluetooth connectivity for streaming-ready operation
  • The product shall support rechargeable battery-backed operation for a few hours unplugged runtime
  • The product shall support external powered operation while charging the battery
  • The product shall display source, playback, connectivity, and battery information to the user
4.2 Electrical Requirements
  • Use an ESP32-S3 module architecture to simplify WiFi/Bluetooth implementation and native USB support
  • Use a single-cell rechargeable Li-ion battery architecture with charge management and system power-path support
  • Provide a regulated 3.3 V digital rail for MCU, display, and logic
  • Provide an audio power path suitable for a compact Class-D speaker amplifier
  • Include one pair of I2C pull-ups if an I2C display or peripheral bus is used
  • Include per-IC local decoupling, with 100 nF ceramic decoupling at each IC power input and additional bulk capacitance as needed
  • Provide USB-C sink configuration resistors on CC pins for 5 V input operation
4.3 Environmental and Reliability Requirements
  • The architecture shall avoid exposed antennas and minimize RF performance degradation from nearby metal, battery, and speaker structures
  • The design shall consider thermal buildup inside a partially enclosed wood-look cabinet
  • The product shall support typical indoor tabletop consumer use
5. Constraints
These are hard constraints or strong project-shaping limits.
5.1 Mechanical Constraints
  • Product width target: 220 mm
  • Product height target: 125 mm nominal
  • Product depth target: 95 mm nominal
  • Main PCB target envelope: 140 mm to 170 mm wide and 45 mm to 70 mm tall
  • Display visible window baseline: 62 mm x 22 mm
  • Knob diameter baseline: 32 mm
  • Reserve front left and right cavity regions for speakers and knob mechanics
  • Maintain a non-metallic keepout region around the wireless antenna area
5.2 Power and Thermal Constraints
  • Battery must coexist safely with audio amplifier, charger, and wireless electronics
  • Charger architecture should support status indication and battery protection-oriented UX
  • Power architecture should support charge-and-play rather than battery disconnect during plugged operation
  • High dissipation parts must be kept away from battery and RF-sensitive regions where practical
5.3 Layout / Implementation Constraints
  • Use a 4-layer PCB baseline for RF, audio return control, and simplified power distribution
  • Place the ESP32-S3 module at a board edge with antenna keepout on all copper layers
  • Keep audio power paths separated from noisy digital and charging regions
  • Keep display and knob support aligned with the front-panel mechanical envelope
  • Keep mounting holes at corners and preserve mechanical clearances around them
5.4 Cost and Sourcing Constraints
  • Prefer module-based RF implementation to reduce development risk
  • Prefer commonly available library parts and generic passives where appropriate
  • Use a charger with power-path management instead of a simpler charge-only part, because the product is intended to operate while charging
6. Assumptions and Dependencies
  • A single-cell Li-ion battery is assumed as the rechargeable energy source
  • A compact I2S Class-D amplifier is assumed for the first-pass audio output path
  • The first-pass display is assumed to be a small SPI or I2C module centered on the front panel
  • Firmware will implement knob push/long-press interaction states so additional front-panel buttons can be minimized
  • Acoustic tuning, speaker choice, and exact battery capacity remain open and will refine PCB and enclosure details later
7. Validation Criteria
The design is considered ready for the next prototype phase when the following evidence is available.
7.1 Acceptance Tests
  • Schematic includes complete wireless, power, battery, display, user-control, and audio subsystems
  • PCB layout shape and mounting align with the enclosure-driven dimensions and front-panel concept
  • Wireless module placement preserves antenna keepout and avoids obvious mechanical conflicts
  • Battery charging and system-power behavior support operation while externally powered
  • Audio path is suitable for streaming playback and routed with mixed-signal layout discipline
7.2 Review Checklist
  • Industrial design constraints are reflected in placement and connector decisions
  • Battery runtime assumptions are documented and traceable to the power architecture
  • Major subsystem interfaces are documented and consistent across requirements, architecture, and PCB planning
  • Design can transition into detailed prototyping without reworking the core system partitioning
Appendix (Optional)
  • Primary reference docs: master-industrial-design-brief, system-requirements, power-architecture, audio-architecture, firmware-architecture, pcb-mechanical-envelope
  • 1. Executive Summary

  • 2. Goals and Non-Goals

  • 2.1 Goals

  • 2.2 Non-Goals

  • 3. System Overview

  • 3.1 Block Diagram

  • 4. Requirements

  • 4.1 Functional Requirements

  • 4.2 Electrical Requirements

  • 4.3 Environmental and Reliability Requirements

  • 5. Constraints

  • 5.1 Mechanical Constraints

  • 5.2 Power and Thermal Constraints

  • 5.3 Layout / Implementation Constraints

  • 5.4 Cost and Sourcing Constraints

  • 6. Assumptions and Dependencies

  • 7. Validation Criteria

  • 7.1 Acceptance Tests

  • 7.2 Review Checklist

  • Appendix (Optional)