Part Information Review and Datasheet Update

flux

Work done
  • Grouped the ESP32-WROOM-32E pins from the official datasheet into one primary function group per pin: Power/3V3, individual GND groups, Control/Boot, Analog/Touch, Clock/Crystal, GPIO, and Reserved/No Connect.
  • Updated terminal properties with Section, Pin Group, Pin Orientation, Sub-symbol Designator Suffix, and concise Pin Description; corrected GND pins to Ground type.
  • Removed duplicate exposed-pad schematic terminals so P_GND/39 is represented once.
  • Full grouping and validation details are documented in ESP32-WROOM-32E Pin Grouping.
Success criteria review
  • ✅ All datasheet pins 1–38 plus P_GND/39 are covered once.
  • ✅ Power, 3V3, individual GND, GPIO, control/boot, analog/touch, clock/crystal, and reserved pins are distinctly categorized.
  • ✅ Project terminal metadata now reflects the grouping with no duplicate pin assignments.
Next steps
  • If you want, I can next clean up the remaining visible duplicate-style labels for GND/NC terminals or proceed to footprint/EPAD mapping cleanup.
Clean labels
Clean EPAD mapping
Run ERC check
Export documentation
NC
Pin Number
18
GND
Pin Number
38
GND
Pin Number
39_6
IO2
Pin Number
24
GND
Pin Number
39_8
TXD0
Pin Number
35
IO21
Pin Number
33
IO32
Pin Number
8
GND
Pin Number
39_1
GND
Pin Number
39_3
IO5
Pin Number
29
IO22
Pin Number
36
SENSOR_VP
Pin Number
4
NC
Pin Number
22
NC
Pin Number
21
IO33
Pin Number
9
IO16
Pin Number
27
GND
Pin Number
39_2
IO17
Pin Number
28
GND
Pin Number
15
GND
Pin Number
39_7
IO25
Pin Number
10
GND
Pin Number
39_4
NC
Pin Number
19
GND
Pin Number
39_5
IO23
Pin Number
37
NC1
Pin Number
32
IO34
Pin Number
6
RXD0
Pin Number
34
NC
Pin Number
17
GND
Pin Number
39_9
IO35
Pin Number
7
NC
Pin Number
20
EN
Pin Number
3
IO4
Pin Number
26
IO19
Pin Number
31
IO14
Pin Number
13
IO15
Pin Number
23
IO0
Pin Number
25
IO26
Pin Number
11
GND
Pin Number
1
SENSOR_VN
Pin Number
5
IO18
Pin Number
30
IO12
Pin Number
14
3V3
Pin Number
2
IO13
Pin Number
16
IO27
Pin Number
12

