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U1
M3
U2
M2
IC2
U3
M1
IC3
U4
IC1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
U4 VSS_2 - U4 EP
GND
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
J5 GND_4 - U4 VSS_1
IC3 GND_3 - IC3 THERMAL_PAD
U4 VSS_2 - U4 EP
U4 VSS_2 - U4 EP
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
U4 VSS_2 - U4 EP
IC3 GND_3 - IC3 THERMAL_PAD
GND
IC3 GND_3 - IC3 THERMAL_PAD
U4 VSS_2 - U4 EP
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
J5 GND_4 - U4 VSS_1
IC3 GND_3 - IC3 THERMAL_PAD
IC3 GND_3 - IC3 THERMAL_PAD
U4 PROG3 - C42 P1
U4 VPCC - C40 P1
R23 P2 - SW3 B
M3 IO38 - R19 P2
J5 DN1 - J5 DN2
U4 OUT_2 - U5 VIN
U4 OUT_2 - U5 VIN
J5 VBUS_1 - J5 VBUS_2
IC3 VDD_2 - C44 P1
U5 VOUT - M3 3V3
U5 VOUT - M3 3V3
U4 IN_2 - C43 P1
U4 CE - U4 SEL
J5 VBUS_1 - J5 VBUS_2
U4 IN_2 - C43 P1
IC3 VDD_2 - C44 P1
M3 IO2 - R23 P1
U4 PROG1 - C41 P1
R22 P2 - SW3 A
M3 IO39 - R20 P2
M3 IO4 - IC3 BCLK
U4 IN_2 - C43 P1
U4 STAT2 - M3 IO17
M3 IO13 - SW4 A
R21 P2 - M3 IO0
M3 IO6 - IC3 DIN
M3 IO11 - J6 DC
M3 IO9 - J6 DIN
J5 DP1 - J5 DP2
M3 IO8 - J6 CLK
U4 OUT_2 - U5 VIN
M3 IO15 - SW4 S1
M3 IO9 - J6 DIN
M3 IO14 - SW4 B
IC3 OUTP - J8 P1
M3 IO39 - R20 P2
R23 P2 - SW3 B
U4 PROG3 - C42 P1
M3 IO3 - SW3 S1
M3 IO12 - J6 RST
M3 IO10 - J6 CS
IC3 VDD_2 - C44 P1
J5 DP1 - J5 DP2
J5 CC1 - R17 P1
M3 IO38 - R19 P2
R21 P2 - M3 IO0
IC3 OUTN - J8 P2
J5 VBUS_4 - U4 IN_1
J5 DN1 - J5 DN2
R22 P2 - SW3 A
U4 STAT2 - M3 IO17
M3 IO2 - R23 P1
M3 IO4 - IC3 BCLK
M3 IO8 - J6 CLK
J5 VBUS_4 - U4 IN_1
M3 IO13 - SW4 A
U5 VOUT - M3 3V3
IC3 VDD_2 - C44 P1
U5 VOUT - M3 3V3
J5 CC2 - R18 P1
M3 IO10 - J6 CS
U4 PROG1 - C41 P1
U4 VBAT_SENSE - J7 PIN1
IC3 OUTP - J8 P1
U4 STAT1/~LBO - M3 IO18
M3 IO5 - IC3 LRCLK
U5 VOUT - M3 3V3
U4 THERM - C39 P1
R21 P2 - M3 IO0
M3 IO11 - J6 DC
M3 IO3 - SW3 S1
U5 VOUT - M3 3V3
U4 ~PG - M3 IO16
M3 IO12 - J6 RST
J5 CC1 - R17 P1
M3 IO14 - SW4 B
U4 CE - U4 SEL
M3 IO15 - SW4 S1
IC3 VDD_2 - C44 P1
J5 DN1 - J5 DN2
U4 CE - U4 SEL
U4 ~PG - M3 IO16
U4 VBAT_SENSE - J7 PIN1
U4 THERM - C39 P1
U4 VPCC - C40 P1
U4 VBAT_SENSE - J7 PIN1
U5 VOUT - M3 3V3
M3 IO5 - IC3 LRCLK
M3 IO1 - R22 P1
U5 VOUT - M3 3V3
M3 IO1 - R22 P1
U4 STAT1/~LBO - M3 IO18
U5 VOUT - M3 3V3
M3 IO6 - IC3 DIN
IC3 OUTN - J8 P2
J5 DP1 - J5 DP2
J5 CC2 - R18 P1
C33
Capacitance
1uF
C4
Capacitance
100nF
C26
Capacitance
10uF
C47
Capacitance
10uF
C22
Capacitance
100nF
C38
Capacitance
100nF
C46
Capacitance
10uF
C32
Capacitance
22uF
C13
Capacitance
10uF
C42
Capacitance
100nF
C30
Capacitance
10uF
C51
Capacitance
1uF
C1
Capacitance
100nF
C31
Capacitance
100nF
C44
Capacitance
10uF
C23
Capacitance
100nF
C35
Capacitance
100nF
C27
Capacitance
10uF
C25
Capacitance
100nF
C8
Capacitance
100nF
C29
Capacitance
10uF
C2
Capacitance
100nF
C7
Capacitance
100nF
C34
Capacitance
1uF
C10
Capacitance
10uF
C24
Capacitance
100nF
C16
Capacitance
1uF
C20
Capacitance
100nF
C43
Capacitance
10uF
C6
Capacitance
100nF
C36
Capacitance
100nF
C3
Capacitance
100nF
C40
Capacitance
100nF
C37
Capacitance
100nF
C50
Capacitance
1uF
C9
Capacitance
10uF
C11
Capacitance
10uF
C48
Capacitance
100nF
C39
Capacitance
100nF
C18
Capacitance
100nF
C19
Capacitance
100nF
C41
Capacitance
100nF
C15
Capacitance
22uF
C5
Capacitance
100nF
C12
Capacitance
10uF
C21
Capacitance
100nF
C17
Capacitance
1uF
C45
Capacitance
10uF
C14
Capacitance
100nF
C28
Capacitance
10uF
C49
Capacitance
22uF
H3
R7
Resistance
220 Ω
R18
Resistance
5.1kΩ
R12
Resistance
4.7kΩ
R15
Resistance
220 Ω
R10
Resistance
5.1kΩ
R20
Resistance
4.7kΩ
H4
R14
Resistance
10kΩ
H2
R22
Resistance
220 Ω
R4
Resistance
4.7kΩ
R23
Resistance
220 Ω
R13
Resistance
4.7kΩ
R17
Resistance
5.1kΩ
R8
Resistance
220 Ω
R21
Resistance
10kΩ
H1
R6
Resistance
10kΩ
R3
Resistance
5.1kΩ
R11
Resistance
5.1kΩ
R2
Resistance
5.1kΩ
R19
Resistance
4.7kΩ
R16
Resistance
220 Ω
R1
Resistance
500 Ω
R5
Resistance
4.7kΩ
SW3
J5
U5
J1
J3
SW4
J8
J7
J2
J6
J4

