Part Data Review and Validation

flux

2:25

Analyzing the schematic.

Reviewing the bill of materials.

Analyzing the PCB layout.

Looking for "device overview description package pin count ordering information special features" in tps274c65

Looking for "absolute maximum ratings" in tps274c65

Looking for "recommended operating conditions" in tps274c65

Looking for "electrical characteristics" in tps274c65

Looking for "pin functions pin descriptions terminal functions" in tps274c65

Looking for "package dimensions mechanical data SHR package RHA package VQFN wettable flank thermal pad" in tps274c65

Looking for "functional features diagnostics protection current sense SPI LED outputs configurable address" in tps274c65

Cross-checking package dimensions.

Identifying project misstatements.

Looking for "RHA0040M package dimensions D E D2 E2 b e L A exact dimensions table" in tps274c65

Looking for "example board layout land pattern dimensions 40X 0.25 0.85 exposed pad 4.15 5.8 5.8 6 by 6 0.5 pitch" in tps274c65

I completed the review for TPS274C65ASHRHAR.

Step 1: Part information review

Project metadata vs datasheet

Item	In part project	Datasheet scan result	Status
MPN	TPS274C65ASHRHAR	TPS274C65ASHRHAR	Match
Datasheet URL	Present: PDF	Official TI datasheet	Match
Package	Property says TO	RHA, 40-pin VQFN, 6.0 mm x 6.0 mm, 0.5 mm pitch	Mismatch
Pin count	41 schematic terminals including exposed pad	40 pins + exposed pad	Match
Description	"12-V to 36-V 65-mohm four-channel..."	TI describes 72 mOhm quad smart high-side switch	Mismatch
Part type	Electromechanical Components	Power switch IC / smart high-side switch	Mismatch

Step 2: Datasheet property check

A datasheet URL was already set on the part, so no web lookup or property update was needed.

Step 3: Datasheet scan summary

Device summary

Field	Value
Function	Quad-channel smart high-side switch with SPI and diagnostics
Supply range	12 V to 36 V nominal operating supply
Logic supply	3.0 V to 5.5 V
On-resistance	72 mOhm typ at 25 C
Package	RHA VQFN-40
Body size	6.0 mm x 6.0 mm
Pitch	0.50 mm
Max height	1.0 mm
Variant features	ASH includes reverse current blocking, LED driver, ADC, current sense

Special features

Feature	Present
SPI interface	Yes
Adjustable current limit	290 mA to 2.45 A for ASH
Reverse current blocking	Yes
LED outputs	4
Integrated ADC	Yes
Current sense	Yes
Thermal shutdown	Yes
Short-to-ground protection	Yes
Wire-break / open-load diagnostics	Yes
Short-to-supply detection	Yes

Absolute maximum ratings

Parameter	Rating
VS continuous	-0.3 V to 40 V
VS transient under 1 ms during ON state	-0.3 V to 60 V
VOUT to GND	-30 V to VS + 0.3 V
VDS	-0.7 V to 39 V
VDD	-0.3 V to 7.0 V
Digital input pins	-0.3 V to 7.0 V
LED output pins	-0.3 V to 7.0 V
REG_EN	-0.3 V to 7.0 V
RCBx	VOUT - 0.7 V to VOUT + 6 V
ISNS	-0.3 V to 7.0 V
FLT	-0.3 V to 7.0 V
Reverse ground current	-50 mA
Junction temperature	150 C max
Storage temperature	-65 C to 150 C

Recommended operating conditions

Parameter	Range
VS nominal supply	12 V to 36 V
VDD	3.0 V to 5.5 V
Digital input pins	-0.3 V to 5.5 V
FLT pin	-0.3 V to 5.5 V
LEDOUT pins	-0.3 V to 5.5 V
REG_EN	-0.3 V to 5.0 V
Operating ambient from orderable info	-40 C to 125 C

Key electrical characteristics

Parameter	Value
On-resistance RON	72 mOhm typ at 25 C, 110 mOhm typ at 125 C
Parallel 2-channel RON	33 mOhm typ at 25 C, 55 mOhm typ at 125 C
Internal VDD regulator output	3.1 V min, 3.3 V typ, 3.6 V max
Internal VDD regulator current limit	25 mA min, 50 mA max
Continuous load current per channel	1.6 A typ with all channels on at 85 C
Continuous load current per channel	2.5 A typ with two channels on at 85 C
VDD quiescent current	1.0 mA typ to 1.3 mA typ depending condition
VS quiescent current	1.4 mA typ to 2.8 mA typ depending condition
Current sense ratio IOUT / ISNS	1160 typ
ADC reference	2.72 V min, 2.8 V typ, 2.85 V max
ADC conversion update time	128 us typ
Thermal shutdown warning	110 C min, 130 C typ, 150 C max
Thermal shutdown	160 C min, 185 C typ, 210 C max