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ESP32-WROOM-32E Part Information Review
Datasheet source
Datasheet-derived key specs
  • Function: 2.4 GHz Wi‑Fi + Bluetooth + Bluetooth LE MCU module.
  • Core: ESP32 series SoC with Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz.
  • Memory: 448 KB ROM, 520 KB SRAM, 16 KB RTC SRAM.
  • Variant matching this project intent: ESP32-WROOM-32E-N16 = 16 MB Quad SPI flash, no PSRAM, -40 to +85 °C, 18.0 × 25.5 × 3.1 mm.
  • Interfaces/peripherals: up to 26 GPIOs; UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, IR, pulse counter, capacitive touch, ADC, DAC, TWAI/CAN-compatible.
  • Supply: recommended VDD33 = 3.0–3.6 V, typical 3.3 V; external supply should deliver at least 0.5 A.
  • Antenna: ESP32-WROOM-32E has onboard PCB antenna and requires antenna keepout on host PCB.
Current project metadata observed
  • Project name: ESP32-WROOM-32E__16MB_
  • Manufacturer Part Number: ESP32-WROOM-32E__16MB_
  • Manufacturer Name: Espressif
  • Part Type: Integrated Circuits
  • Designator Prefix: U
  • Datasheet URL: was not shown in the initial context, so it has been set to the official Espressif PDF.
  • Existing description looked malformed/incomplete: 1.4 / Espressif Systems / 3.25mm / Manufacturer Recommendations.
Metadata mismatches / recommended corrections
  1. MPN mismatch: Datasheet ordering code for the 16 MB no-PSRAM ESP32-WROOM-32E is ESP32-WROOM-32E-N16. The project currently uses ESP32-WROOM-32E__16MB_, which is not the datasheet ordering code.
  2. Part Type too generic: Integrated Circuits is acceptable but less useful than Wi-Fi/Bluetooth MCU Module or Microcontroller Module.
  3. Description should be rewritten: Recommended description: Wi‑Fi + Bluetooth MCU module, ESP32 dual-core LX6 up to 240 MHz, 16 MB flash, PCB antenna, 3.0–3.6 V, 18.0 × 25.5 × 3.1 mm.
  4. Package / case code missing: Recommended value: ESP32-WROOM-32E module, 18.0 × 25.5 × 3.1 mm, 38-pin castellated + EPAD/GND pad.
  5. Operating Voltage missing: Recommended value: 3.6 V if using the Flux numeric max recommended operating voltage convention.
  6. Operating Temperature missing: Recommended value for N16 variant: -40°C to +85°C.
Datasheet pin reference
The datasheet states the module has 38 pins in Table 3, with an additional EPAD/P_GND pad 39 shown in the peripheral schematic / pin layout.
Key pin list:
  • 1 GND — Ground
  • 2 3V3 — Power supply
  • 3 EN — Enable; must not float
  • 4 SENSOR_VP — GPIO36 / ADC1_CH0 / RTC_GPIO0
  • 5 SENSOR_VN — GPIO39 / ADC1_CH3 / RTC_GPIO3
  • 6 IO34 — GPIO34 / ADC1_CH6 / RTC_GPIO4
  • 7 IO35 — GPIO35 / ADC1_CH7 / RTC_GPIO5
  • 8 IO32 — GPIO32 / 32 kHz XTAL input / ADC1_CH4 / TOUCH9 / RTC_GPIO9
  • 9 IO33 — GPIO33 / 32 kHz XTAL output / ADC1_CH5 / TOUCH8 / RTC_GPIO8
  • 10 IO25 — GPIO25 / DAC1 / ADC2_CH8 / RTC_GPIO6 / EMAC_RXD0
  • 11 IO26 — GPIO26 / DAC2 / ADC2_CH9 / RTC_GPIO7 / EMAC_RXD1
  • 12 IO27 — GPIO27 / ADC2_CH7 / TOUCH7 / RTC_GPIO17 / EMAC_RX_DV
  • 13 IO14 — GPIO14 / ADC2_CH6 / TOUCH6 / MTMS / HSPI/SD/EMAC functions
  • 14 IO12 — GPIO12 / ADC2_CH5 / TOUCH5 / MTDI / HSPI/SD/EMAC functions
  • 15 GND — Ground
  • 16 IO13 — GPIO13 / ADC2_CH4 / TOUCH4 / MTCK / HSPI/SD/EMAC functions
  • 17–22 NC — not connected; internal flash-related chip pins are not led out
  • 23 IO15 — GPIO15 / ADC2_CH3 / TOUCH3 / MTDO / HSPICS0 / SD_CMD / EMAC_RXD3
  • 24 IO2 — GPIO2 / ADC2_CH2 / TOUCH2 / RTC_GPIO12 / HSPIWP / SD_DATA0
  • 25 IO0 — GPIO0 / ADC2_CH1 / TOUCH1 / RTC_GPIO11 / CLK_OUT1 / EMAC_TX_CLK
  • 26 IO4 — GPIO4 / ADC2_CH0 / TOUCH0 / RTC_GPIO10 / HSPIHD / SD_DATA1 / EMAC_TX_ER
  • 27 IO16 — GPIO16 / HS1_DATA4 / U2RXD / EMAC_CLK_OUT
  • 28 IO17 — GPIO17 / HS1_DATA5 / U2TXD / EMAC_CLK_OUT_180
  • 29 IO5 — GPIO5 / VSPICS0 / HS1_DATA6 / EMAC_RX_CLK
  • 30 IO18 — GPIO18 / VSPICLK / HS1_DATA7
  • 31 IO19 — GPIO19 / VSPIQ / U0CTS / EMAC_TXD0
  • 32 NC — not connected
  • 33 IO21 — GPIO21 / VSPIHD / EMAC_TX_EN
  • 34 RXD0 — GPIO3 / U0RXD / CLK_OUT2
  • 35 TXD0 — GPIO1 / U0TXD / CLK_OUT3 / EMAC_RXD2
  • 36 IO22 — GPIO22 / VSPIWP / U0RTS / EMAC_TXD1
  • 37 IO23 — GPIO23 / VSPID / HS1_STROBE
  • 38 GND — Ground
  • 39 P_GND / EPAD — optional soldered ground pad shown in peripheral schematic; soldering is not required, and excessive paste can impair edge-pad soldering.
