Part Information Review

Worked for 5 mins 7 sec

Thought for 6 sec — Planning skill development

Referenced guidance.

Thought for 9 sec — Loading schematic for inspection

Completed Overlapping Copper check.

Thought for 7 sec

No valid layout nodes to delete. 1 designator(s) not resolved.

Thought for 5 sec

Reading layout details.

Thought for 7 sec

No valid layout nodes to delete. 1 UIDs not found in layout.

Thought for 21 sec

Editing layout rules.

Thought for 6 sec

Editing layout rules.

Thought for 5 sec

Editing layout rules.

Thought for 11 sec

Thought for 6 sec

Awaiting 1 background task

"EPAD Footprint Fix" completed.

Worked for 47 sec

flux

Fixed and verified:

Disabled the duplicate un-netted EPAD copper.
Preserved the active, terminal-bound GND thermal pad.
No active overlapping center pads remain in the footprint.
Filed an internal part-quality report so the source footprint can be corrected.

adrian95

Fix the Thermal Ground Pad

Thought for 16 sec

flux

I’ll correct the terminal-bound GND thermal pad to the official PWP exposed-pad land pattern, preserve its GND association, and verify the duplicate EPAD remains disabled.

Thought for 9 mins 14 sec

Thought for 10 sec

Thought for 7 sec

Awaiting 1 background task

"TI PowerPAD Footprint Fix" completed.

Worked for 48 sec

flux

Fixed the Thermal Ground Pad:

Changed it to a centered 3.4 × 5.0 mm rectangular Top SMD pad per TI’s PWP0014J land pattern.
Preserved its terminal/GND connectivity and direct thermal connection.
Kept the duplicate un-netted EPAD disabled.
Verified only one active center copper pad remains, with no lead-pad overlap.

Files

Pins

Symbol

Layout

3D View

Part Datasheet Cross-Check — TPS1HTC30AQPWPRQ1

Scope

Reviewed available project information for the Flux part project TPS1HTC30AQPWPRQ1, including project metadata, schematic terminal elements, PCB footprint nodes/assets, and the official TI datasheet link.

Datasheet URL status

Existing project property: Datasheet URL = https://www.ti.com/lit/gpn/tps1htc30-q1
Status: Already set. No Datasheet property update was required.
Canonical TI PDF identified during review: https://www.ti.com/lit/ds/symlink/tps1htc30-q1.pdf

Project metadata reviewed

Table

Field	Current project value	Datasheet / TI source expectation	Status
Manufacturer Part Number	TPS1HTC30AQPWPRQ1	TPS1HTC30AQPWPRQ1	OK
Manufacturer Name	Texas Instruments	Texas Instruments	OK
Designator Prefix	U	U for IC / high-side switch	OK
Datasheet URL	https://www.ti.com/lit/gpn/tps1htc30-q1	Official TI datasheet/product redirect	OK
Package / footprint asset	HTSSOP14_PWP_TEX-M.kicad_mod	PWP 14-pin HTSSOP / PowerPAD	OK
3D model asset	PWP0014J.stp	PWP package model	OK
Description	`TPS1HTC30AQPWPRQ1 HTSSOP14_PWP_TEX...`	Should describe function and headline specs	Needs improvement
Package or Case Code property	Not seen in project properties	PWP / HTSSOP-14 PowerPAD	Missing
Part Type property	Not seen in project properties	Smart high-side switch / power switch IC	Missing
Operating Voltage property	Not seen in project properties	6 V to 60 V recommended VS operating range	Missing
Max Current property	Not seen in project properties	6 A continuous load/output current	Missing
Operating Temperature property	Not seen in project properties	–40°C to +125°C	Missing

Key datasheet specs

Table

Spec	Value
Device function	Single-channel automotive smart high-side switch
Headline rating	30 mΩ, 6 A
Supply voltage, VS	6 V to 60 V recommended operating range
Continuous load/output current	6 A
Adjustable current limit	2 A to 16 A
Default/internal current limit behavior	About 8 A when RILIM is open / out of range
On-resistance	30 mΩ typical at TJ = 25°C; 50 mΩ typical at 125°C; 60 mΩ typical at 150°C
Logic compatibility	1.8 V, 3.3 V, and 5 V logic compatible
Diagnostics	Current sense, open-load, short-to-battery, overload / short-to-ground, thermal shutdown reporting
Protections	Overload / short-circuit, inductive discharge clamp, UVLO, loss of GND, loss of supply, reverse-battery with external components
Operating temperature	–40°C to +125°C
Package	PWP, 14-pin HTSSOP / thermally enhanced PowerPAD
Exposed thermal pad	Internally shorted to GND

Datasheet pin table vs current schematic terminals

The datasheet pinout for the PWP 14-pin HTSSOP package is:

