Additional limits stated with optional impedances: input voltage ≤ 4.2 Vrms and current ≤ 7 mA
Dielectric strength (primary-to-secondary): 1500 V
Limits and operating conditions (per datasheet)
Operating temperature range: -40°C to +105°C
Dielectric strength: 1500 V primary-to-secondary (also listed in electrical characteristics)
Pin information (per datasheet)
Physical pins indicated as 1 through 8 (bottom view shown)
Primary winding referenced between pins 2 and 4 (CT implied in “1000 Ω CT” spec)
Secondary winding referenced between pins 5 and 8; configurations:
1:1 ratio when pins 6 and 7 are tied together
2:1 ratio when 5 is tied to 6 and 7 is tied to 8
DCR callouts:
Primary (2–4) 172 Ω nominal
Secondary (5–8, with 6–7 tied) 172 Ω nominal
Mechanical/package dimensions (from drawing, units not explicitly labeled in the extract)
Lead size: 0.025 SQ (8 PLCS)
Overall maxima shown: 0.900 MAX, 0.800 MAX, 0.770 MAX, 0.700 MAX
Body/lead spacings called out:
0.520 ± 0.020
0.200 ± 0.020 (5 PLCS)
0.150 ± 0.020
0.040
Bottom view is provided with pin placement diagram
Note: The drawing provides all necessary geometry to derive an 8-pad footprint; please refer to the original drawing in the datasheet for exact dimensional context and units.
Multiple connection options to realize 1:1 or 2:1 behavior
RoHS 3 compliant (2015/863/EU)
Cross-check: symbol and footprint vs datasheet
Symbol (schematic)
Observed: 7 connection points labeled 2, 3, 4, 5, 6, 7, 8; no pin “1” is represented.
Datasheet: Shows eight physical pins (1–8).
Flag: Mismatch — missing pin 1 in the symbol. This can cause incorrect pin mapping, documentation errors, and assembly/orientation ambiguity.
Footprint (PCB)
Observed: A default footprint exists with 7 pads; pad numbering not visible/defined; no placement geometry verified.
Datasheet: Requires 8 pins/leads with specific spacing (0.025 SQ leads, “0.200 ± 0.020” spacings in 5 places, and additional dimensional constraints).
Flags:
Pin count mismatch — 7 pads vs required 8. This will cause board failure (one lead unconnected) and assembly issues.
Pad numbering undefined — must match 1–8 per bottom-view orientation in datasheet to ensure correct connectivity.
Dimensional conformity unverified — pad pitch, hole size and body clearances must follow the drawing (e.g., 0.025 SQ leads suggest through-hole pads sized accordingly; the drawing includes a “0.040” dimension that likely relates to hole diameter, but confirm directly from the drawing context).
Recommended next corrections (for your awareness)
Update the schematic symbol to include all 8 pins with correct numbering (1–8) and groupings reflecting primary (2–4, CT implied) and secondary (5–8) connections.
Define the 1:1 and 2:1 tie options (6–7 tied for 1:1; 5–6 and 7–8 tied for 2:1) in the symbol notes or pin function descriptions.
Replace the footprint with an 8-pad through-hole pattern matching the datasheet’s bottom-view orientation, pad/hole sizes, and spacings.
Assign pad numbers 1–8 exactly as shown in the datasheet to prevent assembly and test errors.
If you want, I can proceed to:
Attach the datasheet URL to the project properties.
Fix the symbol (add the missing pin 1 and proper numbering).
Replace the footprint with an 8-pad pattern per the datasheet drawing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant