Temperature and Humidity Sensor Node Design
Placed components
2:56
Placed 27 component(s): U1, C3, C6, C7, H3, H2, J1, R5, C5, R2, H4, U4, C2, R3, R1, C4, U3, R7, J2, H1, R9, U2, R6, R8, R4, C8, C1
0:03
Work done
- Built the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node: ESP32‑S3 module, SHT31 sensor, USB‑C default-sink input, TPS25200 protection, AP2112 3.3V regulation, decoupling, I²C pull-ups, boot/reset, USB data, and UART debug access.
- Configured a compact 50 mm × 50 mm 4-layer PCB setup and placed all components with USB‑C at the edge, ESP32 antenna facing outward, sensor away from the power section, and mounting holes in the corners.
- Added documentation: Project Specification, Firmware Pin Map, and Design Review Results.
- ✅ Complete protected USB-C power-path schematic and 3.3V rail are present.
- ✅ Dual-radio MCU, digital T/RH sensor, support passives, and debug/programming connections are integrated.
- ⚠️ PCB placement is complete, but final routed PCB production readiness is not complete yet.
- ⚠️ Final checks found remaining PCB routing airwires and one copper-overlap item that must be resolved before fabrication.
Route the PCB traces, inspect the copper-overlap item, then rerun final checks before manufacturing export.
Route remaining airwires
Inspect copper overlap
Run final review
Check antenna placement
Export production files
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Design Review Results
Completed checks
- Schematic contains the required architecture: USB-C input, CC pull-downs, TPS25200 protection, protected 5V rail, AP2112 3.3V rail, ESP32-S3 Wi-Fi/BLE module, SHT31 I2C temperature/humidity sensor, decoupling, boot/reset, USB data, and UART debug access.
- Electrical checks passed for floating pins, no-connect violations, missing power, single-pin nets, and undriven nets.
- PCB placement was completed with USB-C on the board edge, ESP32 antenna facing outward at the top edge, SHT31 away from the heat-generating power section, power parts grouped near USB-C, debug header at an edge, and mounting holes at corners.
- Footprint check passed: no missing footprints were reported.
Open production blockers
- Routing is not complete: the review reports airwires, meaning PCB traces still need to be routed before fabrication.
- The review reports overlapping copper around a layout pad identifier. Placement refinement did not clear this item, so it likely requires manual inspection or footprint-level correction before manufacturing export.
Recommended next actions
- Run routing/auto-route in the PCB editor or route traces manually.
- Inspect and resolve the reported overlapping copper item.
- Re-run DRC/ERC after routing.
- Review the ESP32 antenna keepout visually before release.
- Replace generic passive components with preferred production MPNs if the assembler requires a locked AVL.
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