Table

Datasheet pin	Datasheet name	Datasheet role	Current schematic terminal	Current Pin Type	Match?
1	GND	Device ground	GND::e41d35b4	Power Out	Mismatch: should be Ground
2	EN	Enable input	EN	Input	OK
3	DIAG_EN	Diagnostics enable input	DIAG_EN	Input	OK
4	FAULT	Open-drain fault output	*FAULT	Output	Mostly OK; symbol label uses leading `*` while datasheet name is FAULT
5	LATCH	Thermal shutdown latch / retry selection input	LATCH	Input	OK
6	SNS	Analog diagnostic / current sense output	SNS	Output	OK
7	ILIM	Current-limit setting pin	ILIM	Output	Acceptable, though Passive or Unspecified may better reflect external resistor setting behavior
8	VOUT	High-side switch output	VOUT::608d818c	Power In	Mismatch: should be Power Out
9	VOUT	High-side switch output	VOUT::eaf7df97	Power In	Mismatch: should be Power Out
10	VOUT	High-side switch output	VOUT::ee8bb844	Power In	Mismatch: should be Power Out
11	NC	No internal connection	NC	Not Connected	OK
12	VS	Supply input	VS::9d87b72f	Power In	OK
13	VS	Supply input	VS::54ef71a8	Power In	OK
14	VS	Supply input	VS::a95f184d	Power In	OK
Thermal pad	Thermal Pad / GND	Exposed pad internally shorted to GND	GND::a1be50c6, Pin Number 15	Power Out	Mismatch: should be Ground; label should ideally indicate EPAD / Thermal Pad GND

Footprint cross-check

Footprint asset: HTSSOP14_PWP_TEX-M.kicad_mod
Layout pads present: pins/pads for FAULT, EN, DIAG_EN, LATCH, SNS, ILIM, NC, three VS pads, three VOUT pads, GND, plus EPAD.
This matches the expected 14 leads + exposed PowerPAD structure.
The main footprint concern is not pad count; it is semantic naming alignment between the schematic thermal pad terminal (GND::a1be50c6, Pin Number 15) and layout pad (EPAD).

Mismatches / issues flagged

GND terminals typed incorrectly
- Pin 1 and the exposed thermal pad are currently Pin Type: Power Out.
- They should be Ground.
VOUT terminals typed incorrectly
- Pins 8, 9, and 10 are currently Pin Type: Power In.
- They should be Power Out because they are high-side switch outputs to the load.
Thermal pad representation is ambiguous
- Datasheet describes the exposed thermal pad as internally shorted to ground.
- Footprint pad is named EPAD, while the schematic terminal is named GND with Pin Number: 15.
- This is electrically understandable but should ideally be labeled EPAD or Thermal Pad with Pin Type: Ground and a short pin description such as Ground Thermal Pad.
Pin descriptions missing
- Existing schematic terminals do not show Pin Description properties.
- Adding short descriptions would improve library usability and ERC context.
Project metadata is incomplete
- Missing recommended properties: Part Type, Package or Case Code, Operating Voltage, Max Current, Operating Temperature, and Implementation Details.
Project description is not library-friendly
- Current description is mostly the MPN and package names.
- Recommended description: Automotive 30-mΩ, 6-A single-channel smart high-side switch, 6-V to 60-V supply, HTSSOP-14 PowerPAD.

Suggested corrections

If you want the part synchronized to the datasheet, update these fields:

Terminal Pin Type fixes

Table

Terminal	Current	Recommended
GND::e41d35b4, pin 1	Power Out	Ground
GND::a1be50c6, thermal pad / pin 15	Power Out	Ground
VOUT::608d818c, pin 8	Power In	Power Out
VOUT::eaf7df97, pin 9	Power In	Power Out
VOUT::ee8bb844, pin 10	Power In	Power Out

Suggested project properties

Table

Property	Suggested value
Part Type	Power Switch / Smart High-Side Switch
Package or Case Code	HTSSOP-14 PWP PowerPAD
Operating Voltage	60 V
Max Current	6 A
Operating Temperature	–40°C to +125°C
Implementation Details	VS pins supply the high-side switch; VOUT pins connect to load; exposed thermal pad is internally shorted to GND and should be soldered to the PCB ground/thermal plane; FAULT is open-drain and requires an external pull-up in typical use; EN, DIAG_EN, and LATCH have internal pulldowns; ILIM sets external current limit and can be shorted to GND or left floating if external current limit is not used.

Overall result

The part is mostly structurally correct: the official datasheet URL is set, MPN/manufacturer are correct, the footprint has the expected 14-lead HTSSOP + exposed pad structure, and the schematic has all expected signal pins. The main problems are pin-type metadata errors on GND and VOUT, missing terminal descriptions, incomplete project properties, and ambiguous thermal-pad labeling.

Scope
Datasheet URL status
Project metadata reviewed
Key datasheet specs
Datasheet pin table vs current schematic terminals
Footprint cross-check
Mismatches / issues flagged
Suggested corrections
Terminal Pin Type fixes
Suggested project properties
Overall result