Pin descriptions

Pin(s)	Signal(s)	Datasheet role
1	~READY	Ready/status output
2	~FLT	Open-drain fault output
3	DO_EN	Global output enable input
4	VDD	Logic supply input
5, 21	GND_1, GND_2	Ground
6	ISNS	Analog current-sense output
7	SDO	SPI data output
8	SDI	SPI data input
9	SCLK	SPI clock input
10	~CS	SPI chip select input
11	RCB3	Reverse current blocking gate for channel 3
12, 13	OUT3_1, OUT3_2	Channel 3 output
14-17	VS_1, VS_2, VS_3, VS_4	Main switch supply input
18, 19	OUT4_1, OUT4_2	Channel 4 output
20	RCB4	Reverse current blocking gate for channel 4
22-25	LEDOUT1, LEDOUT2, LEDOUT3, LEDOUT4	LED matrix driver outputs
26, 27	DNC_1, DNC_2	Do not connect
28	DSPI	Daisy-chain SPI mode input
29	REG_EN	Internal regulator enable
30	ADDCFG	SPI address configuration
31	RCB2	Reverse current blocking gate for channel 2
32, 33	OUT2_1, OUT2_2	Channel 2 output
34-37	VS_5, VS_6, VS_7, VS_8	Main switch supply input
38, 39	OUT1_1, OUT1_2	Channel 1 output
40	RCB1	Reverse current blocking gate for channel 1
EP	EP	Exposed pad, connect to IC ground

Package dimensions

Parameter	Datasheet value
Package code	RHA0040M
Package type	VQFN-40
Body size A x B	5.9 mm to 6.1 mm square
Exposed pad D2 x E2	4.15 mm +/- 0.1 mm
Lead pitch e	0.50 mm
Terminal width b	0.20 mm to 0.30 mm
Terminal length L	0.30 mm to 0.50 mm
Height A	0.8 mm to 1.0 mm
TI example land pattern terminal size	40x 0.25 mm x 0.6 mm
TI example exposed pad land	4.15 mm square

Step 4: Symbol and footprint cross-check

Cross-check result

Check	Result	Risk
Pin count	41 terminals in project = 40 pins + exposed pad	OK
Pin numbering	Matches datasheet numbering including EP as 41	OK
Pin names	AS/ASH pin names align with datasheet	OK
DNC pins	DNC_1 and DNC_2 present	OK
Footprint package family	Footprint filename indicates QFN50P600X600X100-41N-D, consistent with 0.5 mm pitch, 6x6 mm, 1.0 mm height, 41 terminals incl. EP	OK
Exposed pad present	EP and pad 41 exist	OK
Metadata package property	Project says TO instead of RHA / VQFN-40	Ordering/library risk
Metadata part type	Project says Electromechanical Components	Library/search/BOM risk
Description value	Project says 65-mohm, datasheet says 72 mOhm typ	Specification risk
Symbol pin electrical types	All terminals are marked Unspecified in the symbol	ERC/usability risk
Footprint peripheral pad length	Footprint uses 0.25 mm x 0.85 mm pads, TI example land pattern shows 0.25 mm x 0.6 mm	Manufacturing risk
Exposed pad size	Footprint EP is 4.25 mm square, TI example land is 4.15 mm	Minor assembly review item

Issues that should be fixed

Priority	Issue	Why it matters
High	Peripheral pads appear 0.85 mm long instead of TI's 0.6 mm recommendation	On a 0.5 mm pitch VQFN, longer pads can increase solder bridging and skew assembly yield
High	Package property is TO	Can cause wrong package identification and wrong ordering assumptions
Medium	Description says 65-mohm instead of 72 mOhm typ	Can mislead selection and review
Medium	Part type is incorrect	Can affect organization, filtering, and part reuse
Medium	All symbol pins are Unspecified rather than input/output/power/ground	Can weaken ERC quality and make the part harder to use safely
Low	Exposed pad land is 4.25 mm vs TI example 4.15 mm	Usually not fatal, but worth reviewing with stencil/paste strategy

Bottom line

The pin map is good and matches the ASH datasheet.
The footprint family is broadly correct for a 6 mm x 6 mm, 0.5 mm pitch VQFN-40 with EP.
The biggest concern is the outer pad length mismatch versus TI's recommended land pattern.
The project metadata also has clear package/type/spec mismatches that should be corrected before reuse or release.

If you want, I can next give you a precise fix list for the part project fields and footprint dimensions.

Fix list next

Check pin types

Review DRC risks

28 days

Ready.

Reviews

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