Temperature and Humidity Sensor Node Design


Work done
  • Created and named the project USB-C WiFi BLE Environmental Sensor and updated the project description.
  • Verified an existing schematic already contains the main design blocks: ESP32-S3-WROOM-1-N16R8, SHT31-DIS, USB-C receptacle, TPS25200 5V eFuse/protection, AP2112K-3.3 regulator, UART/debug header, decoupling capacitors, I2C pull-ups, CC pull-downs, mounting holes, and power/reset/boot support.
  • Confirmed key nets are present: VBUS_USB, 5V_PROTECTED, 3V3, GND, I2C_SDA, I2C_SCL, USB_DP, USB_DN, UART, reset, boot, and eFuse fault/enable/current-limit nets.
  • Added component role metadata for passives, ICs, connector, power protection, regulator, sensor, MCU, and debug header to support review and placement intent.
  • Created the Project Specification project file with architecture, implementation choices, firmware pin map, and layout requirements.
  • Set PCB outline to 90 mm × 60 mm, rounded corners, compact consumer form factor, and 4-layer stackup with a ground reference suitable for RF/EMI.
  • Applied baseline manufacturable layout rules: 0.20 mm default trace width, 0.15 mm minimum trace width, 0.15 mm keepout, and 0.50 mm board inset margin.
  • Checked datasheets for the protection/regulator/RF-module assumptions: TPS25200 provides UVLO/OVLO/OVP clamp/OCP/reverse blocking while disabled; AP2112K-3.3 supports a 600 mA 3.3 V rail; ESP32-S3-WROOM-1 has antenna keepout placement requirements.
Success criteria review
  • ✅ Schematic includes USB-C 5 V input, CC pull-downs, protected 5 V path, 3.3 V regulation, MCU, sensor, I2C, debug, and support passives.
  • ✅ Dual-radio MCU and digital T/RH sensor are integrated and interconnected in the schematic.
  • ⚠️ PCB layout setup is partially complete: board size, stackup, and baseline rules are set, but final component placement/routing/review could not be completed.
  • ⚠️ Final production review is not complete; ERC/DRC/airwire review and routing verification still remain.
Next steps
  • Place components on the 90 mm × 60 mm PCB with the ESP32-S3 antenna at a board edge and ~5 mm antenna overhang/keepout, USB-C at an accessible edge, power components clustered near USB-C, and SHT31 away from heat sources.
  • Route the board, using wide copper/traces for the 5 V protected path and short decoupling loops.
  • Run final ERC/DRC/airwire review and resolve any remaining issues before manufacturing export.
Placed 27 component(s): U1, C3, C6, C7, H3, H2, J1, R5, C5, R2, H4, U4, C2, R3, R1, C4, U3, R7, J2, H1, R9, U2, R6, R8, R4, C8, C1
Work done
  • Built the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node: ESP32‑S3 module, SHT31 sensor, USB‑C default-sink input, TPS25200 protection, AP2112 3.3V regulation, decoupling, I²C pull-ups, boot/reset, USB data, and UART debug access.
  • Configured a compact 50 mm × 50 mm 4-layer PCB setup and placed all components with USB‑C at the edge, ESP32 antenna facing outward, sensor away from the power section, and mounting holes in the corners.
  • Added documentation: Project Specification, Firmware Pin Map, and Design Review Results.
Success criteria review
  • ✅ Complete protected USB-C power-path schematic and 3.3V rail are present.
  • ✅ Dual-radio MCU, digital T/RH sensor, support passives, and debug/programming connections are integrated.
  • ⚠️ PCB placement is complete, but final routed PCB production readiness is not complete yet.
  • ⚠️ Final checks found remaining PCB routing airwires and one copper-overlap item that must be resolved before fabrication.
Next steps
Route the PCB traces, inspect the copper-overlap item, then rerun final checks before manufacturing export.
Route remaining airwires
Inspect copper overlap
Run final review
Check antenna placement
Export production files

Firmware Pin Map — ESP32-S3 Environmental Node
MCU
ESP32-S3-WROOM-1-N16R8, powered from 3V3.
Pin assignments

Table


FunctionESP32-S3 pinNetNotes
I2C SDAIO8I2C_SDASHT31 SDA, 4.7 kΩ pull-up to 3V3
I2C SCLIO9I2C_SCLSHT31 SCL, 4.7 kΩ pull-up to 3V3
SHT31 ALERTIO5SHT_ALERTOptional interrupt input
eFuse FAULTIO4EFUSE_FAULTActive-low open-drain fault input, 10 kΩ pull-up to 3V3
USB D-IO19USB_DNESP32-S3 USB Serial/JTAG / USB device
USB D+IO20USB_DPESP32-S3 USB Serial/JTAG / USB device
UART0 TXTXD0UART0_TXDebug header J2 pin 3
UART0 RXRXD0UART0_RXDebug header J2 pin 4
Reset/enableENESP_ENDebug header J2 pin 5, 10 kΩ pull-up, 1 µF delay capacitor
Boot modeIO0ESP_BOOT_IO0Debug header J2 pin 6, 10 kΩ pull-up; pull low for download boot
Firmware initialization outline
  1. Configure I2C on SDA=IO8, SCL=IO9 at 100 kHz or 400 kHz.
  2. Initialize SHT31 at default address with ADDR tied low.
  3. Configure IO4 and IO5 as inputs with internal pull-ups disabled or enabled only if needed; external pull-ups are present for FAULT.
  4. Enable Wi-Fi 2.4 GHz and BLE 5.x services as required by application firmware.
  5. Use light sleep/deep sleep between measurements for low-power operation; keep USB power policy simple because the node is USB powered.
  6. Use USB Serial/JTAG or UART0 header for manufacturing programming and debug.
  • MCU

  • Pin assignments

  • Firmware initialization outline