Schematic symbol audit
Matches
  • Pins 1–38 are present with the correct visible names and pin numbers.
  • NC pins 17–22 and 32 are represented as not connected.
  • Input-only pins SENSOR_VP, SENSOR_VN, IO34, and IO35 are set as Input.
  • Most GPIO pins are set as Bi-Directional.
Mismatches / missing symbol metadata
  1. GND pin type is wrong: GND terminals are set to Power In; they should be Ground.
  2. Pin descriptions are missing: terminals currently only have Pin Number / Pin Type / Designator Prefix; the datasheet functions are not captured as Pin Description.
  3. Section / Pin Group / Pin Orientation / Sub-symbol Designator Suffix are missing for this >20-pin IC-style module.
  4. IO16 note not represented: datasheet says IO16 cannot be used for other functions on PSRAM variants; for the N16 no-PSRAM variant this is okay, but the note is important if the same part is reused for N16R2.
  5. EPAD/P_GND representation is inconsistent: schematic has multiple GND terminal elements with pin numbers 39_1 through 39_9, while the datasheet shows one functional pad 39 / P_GND. This should be reviewed. A footprint may split EPAD copper into multiple pads, but the schematic symbol should ideally expose a single EPAD/P_GND terminal or consistently map all split pads to the same ground function.
Footprint audit
Matches
  • The footprint has pads for pins 1–38 matching the ESP32-WROOM-32E module pins.
  • The footprint includes an antenna marking/area, which is appropriate for the ESP32-WROOM-32E PCB antenna version.
  • The footprint includes additional GND/mount pads corresponding to the EPAD / thermal ground pad region.
Mismatches / items to verify
  1. EPAD split pad mapping: layout contains mount pads 39_10 through 39_21, while schematic contains only 39_1 through 39_9 split GND terminals. This suggests not all footprint split pads have corresponding schematic terminals, or the split-pad strategy is inconsistent.
  2. Pin 39 naming: datasheet schematic names this as P_GND / pin 39. Current split names 39_1...39_21 should be verified against Flux footprint-to-symbol mapping expectations.
  3. Antenna keepout: footprint marks ANTENNA, but the datasheet requires host-board keepout/placement care. Verify that the actual reusable footprint/part carries enough information/rules/notes so downstream board designs do not place copper or components under the antenna region.
Suggested next cleanup actions
  1. Correct project MPN to ESP32-WROOM-32E-N16 if this part is specifically the 16 MB no-PSRAM variant.
  2. Add Package or Case Code, Operating Voltage, Operating Temperature, and Implementation Details properties.
  3. Rewrite the description to a clean library-facing functional summary.
  4. Change all GND terminals from Power In to Ground.
  5. Add concise pin descriptions from the datasheet for all terminals.
  6. Add Section / Pin Group / Pin Orientation / Sub-symbol fields for the symbol.
  7. Decide how to model pin 39/EPAD: one functional schematic terminal P_GND / 39, or a fully consistent split-pad mapping across schematic and footprint.

  • Datasheet source

  • Datasheet-derived key specs

  • Current project metadata observed

  • Metadata mismatches / recommended corrections

  • Datasheet pin reference

  • Schematic symbol audit

  • Matches

  • Mismatches / missing symbol metadata

  • Footprint audit

  • Matches

  • Mismatches / items to verify

  • Suggested next cleanup actions

Documents

Assets

kicad_mod

ESP32-WROOM-32E__16MB_

XCVR_ESP32-WROOM-32E__16MB_.kicad_modFootprint
ESP32-WROOM-32E (16MB).png

ESP32-WROOM-32E (16MB).png

ESP32-WROOM-32E (16MB)Thumbnail
svg

ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_ Symbol.svgDefault
ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_.step3D Model

ESP32-WROOM-32E (16MB)

ESP32-WROOM-32E (16MB) thumbnail
The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications.
This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D.
Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash)
#module #ESP32 #16MB

Properties

ESP32-WROOM-32E__16MB_

Espressif

Integrated Circuits

documentation.espressif.com/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf

U

parametric-v1

Pricing & Availability

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