Part Review and Datasheet Analysis

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ST4SIM-300M part review 1) Available part information in the project

Table

FieldCurrent project dataReview
MPNST4SIM-300MPresent
ManufacturerSTMicroelectronicsPresent
Datasheet URLPresent: PDFAlready set, so no update was needed
DescriptionProject description is 123Incomplete / not usable
Package in footprint assetSON127P600X500X100-9N.kicad_modDoes not match datasheet naming cleanly
3D modelST4SIM-300M.stpPresent
Pin objects in symbol9 terminalsIncludes an extra EP terminal
BOM metadataOnly generic GND entries are presentPart metadata is not fully populated in BOM
2) Datasheet status
A datasheet URL was already set on the part, so step 2 did not require a web search or property edit.
3) Datasheet summary Device summary

Table

ItemDatasheet value
PartST4SIM-300M
FunctionGSMA eSIM / eUICC solution for IoT
Package options mentionedVFDFPN8 5 × 6 mm wettable flank (MFF2), WLCSP24, card plugin 2FF / 3FF / 4FF
VFDFPN package pin count8 pins
Supply voltage1.8 V, 3 V
Operating temperature-40 °C to +105 °C
Absolute maximum ratings

Table

SymbolParameterValue
VCCSupply voltage1.8 to 3.0 V
VIOInput/output voltage relative to ground-0.3 to VCC + 0.3 V
TAAmbient operating temperature-40 to +105 °C
TSTGStorage temperature-65 to +150 °C
TLEADLead temperature during solderingSee J-STD-020D note
VESDHBM ESD4000 V
Recommended / operating conditions found

Table

ParameterValue
Supply voltage1.8 V or 3 V
Operating temperature-40 °C to +105 °C
Maximum VCC rising slope5 V/µs
Recommended VCC filtering100 nF and 1 µF on VCC
Pin descriptions from datasheet

Table

Datasheet pinNameFunctionPin state
1VCCPower supply-
2RESETExternal resetInput pull-down
3CLKExternal clockPull-down
4NCNot connected internally-
5GNDGround supply-
6SWIONot usedInput pull-up
7I/OInput/outputPull-down then pull-up after card activation
8NCNot connected internally-
VFDFPN8 package dimensions

Table

ParameterValue
Overall size5.0 mm × 6.0 mm
Pitch1.27 mm
Lead width b0.350 / 0.400 / 0.480 mm
Lead length L0.400 / 0.500 / 0.600 mm
Central bottom area D24.100 / 4.200 / 4.300 mm
Central bottom area E23.300 / 3.400 / 3.500 mm
Thickness A0.700 / 0.850 / 1.000 mm
Special features

Table

AreaHighlights
ConnectivityGSMA eSIM for IoT, remote SIM provisioning, up to 7 profiles optional
Network support2G / 3G / 4G LTE / CDMA / NB-IoT / CAT-M
SecurityCommon Criteria EAL6+, DES/3DES/AES, RSA up to 2048-bit, ECC up to 521-bit
InterfacesISO/IEC 7816-3 async I/O, SPI depending on package
Software ecosystemJava Card v3.0.5 Classic, GlobalPlatform v2.3, GSMA SGP.32 v1.1
PackagingECOPACK, MFF2 wettable-flank option
4) Symbol and footprint cross-check Major mismatches

Table

AreaProject implementationDatasheetRisk
Pin numberingSymbol/footprint map pin 1 = GND, 8 = VCCDatasheet says pin 1 = VCC, 5 = GNDCritical: wrong PCB net assignment can cause immediate non-function or damage
Signal orderProject has 1 GND, 2 SWIO, 3 I/O, 4 NC, 5 NC, 6 CLK, 7 ~RESET, 8 VCCDatasheet has 1 VCC, 2 RESET, 3 CLK, 4 NC, 5 GND, 6 SWIO, 7 I/O, 8 NCCritical manufacturing failure risk
Extra pad/terminalProject includes pin 9 / EPDatasheet pin table defines 8 pins onlyHigh: may create invalid net/pad definition and ordering confusion
Package namingFootprint asset named SON127P600X500X100-9NDatasheet calls package VFDFPN8 5 × 6 mm wettable flank (MFF2)Medium: ordering/footprint selection ambiguity
Pin electrical typesAll symbol terminals are UnspecifiedDatasheet provides clear functional rolesMedium: weaker ERC quality, easier wiring mistakes
Footprint geometry check

Table

Geometry itemFootprintDatasheetReview
Pin count8 edge pads + center pad = 9 pads8 pinsMismatch
Edge pad pitch1.27 mm1.27 mm typMatches
Edge pad size0.45 × 0.95 mmLead width/length ranges support this as plausible land sizeLooks reasonable
Body outline5 × 6 mm class5 × 6 mmMatches broadly
Center pad size3.5 × 4.3 mmBottom central area 4.2 × 3.4 mm typAppears transposed relative to datasheet dimensions
Conclusion

Table

SeverityFinding
CriticalThe current symbol-to-footprint pin numbering does not match the datasheet pinout.
CriticalIf used as-is, this part could produce a board with incorrect power and signal routing.
HighThe added EP / pin 9 is not supported by the datasheet pin table for the VFDFPN8 package.
MediumThe center pad dimensions appear swapped versus datasheet D2/E2.
MediumPart metadata is incomplete, especially the description and pin-type definitions.
Recommended fixes

Table

PriorityFix
1Rebuild the symbol pin numbering to match datasheet VFDFPN8 exactly: 1 VCC, 2 RESET, 3 CLK, 4 NC, 5 GND, 6 SWIO, 7 I/O, 8 NC
2Remove the extra EP electrical pin unless you confirm the package requires a center pad with a defined electrical function in the package drawing
3Re-verify the center pad geometry against the VFDFPN8 mechanical drawing before release
4Update the part description from 123 to a real functional description
5Assign proper pin types so ERC can catch misuse
If you want, I can next turn this into a clean correction checklist for the part project.
Create correction checklist
Inspect pin mapping
Recheck footprint geometry

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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    ST4SIM-300M

    SON127P600X500X100-9N.kicad_modFootprint
    ST4SIM-300M-thumb.png

    ST4SIM-300M-thumb.png

    ST4SIM-300M-thumbThumbnail
    ST4SIM-300M

    ST4SIM-300M

    ST4SIM-300M.stp3D Model

    ST4SIM-300M

    ST4SIM-300M Symbol.svgDefault

    ST4SIM-300M

    ST4SIM-300M thumbnail
    GSMA eSIM for IoT system-on-chip solution for IoT environment #CommonPartsLibrary #IntegratedCircuit

    Properties

    ST4SIM-300M

    STMicroelectronics

    Integrated Circuit

    mouser.in/pdfDocs/st4sim-300m.pdf

    IC

    creativecommons.org/licenses/by/4.0/

    Pricing & Availability

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    Controls