Part Information Review

Worked for 5 mins 7 sec
Thought for 6 sec — Planning skill development
Referenced guidance.
Thought for 9 sec — Loading schematic for inspection
Completed Overlapping Copper check.
Thought for 7 sec
No valid layout nodes to delete. 1 designator(s) not resolved.
Thought for 5 sec
Reading layout details.
Thought for 7 sec
No valid layout nodes to delete. 1 UIDs not found in layout.
Thought for 21 sec
Editing layout rules.
Thought for 6 sec
Editing layout rules.
Thought for 5 sec
Editing layout rules.
Thought for 11 sec
Thought for 6 sec
Awaiting 1 background task
"EPAD Footprint Fix" completed.

flux

Fixed and verified:
  • Disabled the duplicate un-netted EPAD copper.
  • Preserved the active, terminal-bound GND thermal pad.
  • No active overlapping center pads remain in the footprint.
  • Filed an internal part-quality report so the source footprint can be corrected.
A

adrian95

Fix the Thermal Ground Pad

flux

I’ll correct the terminal-bound GND thermal pad to the official PWP exposed-pad land pattern, preserve its GND association, and verify the duplicate EPAD remains disabled.
Thought for 9 mins 14 sec
Thought for 10 sec
Thought for 7 sec
Awaiting 1 background task
"TI PowerPAD Footprint Fix" completed.

flux

Fixed the Thermal Ground Pad:
  • Changed it to a centered 3.4 × 5.0 mm rectangular Top SMD pad per TI’s PWP0014J land pattern.
  • Preserved its terminal/GND connectivity and direct thermal connection.
  • Kept the duplicate un-netted EPAD disabled.
  • Verified only one active center copper pad remains, with no lead-pad overlap.
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TPS1HTC30-Q1