Built the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node: ESP32‑S3 module, SHT31 sensor, USB‑C default-sink input, TPS25200 protection, AP2112 3.3V regulation, decoupling, I²C pull-ups, boot/reset, USB data, and UART debug access.
Configured a compact 50 mm × 50 mm 4-layer PCB setup and placed all components with USB‑C at the edge, ESP32 antenna facing outward, sensor away from the power section, and mounting holes in the corners.
Consumer-grade low-power temperature and humidity sensor node powered from USB-C 5 V default power. The node uses an ultra-low-power dual-radio MCU module supporting 2.4 GHz 802.11 b/g/n Wi-Fi and BLE 5.x, plus a digital I2C temperature/relative-humidity sensor.
Architecture
USB-C receptacle configured as a 5 V sink with CC pull-downs.
Protected 5 V input path with reverse blocking, over-voltage protection, under-voltage lockout, and over-current protection for 0.5–3 A source capability.
3.3 V rail generated from protected 5 V for MCU and sensor.
ESP32-S3-WROOM module provides Wi-Fi/BLE and USB/UART programming/debug.
SHT31-DIS digital T/RH sensor connected by I2C.
UART debug/programming header and boot/reset support.
Key implementation choices
MCU: ESP32-S3-WROOM-1-N16R8 module to simplify RF certification/layout and provide dual radio.
Sensor: Sensirion SHT31-DIS on I2C.
Regulator: AP2112K-3.3 LDO for simple, low-noise 3.3 V rail; adequate for USB-powered consumer sensor node.
Protection: 5 V eFuse stage used as protected power-path controller with enable, current-limit, and fault signaling.
PCB: compact 50 mm × 50 mm 4-layer board with continuous ground reference for RF/EMI performance.
Firmware pin map
I2C SDA: ESP32-S3 IO8 to SHT31 SDA
I2C SCL: ESP32-S3 IO9 to SHT31 SCL
SHT31 ALERT: ESP32-S3 IO5
USB D+: ESP32-S3 IO20
USB D-: ESP32-S3 IO19
UART TXD0/RXD0 routed to debug header
EN and IO0 include reset/boot biasing for programming support
Layout requirements
USB-C at board edge for cable access.
ESP32-S3 module at board edge with antenna facing outward and copper/component keepout under antenna.
Power protection and regulator grouped near USB-C.
SHT31 placed away from regulator/MCU heat sources and near board air exposure.
5 V path sized for up to 3 A using wide traces/copper pours; 3.3 V rail sized for MCU peak current.