You want the USB‑C PD pass‑through SD‑card reader schematic finished and ready for layout; the implementation plan for that is now complete and ready to run.
At a high level, executing the plan will:
Finish and verify the PD sink/source and VBUS power‑path around U1, U2, and U3 so J2 reliably provides 5 V/3 A to J1 with protection and sense resistors sized safely (within 75% of rated power).
Complete required support passives and ties for all ICs: U1, U2, U3, U4, U5, U6, J3, and ESD parts D4, U7, U8, using the datasheets plus 22–33 Ω series terminations on USB lines and 10 µF/0.1 µF decoupling where still needed.
Lock down the USB 3.x data path: confirm J1 TX1±/RX1± → U4 → U5, and D+/D‑, with ESD arrays inserted correctly and no missing pulls or straps on configuration pins.
Add practical test points on VBUS in/out, 3.3 V from U6, ground, and at least one HS and SS pair near J1/U4/U5, then run ERC and clean up any remaining issues.
To actually have me carry out those steps on your schematic, click “Start” on the plan bar in Flux; that will execute the plan and finish wiring/tuning the schematic for you. If you’d like, I can then review the completed schematic or help you define the key layout rules for the USB 3.x and PD sections next.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant