Part Information Review and Datasheet Update

Set Pin Description to "GPIO VSPI D" on IO23, Set Section to "GPIO" on IO23, and 16 more changes

Set IO23's Pin Description to "GPIO VSPI D"

Set IO23's Section to "GPIO"

Set IO23's Pin Group to "GPIO"

Set IO23's Pin Orientation to "Left"

Set IO23's Sub-symbol Designator Suffix to "GPIO"

Set GND's Pin Type to "Ground"

Set GND's Pin Description to "Ground pin 38"

Set GND's Section to "Ground"

Set GND's Pin Group to "GND_38"

Set GND's Pin Orientation to "Bottom"

Set GND's Sub-symbol Designator Suffix to "Power"

Set GND's Pin Number to "39"

Set GND's Pin Type to "Ground"

Set GND's Pin Description to "Exposed ground pad"

Set GND's Section to "Ground"

Set GND's Pin Group to "P_GND"

Set GND's Pin Orientation to "Bottom"

Set GND's Sub-symbol Designator Suffix to "Power"

Set GND's Pin Type to "Ground"

Set GND's Pin Description to "Ground pin 1"

Set GND's Section to "Ground"

Set GND's Pin Group to "GND_1"

Set GND's Pin Orientation to "Bottom"

Set GND's Sub-symbol Designator Suffix to "Power"

Set GND's Pin Type to "Ground"

Set GND's Pin Description to "Ground pin 15"

Set GND's Section to "Ground"

Set GND's Pin Group to "GND_15"

Set GND's Pin Orientation to "Bottom"

Set GND's Sub-symbol Designator Suffix to "Power"

a day

flux

0:02

Work done
  • Grouped the ESP32-WROOM-32E pins from the official datasheet into one primary function group per pin: Power/3V3, individual GND groups, Control/Boot, Analog/Touch, Clock/Crystal, GPIO, and Reserved/No Connect.
  • Updated terminal properties with Section, Pin Group, Pin Orientation, Sub-symbol Designator Suffix, and concise Pin Description; corrected GND pins to Ground type.
  • Removed duplicate exposed-pad schematic terminals so P_GND/39 is represented once.
  • Full grouping and validation details are documented in ESP32-WROOM-32E Pin Grouping.
Success criteria review
  • ✅ All datasheet pins 1–38 plus P_GND/39 are covered once.
  • ✅ Power, 3V3, individual GND, GPIO, control/boot, analog/touch, clock/crystal, and reserved pins are distinctly categorized.
  • ✅ Project terminal metadata now reflects the grouping with no duplicate pin assignments.
Next steps
  • If you want, I can next clean up the remaining visible duplicate-style labels for GND/NC terminals or proceed to footprint/EPAD mapping cleanup.
Clean labels
Clean EPAD mapping
Run ERC check
Export documentation
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ESP32-WROOM-32E Part Information Review
Datasheet source
Datasheet-derived key specs
  • Function: 2.4 GHz Wi‑Fi + Bluetooth + Bluetooth LE MCU module.
  • Core: ESP32 series SoC with Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz.
  • Memory: 448 KB ROM, 520 KB SRAM, 16 KB RTC SRAM.
  • Variant matching this project intent: ESP32-WROOM-32E-N16 = 16 MB Quad SPI flash, no PSRAM, -40 to +85 °C, 18.0 × 25.5 × 3.1 mm.
  • Interfaces/peripherals: up to 26 GPIOs; UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, IR, pulse counter, capacitive touch, ADC, DAC, TWAI/CAN-compatible.
  • Supply: recommended VDD33 = 3.0–3.6 V, typical 3.3 V; external supply should deliver at least 0.5 A.
  • Antenna: ESP32-WROOM-32E has onboard PCB antenna and requires antenna keepout on host PCB.
Current project metadata observed
  • Project name: ESP32-WROOM-32E__16MB_
  • Manufacturer Part Number: ESP32-WROOM-32E__16MB_
  • Manufacturer Name: Espressif
  • Part Type: Integrated Circuits
  • Designator Prefix: U
  • Datasheet URL: was not shown in the initial context, so it has been set to the official Espressif PDF.
  • Existing description looked malformed/incomplete: 1.4 / Espressif Systems / 3.25mm / Manufacturer Recommendations.
Metadata mismatches / recommended corrections
  1. MPN mismatch: Datasheet ordering code for the 16 MB no-PSRAM ESP32-WROOM-32E is ESP32-WROOM-32E-N16. The project currently uses ESP32-WROOM-32E__16MB_, which is not the datasheet ordering code.
  2. Part Type too generic: Integrated Circuits is acceptable but less useful than Wi-Fi/Bluetooth MCU Module or Microcontroller Module.
  3. Description should be rewritten: Recommended description: Wi‑Fi + Bluetooth MCU module, ESP32 dual-core LX6 up to 240 MHz, 16 MB flash, PCB antenna, 3.0–3.6 V, 18.0 × 25.5 × 3.1 mm.
  4. Package / case code missing: Recommended value: ESP32-WROOM-32E module, 18.0 × 25.5 × 3.1 mm, 38-pin castellated + EPAD/GND pad.
  5. Operating Voltage missing: Recommended value: 3.6 V if using the Flux numeric max recommended operating voltage convention.
  6. Operating Temperature missing: Recommended value for N16 variant: -40°C to +85°C.
Datasheet pin reference
The datasheet states the module has 38 pins in Table 3, with an additional EPAD/P_GND pad 39 shown in the peripheral schematic / pin layout.
Key pin list:
  • 1 GND — Ground
  • 2 3V3 — Power supply
  • 3 EN — Enable; must not float
  • 4 SENSOR_VP — GPIO36 / ADC1_CH0 / RTC_GPIO0
  • 5 SENSOR_VN — GPIO39 / ADC1_CH3 / RTC_GPIO3
  • 6 IO34 — GPIO34 / ADC1_CH6 / RTC_GPIO4
  • 7 IO35 — GPIO35 / ADC1_CH7 / RTC_GPIO5
  • 8 IO32 — GPIO32 / 32 kHz XTAL input / ADC1_CH4 / TOUCH9 / RTC_GPIO9
  • 9 IO33 — GPIO33 / 32 kHz XTAL output / ADC1_CH5 / TOUCH8 / RTC_GPIO8
  • 10 IO25 — GPIO25 / DAC1 / ADC2_CH8 / RTC_GPIO6 / EMAC_RXD0
  • 11 IO26 — GPIO26 / DAC2 / ADC2_CH9 / RTC_GPIO7 / EMAC_RXD1
  • 12 IO27 — GPIO27 / ADC2_CH7 / TOUCH7 / RTC_GPIO17 / EMAC_RX_DV
  • 13 IO14 — GPIO14 / ADC2_CH6 / TOUCH6 / MTMS / HSPI/SD/EMAC functions
  • 14 IO12 — GPIO12 / ADC2_CH5 / TOUCH5 / MTDI / HSPI/SD/EMAC functions
  • 15 GND — Ground
  • 16 IO13 — GPIO13 / ADC2_CH4 / TOUCH4 / MTCK / HSPI/SD/EMAC functions
  • 17–22 NC — not connected; internal flash-related chip pins are not led out
  • 23 IO15 — GPIO15 / ADC2_CH3 / TOUCH3 / MTDO / HSPICS0 / SD_CMD / EMAC_RXD3
  • 24 IO2 — GPIO2 / ADC2_CH2 / TOUCH2 / RTC_GPIO12 / HSPIWP / SD_DATA0
  • 25 IO0 — GPIO0 / ADC2_CH1 / TOUCH1 / RTC_GPIO11 / CLK_OUT1 / EMAC_TX_CLK
  • 26 IO4 — GPIO4 / ADC2_CH0 / TOUCH0 / RTC_GPIO10 / HSPIHD / SD_DATA1 / EMAC_TX_ER
  • 27 IO16 — GPIO16 / HS1_DATA4 / U2RXD / EMAC_CLK_OUT
  • 28 IO17 — GPIO17 / HS1_DATA5 / U2TXD / EMAC_CLK_OUT_180
  • 29 IO5 — GPIO5 / VSPICS0 / HS1_DATA6 / EMAC_RX_CLK
  • 30 IO18 — GPIO18 / VSPICLK / HS1_DATA7
  • 31 IO19 — GPIO19 / VSPIQ / U0CTS / EMAC_TXD0
  • 32 NC — not connected
  • 33 IO21 — GPIO21 / VSPIHD / EMAC_TX_EN
  • 34 RXD0 — GPIO3 / U0RXD / CLK_OUT2
  • 35 TXD0 — GPIO1 / U0TXD / CLK_OUT3 / EMAC_RXD2
  • 36 IO22 — GPIO22 / VSPIWP / U0RTS / EMAC_TXD1
  • 37 IO23 — GPIO23 / VSPID / HS1_STROBE
  • 38 GND — Ground
  • 39 P_GND / EPAD — optional soldered ground pad shown in peripheral schematic; soldering is not required, and excessive paste can impair edge-pad soldering.
Schematic symbol audit
Matches
  • Pins 1–38 are present with the correct visible names and pin numbers.
  • NC pins 17–22 and 32 are represented as not connected.
  • Input-only pins SENSOR_VP, SENSOR_VN, IO34, and IO35 are set as Input.
  • Most GPIO pins are set as Bi-Directional.
Mismatches / missing symbol metadata
  1. GND pin type is wrong: GND terminals are set to Power In; they should be Ground.
  2. Pin descriptions are missing: terminals currently only have Pin Number / Pin Type / Designator Prefix; the datasheet functions are not captured as Pin Description.
  3. Section / Pin Group / Pin Orientation / Sub-symbol Designator Suffix are missing for this >20-pin IC-style module.
  4. IO16 note not represented: datasheet says IO16 cannot be used for other functions on PSRAM variants; for the N16 no-PSRAM variant this is okay, but the note is important if the same part is reused for N16R2.
  5. EPAD/P_GND representation is inconsistent: schematic has multiple GND terminal elements with pin numbers 39_1 through 39_9, while the datasheet shows one functional pad 39 / P_GND. This should be reviewed. A footprint may split EPAD copper into multiple pads, but the schematic symbol should ideally expose a single EPAD/P_GND terminal or consistently map all split pads to the same ground function.
Footprint audit
Matches
  • The footprint has pads for pins 1–38 matching the ESP32-WROOM-32E module pins.
  • The footprint includes an antenna marking/area, which is appropriate for the ESP32-WROOM-32E PCB antenna version.
  • The footprint includes additional GND/mount pads corresponding to the EPAD / thermal ground pad region.
Mismatches / items to verify
  1. EPAD split pad mapping: layout contains mount pads 39_10 through 39_21, while schematic contains only 39_1 through 39_9 split GND terminals. This suggests not all footprint split pads have corresponding schematic terminals, or the split-pad strategy is inconsistent.
  2. Pin 39 naming: datasheet schematic names this as P_GND / pin 39. Current split names 39_1...39_21 should be verified against Flux footprint-to-symbol mapping expectations.
  3. Antenna keepout: footprint marks ANTENNA, but the datasheet requires host-board keepout/placement care. Verify that the actual reusable footprint/part carries enough information/rules/notes so downstream board designs do not place copper or components under the antenna region.
Suggested next cleanup actions
  1. Correct project MPN to ESP32-WROOM-32E-N16 if this part is specifically the 16 MB no-PSRAM variant.
  2. Add Package or Case Code, Operating Voltage, Operating Temperature, and Implementation Details properties.
  3. Rewrite the description to a clean library-facing functional summary.
  4. Change all GND terminals from Power In to Ground.
  5. Add concise pin descriptions from the datasheet for all terminals.
  6. Add Section / Pin Group / Pin Orientation / Sub-symbol fields for the symbol.
  7. Decide how to model pin 39/EPAD: one functional schematic terminal P_GND / 39, or a fully consistent split-pad mapping across schematic and footprint.

    Datasheet source

    Datasheet-derived key specs

    Current project metadata observed

    Metadata mismatches / recommended corrections

    Datasheet pin reference

    Schematic symbol audit

    Matches

    Mismatches / missing symbol metadata

    Footprint audit

    Matches

    Mismatches / items to verify

    Suggested next cleanup actions

Documents

    ESP32-WROOM-32E Part Information Review

    ESP32-WROOM-32E Pin Grouping

Assets

kicad_mod

ESP32-WROOM-32E__16MB_

XCVR_ESP32-WROOM-32E__16MB_.kicad_modFootprint
ESP32-WROOM-32E (16MB).png

ESP32-WROOM-32E (16MB).png

ESP32-WROOM-32E (16MB)Thumbnail
ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_ Symbol.svgDefault
step

ESP32-WROOM-32E__16MB_

ESP32-WROOM-32E__16MB_.step3D Model

ESP32-WROOM-32E (16MB)

ESP32-WROOM-32E (16MB) thumbnail
The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications.
This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D.
Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash)
#module #ESP32 #16MB

Properties

ESP32-WROOM-32E__16MB_

Espressif

Integrated Circuits

documentation.espressif.com/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf

U

parametric-v1

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