Part Audit and Datasheet Review
Thought for 17 sec
I’ll update the official MPN formatting, add datasheet-derived pin descriptions, and restructure the symbol metadata into parametric sections/groups with orientations and ordering.
Worked for 2 mins 58 sec
The official MPN/project name and all unique signal/power-control pins are updated. I’m applying the repeated power/ground ball metadata next, which is the bulk of the 144-ball symbol.
Worked for 4 mins 14 sec
Done.
- Renamed the project to the official MPN format:
LTM4712IY#PBF. - Converted the symbol terminals to
Parametricstyle. - Added datasheet-derived
Pin Description,Section,Pin Group,Pin Orientation, andTerminal Ordermetadata across the 144-ball symbol. - Refined key pin types, including
INTVCCas power output,VOUTas power output, andSW1/SW2as passive switch/test nodes. - Verified representative signal, power, switch, SGND, and GND pins; no missing parametric metadata was surfaced by the project index or review checks.
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Part Audit: LTM4712IY#PBF
Date: 2026-05-29
Source Data Reviewed
- Project name:
LTM4712IY-PBF - Project description:
LTM4712IY#PBF 05-08-7078_ADI - Official datasheet URL set on project: https://www.analog.com/media/en/technical-documentation/data-sheets/ltm4712.pdf
- Datasheet source: Analog Devices, LTM4712 Rev. 0
- Schematic representation: 144 separate
Terminalcomponents representing package balls - Footprint representation: 144 pad nodes plus footprint shapes/text
- BOM: no assembled BOM items; expected for a part/symbol-footprint project
Key Datasheet Identification
Table
| Field | Datasheet Value | Project / Flux Value | Result |
|---|---|---|---|
| Manufacturer | Analog Devices | Description includes ADI | Pass |
| MPN | LTM4712IY#PBF | Project name uses LTM4712IY-PBF; description uses LTM4712IY#PBF | Minor naming mismatch |
| Function | 36VIN, 12A step-up/step-down buck-boost uModule regulator | Description only contains MPN/vendor metadata | Description incomplete |
| Package | CSP_BGA | Footprint is BGA-like 12 x 12 pad array | Pass |
| Pin/ball count | 144-pin / 144-ball | 144 terminals and 144 footprint pads | Pass |
| Package size | 16 mm x 16 mm x 8.34 mm | Footprint has 144 pads; exact body dimensions not fully exposed in readback | Needs layout dimension spot-check if critical |
| Ball pitch | 1.27 mm | Footprint appears as 12 x 12 BGA; exact pitch not fully exposed in readback | Needs layout dimension spot-check if critical |
| Ball diameter | 0.60 mm nominal, 0.70 mm max | Pad details not fully exposed in readback | Needs pad-size spot-check |
| Suggested PCB pad | 0.630 mm diameter reference, 144x | Pad details not fully exposed in readback | Needs pad-size spot-check |
Key Electrical Specs
- Input voltage range: 5 V to 36 V
- Output voltage range: 1 V to 36 V
- Output current: 12 A in buck and buck-boost mode; 6 A at VIN = 5 V, VOUT = 12 V, 400 kHz; 12 A at VIN = 12 V, VOUT = 12 V, 400 kHz
- Switching frequency range: 100 kHz to 600 kHz
- Recommended fixed frequency example: 400 kHz with RT = 140 kΩ
- FB reference: 1.00 V typical
- Internal VOUT-to-FB resistor: 100 kΩ
- INTVCC regulation: 5 V typical
- PGOOD: open-drain output, ±10% regulation window, internal 30 us delay
- Thermal: thetaJCtop = 9 °C/W, thetaJCbottom = 4.2 °C/W, thetaJA = 9 °C/W; weight 7.4 g typical
- Operating temperature / max internal operating range: -40 °C to 125 °C
Datasheet Ball Map Cross-Check
The schematic terminal names and pin numbers were checked against Datasheet Table 6,
LTM4712 Pin Assignment (Arranged by Pin Number).Result: No symbol pin-number/name mismatches found in the available readback. All 144 expected balls are represented.