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PCB Mechanical Envelope
Purpose
Define the first-pass mechanical and PCB packaging envelope for enclosure modeling and electronics partitioning.
Exterior Reference Envelope
  • Product width: 220 mm
  • Product height: 125 mm nominal
  • Product depth: 95 mm nominal
Internal Zoning Strategy
  • Front center: display module and light pipe or window subassembly
  • Front left/right: speaker zones and knob mechanical volumes
  • Mid-body: primary PCB zone
  • Lower rear or lower center: rechargeable battery pack zone
  • Upper rear or side rear: antenna keep-out region for WiFi/Bluetooth
  • Rear wall: charge/power connector and optional service/debug access
Main PCB Assumption
  • Single primary PCB preferred for cost and assembly simplicity
  • Initial PCB bounding target: 140 mm to 170 mm wide, 45 mm to 70 mm tall depending on audio and power partitioning
  • PCB likely mounted behind front control cluster or slightly rear-shifted to preserve acoustic volume
Display Subassembly Envelope
  • Display visible window baseline: 62 mm x 22 mm
  • Internal module allowance should include bezel, mounting, connector bend radius, and standoff depth
  • Reserve front-center depth allowance of approximately 8 mm to 18 mm depending on display selection
Knob and Encoder Envelope
  • Two front knobs approximately 32 mm diameter baseline
  • Reserve mechanical keep-out behind each knob for shaft encoder or potentiometer body plus harness/connector clearance
  • Maintain hand clearance and structural rigidity at front panel mounting points
Speaker Envelope Assumptions
  • Preserve left and right front cavity regions for drivers and acoustic treatment
  • Electronics should not excessively intrude into speaker depth or front radiation path
  • Final acoustic volume to be refined after driver choice
Battery Envelope Assumptions
  • Rechargeable battery intended for a few hours unplugged runtime
  • Reserve protected battery compartment or bracketed internal space low in the enclosure for center-of-gravity stability
  • Battery should be isolated from hot amplifier and RF-sensitive zones where practical
Antenna Constraints
  • Provide non-metallic enclosure region near antenna placement
  • Keep dense ground, battery metal, speaker magnets, and shielding away from immediate antenna near-field volume as much as feasible
  • Do not place antenna directly behind a metal grille if avoidable
Connector and Service Envelope
  • Rear connector zone should accommodate charging input and possible USB/service interface
  • Provide assembly access for battery connection and display interconnect
  • Keep serviceable items away from speaker screws where possible
Mechanical Risks to Track
  • Display depth conflicts with front structure
  • Battery volume reducing acoustic chamber size
  • Antenna detuning from nearby metal and battery placement
  • Thermal buildup in enclosed wood-look cabinet construction
  • Knob shaft alignment tolerance stack-up
Outputs This Document Supports
  • enclosure CAD model
  • PCB outline exploration
  • component height budgeting
  • mounting boss planning
  • front panel stack-up design
  • Purpose

  • Exterior Reference Envelope

  • Internal Zoning Strategy

  • Main PCB Assumption

  • Display Subassembly Envelope

  • Knob and Encoder Envelope

  • Speaker Envelope Assumptions

  • Battery Envelope Assumptions

  • Antenna Constraints

  • Connector and Service Envelope

  • Mechanical Risks to Track

  • Outputs This Document Supports