Part Datasheet Review and Audit

Thought for 1 min 52 sec

I reviewed the current part data for LTC7891RUFDM#PBF and found:

Current part summary

Table

Field	Result
MPN	LTC7891RUFDM_PBF / ordering variant LTC7891RUFDM#PBF
Manufacturer	Analog Devices
Description	100 V, Low IQ, Synchronous Step-Down Controller for GaN FETs
Package in project	28-QFN, 0.8 mm body height noted
Symbol pin count	29 terminals including exposed pad as ground
Footprint asset	QFN50P500X400X80-29N.kicad_mod
Existing datasheet property	Not found

Official datasheet found

Table

Source	URL
Analog Devices datasheet PDF	Datasheet

I can update the part’s Datasheet property to that official Analog Devices PDF.

Early audit notes from the datasheet cross-check

Table

Check	Result	Risk
Package family	Matches: 28-lead side-wettable QFN, 4 mm x 5 mm	Low
Terminal count	Matches: 28 pins + exposed pad = 29	Low
Exposed pad	Matches: exposed pad is ground and must be soldered to PCB ground	Low
Footprint naming	Matches the expected 5.0 mm x 4.0 mm x 0.8 mm, 0.5 mm pitch style	Low
Symbol pin numbering	Appears consistent with datasheet numbering	Low
Functional pin typing	Some pins are marked generically in the symbol; not necessarily wrong, but worth tightening later for ERC quality	Medium

Datasheet facts already confirmed

Table

Category	Key items
Electrical characteristics	VIN 4 V to 100 V, VOUT 0.8 V to 60 V, IQ 5 µA typ at 48 VIN to 5 VOUT, programmable 100 kHz to 3 MHz
Absolute max	VIN/RUN to 100 V, BOOST to 106 V, EXTVCC to 30 V, DRVCC/INTVCC/BSTVCC to 6 V, SENSE+/SENSE- to 65 V
Operating range	TJ = -40 C to +150 C
Special features	Optimized for GaN FETs, smart bootstrap, near-zero dead time, adjustable gate-drive voltage, spread-spectrum, PLL sync
Important package rule	Exposed pad must be soldered to PCB GND for rated electrical and thermal performance

If you apply the change, I’ll continue with the full datasheet metadata extraction and the detailed symbol/footprint mismatch audit.

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