Expected functional groups from datasheet:
- GND: A1-G1, A2-G2, C3-M3, C4-M4, C5-J5, M5, E6-M6, E7-M7, C8-J8, M8, C9-M9, C10-M10, C11-G11, A12-G12
- SGND: C6-D6, B7-D8
- VIN: H1-M1, H2-M2
- VOUT: H11-M11, H12-M12
- SW1: K5-L5
- SW2: K8-L8
- Signal/control pins: A3 ISN, A4 ISP, A5 IMON, A6 CLKOUT, A7 FREQ, A8 PGOOD, A9 PHMODE, A10 MODE, A11 SS, B3 INTVCC, B4 EXTVCC, B5 ISET, B6 SYNC, B8 RUN, B9 FB, B10 COMPa, B11 COMPb
Footprint Cross-Check
- Footprint pad count: 144 pad nodes were found, matching the 144-ball datasheet package.
- Layout text indicates a 12 x 12 BGA grid with row/column markings.
- Footprint has BGA pad naming aligned by function/designator readback.
Open verification item: the tool readback did not expose exact pad diameter, ball pitch, or body outline dimensions. Datasheet values to verify visually/numerically if manufacturing precision is required:
- Body: 16 mm x 16 mm x 8.34 mm
- Pitch: 1.27 mm
- Ball diameter: 0.60 mm nominal, 0.70 mm maximum
- Suggested PCB pad: 0.630 mm diameter reference
Pin Description and Pin Type Audit
The current terminals use the pin name and pin number, but most do not include a rich
Pin Description property. For a library-quality part, add descriptions from the datasheet pin-functions section.Notable pin-type/property issues to consider:
Table
| Pin(s) | Current Flux Pin Type | Datasheet Role | Recommended Action |
|---|---|---|---|
| INTVCC B3 | Power In | Internal 5 V regulator output; internally decoupled to SGND | Change to Power Out or Output; add description |
| VOUT H11-M11, H12-M12 | Passive | Power output pins | Consider Power Out for clearer ERC semantics |
| SW1 K5-L5, SW2 K8-L8 | Power In | Switching/test nodes; snubber optional, otherwise leave floating | Change to Passive or Unspecified; add note that these may be left floating |
| GND / SGND | Power Out | Ground / signal ground pins | Ground-specific pin type would be preferable if available; current Power Out is acceptable but not descriptive |
| ISET, FREQ, MODE, SS, COMPa, COMPb, ISP, ISN | Unspecified | Analog/control pins with specific application behavior | Add pin descriptions and consider Input/Bidirectional/Passive based on usage |
| PGOOD A8 | Output | Open-drain power-good output | Add open-drain description; external pull-up required by application if used |
| CLKOUT A6 | Output | Clock output; leave open if unused | Add description |
| SYNC B6 | Input | External sync input; internal pull-down; tie to GND if unused | Current Input is good; add description |
| RUN B8 | Input | Enable input | Current Input is good; add thresholds in description |
| FB B9 | Input | Error amp negative input, internally tied to VOUT through 100 kΩ | Current Input is good; add description |
| EXTVCC B4 | Power In | External power input to internal LDO | Current Power In is good; add description |
Mismatches / Flags
- Datasheet URL was missing and has now been set to the official Analog Devices PDF.
- MPN naming differs between project name and official ordering code: project name uses
LTM4712IY-PBF, while the official datasheet/order code isLTM4712IY#PBF. The description already contains the official#form. - Project description is sparse. Recommended description:
Analog Devices LTM4712IY#PBF, 36VIN 12A buck-boost uModule regulator, 144-ball 16 mm x 16 mm x 8.34 mm CSP_BGA. - Pin names and ball assignments match the datasheet in the available schematic readback.
- Footprint pad count matches the datasheet 144-ball package, but exact pad diameter/pitch/body dimensions were not exposed in the layout readback and should be spot-checked before release.
- Pin descriptions are largely absent; add datasheet-derived
Pin Descriptiontext for library quality. - Several pin types should be refined for better ERC/library semantics, especially INTVCC, VOUT, SW1/SW2, and analog/control pins.
Recommended Next Edits
- Rename or alias the part to preserve official ordering code
LTM4712IY#PBF. - Update project description with the complete function/package summary.
- Add
Pin Descriptionproperties to all non-repeated signal/control pins and representative power groups. - Refine pin types:
- INTVCC: Power Out / Output
- VOUT: Power Out
- SW1/SW2: Passive or Unspecified
- PGOOD: Output, with open-drain description
- CLKOUT: Output
- RUN/SYNC/PHMODE/FB: Input
- ISP/ISN/IMON/ISET/FREQ/SS/COMPa/COMPb/MODE: analog/control descriptions and suitable non-power types
- Verify footprint numeric pad pitch and diameter against the datasheet mechanical drawing before release/manufacturing.
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