Part Review and Datasheet Analysis

Thought for 1 min 36 sec

ST4SIM-300M part review 1) Available part information in the project

Table

Field	Current project data	Review
MPN	ST4SIM-300M	Present
Manufacturer	STMicroelectronics	Present
Datasheet URL	Present: PDF	Already set, so no update was needed
Description	Project description is `123`	Incomplete / not usable
Package in footprint asset	SON127P600X500X100-9N.kicad_mod	Does not match datasheet naming cleanly
3D model	ST4SIM-300M.stp	Present
Pin objects in symbol	9 terminals	Includes an extra EP terminal
BOM metadata	Only generic GND entries are present	Part metadata is not fully populated in BOM

2) Datasheet status

A datasheet URL was already set on the part, so step 2 did not require a web search or property edit.

3) Datasheet summary Device summary

Table

Item	Datasheet value
Part	ST4SIM-300M
Function	GSMA eSIM / eUICC solution for IoT
Package options mentioned	VFDFPN8 5 × 6 mm wettable flank (MFF2), WLCSP24, card plugin 2FF / 3FF / 4FF
VFDFPN package pin count	8 pins
Supply voltage	1.8 V, 3 V
Operating temperature	-40 °C to +105 °C

Absolute maximum ratings

Table

Symbol	Parameter	Value
VCC	Supply voltage	1.8 to 3.0 V
VIO	Input/output voltage relative to ground	-0.3 to VCC + 0.3 V
TA	Ambient operating temperature	-40 to +105 °C
TSTG	Storage temperature	-65 to +150 °C
TLEAD	Lead temperature during soldering	See J-STD-020D note
VESD	HBM ESD	4000 V

Recommended / operating conditions found

Table

Parameter	Value
Supply voltage	1.8 V or 3 V
Operating temperature	-40 °C to +105 °C
Maximum VCC rising slope	5 V/µs
Recommended VCC filtering	100 nF and 1 µF on VCC

Pin descriptions from datasheet

Table

Datasheet pin	Name	Function	Pin state
1	VCC	Power supply	-
2	RESET	External reset	Input pull-down
3	CLK	External clock	Pull-down
4	NC	Not connected internally	-
5	GND	Ground supply	-
6	SWIO	Not used	Input pull-up
7	I/O	Input/output	Pull-down then pull-up after card activation
8	NC	Not connected internally	-

VFDFPN8 package dimensions

Table

Parameter	Value
Overall size	5.0 mm × 6.0 mm
Pitch	1.27 mm
Lead width `b`	0.350 / 0.400 / 0.480 mm
Lead length `L`	0.400 / 0.500 / 0.600 mm
Central bottom area `D2`	4.100 / 4.200 / 4.300 mm
Central bottom area `E2`	3.300 / 3.400 / 3.500 mm
Thickness `A`	0.700 / 0.850 / 1.000 mm

Special features

Table

Area	Highlights
Connectivity	GSMA eSIM for IoT, remote SIM provisioning, up to 7 profiles optional
Network support	2G / 3G / 4G LTE / CDMA / NB-IoT / CAT-M
Security	Common Criteria EAL6+, DES/3DES/AES, RSA up to 2048-bit, ECC up to 521-bit
Interfaces	ISO/IEC 7816-3 async I/O, SPI depending on package
Software ecosystem	Java Card v3.0.5 Classic, GlobalPlatform v2.3, GSMA SGP.32 v1.1
Packaging	ECOPACK, MFF2 wettable-flank option

4) Symbol and footprint cross-check Major mismatches

Table

Area	Project implementation	Datasheet	Risk
Pin numbering	Symbol/footprint map pin 1 = GND, 8 = VCC	Datasheet says pin 1 = VCC, 5 = GND	Critical: wrong PCB net assignment can cause immediate non-function or damage
Signal order	Project has `1 GND, 2 SWIO, 3 I/O, 4 NC, 5 NC, 6 CLK, 7 ~RESET, 8 VCC`	Datasheet has `1 VCC, 2 RESET, 3 CLK, 4 NC, 5 GND, 6 SWIO, 7 I/O, 8 NC`	Critical manufacturing failure risk
Extra pad/terminal	Project includes pin 9 / EP	Datasheet pin table defines 8 pins only	High: may create invalid net/pad definition and ordering confusion
Package naming	Footprint asset named SON127P600X500X100-9N	Datasheet calls package VFDFPN8 5 × 6 mm wettable flank (MFF2)	Medium: ordering/footprint selection ambiguity
Pin electrical types	All symbol terminals are Unspecified	Datasheet provides clear functional roles	Medium: weaker ERC quality, easier wiring mistakes

Footprint geometry check

Table

Geometry item	Footprint	Datasheet	Review
Pin count	8 edge pads + center pad = 9 pads	8 pins	Mismatch
Edge pad pitch	1.27 mm	1.27 mm typ	Matches
Edge pad size	0.45 × 0.95 mm	Lead width/length ranges support this as plausible land size	Looks reasonable
Body outline	5 × 6 mm class	5 × 6 mm	Matches broadly
Center pad size	3.5 × 4.3 mm	Bottom central area 4.2 × 3.4 mm typ	Appears transposed relative to datasheet dimensions

Conclusion

Table

Severity	Finding
Critical	The current symbol-to-footprint pin numbering does not match the datasheet pinout.
Critical	If used as-is, this part could produce a board with incorrect power and signal routing.
High	The added EP / pin 9 is not supported by the datasheet pin table for the VFDFPN8 package.
Medium	The center pad dimensions appear swapped versus datasheet `D2/E2`.
Medium	Part metadata is incomplete, especially the description and pin-type definitions.

Recommended fixes

Table

Priority	Fix
1	Rebuild the symbol pin numbering to match datasheet VFDFPN8 exactly: 1 VCC, 2 RESET, 3 CLK, 4 NC, 5 GND, 6 SWIO, 7 I/O, 8 NC
2	Remove the extra EP electrical pin unless you confirm the package requires a center pad with a defined electrical function in the package drawing
3	Re-verify the center pad geometry against the VFDFPN8 mechanical drawing before release
4	Update the part description from `123` to a real functional description
5	Assign proper pin types so ERC can catch misuse

If you want, I can next turn this into a clean correction checklist for the part project.

Create correction checklist

Inspect pin mapping

Recheck footprint geometry

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