Schematic symbol present: yes (ball labels A..U rows with numeric 1..17, modeled as Terminal pins)
Footprint present: yes (pads for each signal; 1:1 naming with symbol)
Step 2 — Datasheet URL
Datasheet property on the part: not set.
Attempted to locate official datasheet via web search, but the web tool returned no results. I cannot add the ‘Datasheet’ property without a valid URL.
Action needed: please share the official datasheet link (PDF or NXP product page) and I will immediately attach it to the part and proceed with full extraction.
Step 3 — Datasheet scan and metadata extraction
Blocked until a datasheet URL is available. Once provided, I will extract and summarize:
Absolute Maximum Ratings
Recommended Operating Conditions
Electrical Characteristics
Pin descriptions
Package dimensions/land pattern
Special/Key features
Step 4 — Cross-check of symbol and footprint vs datasheet (preliminary, without datasheet)
What matches so far
Ball grid/pinout scheme: The symbol implements per-ball terminals with alphanumeric labels (e.g., VSS shows Pin Number A1), consistent with a 17×17 BGA.
Pin coverage: The PCB footprint includes a pad for each symbol Terminal (1:1 mapping by name), indicating intended completeness.
Issues and risks to address after datasheet review
Pin electrical types:
Many ground balls are typed as “Power Out” (e.g., VSS). This is likely incorrect and can cause ERC confusion; these should be typed as “Ground” (or “Power In” per convention) per datasheet guidance.
Several functional pins are “Unspecified” (examples: USB1_VBUS, USB2_DN, USB1_DN, MIPI_DSI_DP0, POR_B). These should be set to Input/Output/Bi-Directional/Power In as specified by the datasheet.
Footprint verification items pending datasheet:
Confirm body size (14 × 14 mm), ball pitch (0.80 mm), ball diameter, and keep-out recommendations.
Confirm corner orientation (A1) indicator and silkscreen/fab markers.
Confirm solder mask and paste apertures vs NXP recommended land pattern.
Confirm any depopulated balls or NCs per MPN variant.
Ordering/manufacturing risk without datasheet:
Family-level documents sometimes have multiple package variants and tolerance notes that affect paste and assembly. Without confirming these, there is risk of assembly defects or misordered parts.
Next step
Share the official NXP datasheet URL for MIMXRT1176DVMAA. I’ll immediately:
Attach it to the part (“Datasheet” property).
Extract all required metadata into concise tables.
Complete a definitive symbol/footprint cross-check against the datasheet’s pin tables and mechanical package section.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant