Part Datasheet Review and Updates

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

Worked for 2 mins 23 sec

flux

I reviewed the part against TI’s official DS90UB953-Q1 information; the Datasheet URL was already set, so I did not change it. The pin names/count mostly match, but I flagged property/metadata issues including EPAD typed as unspecified, RES1 typed as input, I²C pins typed as output, LPF pins unspecified, and missing richer part properties/descriptions. Full review is in DS90UB953TRHBRQ1 Part Datasheet Review.

adrian95

Looking at the datasheet of this component, can you group together pins by their functions? for example for Power, VDD etc NOTE: If you group them, can you not add the same pin if you already added them in a group? You should know which pin function is common for its function

Worked for 2 mins 30 sec

flux

I grouped every DS90UB953-Q1 terminal into exactly one functional group: Power, Ground/Thermal, MIPI CSI-2 Input, FPD-Link III, I²C, GPIO, Clock, Control, Loop Filter, and Reserved. I also flagged current property fixes like EPAD → Ground and I2C_SDA/SCL → Bi-Directional; full details are in DS90UB953-Q1 Pin Functional Groups.

Fix pin metadata

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Symbol grouping plan

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DS90UB953TRHBRQ1 Part Datasheet Review

Scope

Reviewed available Flux part information for DS90UB953TRHBRQ1 against the official Texas Instruments information and datasheet found at:

Project Datasheet URL property: https://www.ti.com/lit/gpn/ds90ub953-q1
Official TI PDF found during review: https://www.ti.com/lit/ds/symlink/ds90ub953-q1.pdf
TI part page: https://www.ti.com/product/DS90UB953-Q1/part-details/DS90UB953TRHBRQ1

Because a Datasheet URL was already set, I did not update the project property.

Current Flux Part Information

Project-level metadata

Project name: DS90UB953TRHBRQ1
Description currently set to: DS90UB953TRHBRQ1 / RHB32_TEX
Manufacturer Part Number: DS90UB953TRHBRQ1
Manufacturer Name: Texas Instruments
Designator Prefix: U
Datasheet URL: https://www.ti.com/lit/gpn/ds90ub953-q1

Assets / package data

3D model asset: RHB0032P.stp
Symbol asset: DS90UB953TRHBRQ1 DS90UB953TRHBRQ1_0_1 Symbol.svg
Footprint asset: RHB32_TEX.kicad_mod

Schematic terminals found

The schematic contains 33 terminal components: pins 1–32 plus EPAD with Pin Number 33.

Datasheet / Official TI Information

Part identity

Manufacturer: Texas Instruments
Part family: DS90UB953-Q1
Orderable MPN reviewed: DS90UB953TRHBRQ1
Function: FPD-Link III serializer with MIPI CSI-2 input interface for cameras, RADAR, and other sensors
Package: VQFN (RHB), 32 pins, 5.00 mm × 5.00 mm
Temperature range from TI part page: –40°C to 105°C
Key interface notes from TI information:
- CSI-2 input up to 4 lanes
- 4.16 Gbps FPD-Link III forward channel
- Single 1.8 V supply family according to TI summary

Pin Cross-check

Table

Pin	Datasheet / TI name	Flux terminal	Status	Notes
1	CSI_D1P	CSI_D1P	Match	CSI-2 data input
2	CSI_D1N	CSI_D1N	Match	CSI-2 data input
3	CSI_D0P	CSI_D0P	Match	CSI-2 data input
4	CSI_D0N	CSI_D0N	Match	CSI-2 data input
5	CSI_CLKP	CSI_CLKP	Match	CSI-2 clock input
6	CSI_CLKN	CSI_CLKN	Match	CSI-2 clock input
7	RES0	RES0	Match, property review needed	Reserved; TI notes connect to GND
8	PDB	PDB	Match	Power-down inverted input; not 3.3 V tolerant
9	LPF1	LPF1	Match, property mismatch	Existing Pin Type is `Unspecified`; should not remain unspecified
10	VDDPLL_CAP	VDDPLL_CAP	Match, property review needed	Internal regulator decoupling-cap connection
11	VDDPLL	VDDPLL	Match	1.8 V analog PLL supply
12	LPF2	LPF2	Match, property mismatch	Existing Pin Type is `Unspecified`; should not remain unspecified
13	DOUT-	DOUT-	Match	FPD-Link III I/O, AC-coupled
14	DOUT+	DOUT+	Match	FPD-Link III I/O, AC-coupled
15	VDDDRV_CAP	VDDDRV_CAP	Match, property review needed	Internal regulator decoupling-cap connection
16	VDDDRV	VDDDRV	Match	1.8 V analog supply
17	GPIO_0	GPIO_0	Match	GPIO / voltage-sense capable
18	GPIO_1	GPIO_1	Match	GPIO / voltage-sense capable
19	CLK_OUT/IDX	CLK_OUT/IDX	Match	I2C address / strap at startup, then CLK_OUT
20	CLKIN	CLKIN	Match	Reference clock input; may be open if unused
21	MODE	MODE	Match	Mode-select strap input
22	RES1	RES1	Match, property mismatch	TI notes reserved / do not connect / leave floating; existing Pin Type is `Input`
23	I2C_SDA	I2C_SDA	Match, property mismatch	I²C data, open-drain; existing Pin Type is `Output`
24	I2C_SCL	I2C_SCL	Match, property mismatch	I²C clock, open-drain; existing Pin Type is `Output`
25	VDDD	VDDD	Match	1.8 V digital supply
26	VDDD_CAP	VDDD_CAP	Match, property review needed	Internal regulator decoupling-cap connection
27	GPIO_2	GPIO_2	Match	GPIO
28	GPIO_3	GPIO_3	Match	GPIO
29	CSI_D3P	CSI_D3P	Match	CSI-2 data input
30	CSI_D3N	CSI_D3N	Match	CSI-2 data input
31	CSI_D2P	CSI_D2P	Match	CSI-2 data input
32	CSI_D2N	CSI_D2N	Match	CSI-2 data input
DAP / exposed pad	GND / exposed thermal pad	EPAD, Pin Number `33`	Functional mismatch	EPAD should be treated as ground / exposed pad. Datasheet names it DAP/GND rather than a normal numbered pin.

Footprint Cross-check

Footprint asset name RHB32_TEX.kicad_mod is consistent with the TI RHB 32-pin VQFN package family.
Layout tree shows pads corresponding to all 32 named pins plus EPAD.
The 3D model asset RHB0032P.stp is consistent with the RHB0032 package naming.
I could not fully verify pad geometry, pitch, exposed pad dimensions, or courtyard dimensions from the current layout tool output because the detailed pad dimensions were not exposed in the retrieved PCB node data.

Key Mismatches / Gaps Flagged

Project description is not library-quality
- Current: DS90UB953TRHBRQ1 / RHB32_TEX
- Recommended: a functional description such as: FPD-Link III serializer with 4-lane MIPI CSI-2 input, 4.16Gbps link, RHB-32 VQFN.
Missing or incomplete project properties
- Recommended additions if you want the part metadata completed:
  - Part Type: Serializer / Interface IC
  - Package or Case Code: VQFN-32 / RHB, 5 mm × 5 mm
  - Operating Voltage: 1.8 V
  - Operating Temperature: -40°C to +105°C
EPAD pin type mismatch
- Existing: EPAD, Pin Number 33, Pin Type Unspecified
- Datasheet: exposed thermal pad / DAP tied to ground
- Recommended: Pin Type Ground, description Exposed thermal pad, and consider whether Pin Number should remain 33 or use DAP depending on Flux part convention.
Reserved / no-connect pin mismatch
- RES1 is currently Input; TI notes it as reserved / do not connect / leave floating.
- Recommended: change Pin Type to Not Connected or equivalent, with description Reserved, leave floating.
Open-drain I²C pins typed as Output
- I2C_SDA and I2C_SCL are currently Output.
- Because these are I²C open-drain pins, a better Flux type would be Bi-Directional or Open Collector if supported by the part style.
LPF pins are unspecified
- LPF1 and LPF2 are currently Unspecified.
- They should have explicit functional descriptions such as loop-filter pins. Pin Type should be reviewed; Passive is likely more useful than Unspecified for schematic clarity.
Internal regulator capacitor pins may need clearer typing
- VDDPLL_CAP, VDDDRV_CAP, and VDDD_CAP are currently Power In.
- Datasheet describes them as internal regulator decoupling-capacitor connections. They should at least have explicit pin descriptions; their Pin Type may be better as Passive or a regulator-related power node depending on Flux ERC behavior.
Missing pin descriptions / sections / groups
- Existing terminals mostly contain Pin Number and Pin Type only.
- For a 33-terminal IC-style part, the terminals would benefit from Pin Description, Section, Pin Group, and Pin Orientation metadata.

Overall Result

Pin names/count: Good — all 32 package pins plus exposed pad are represented.
Footprint/package naming: Likely correct for RHB32, but geometry was not fully verified from available layout data.
Main issues: Metadata completeness and several terminal property mismatches, especially EPAD, RES1, I²C open-drain pins, LPF pins, and internal regulator capacitor pins.

Scope
Current Flux Part Information
Project-level metadata
Assets / package data
Schematic terminals found
Datasheet / Official TI Information
Part identity
Pin Cross-check
Footprint Cross-check
Key Mismatches / Gaps Flagged
Overall Result

Reviews

Documents

DS90UB953TRHBRQ1 Part Datasheet Review
DS90UB953-Q1 Pin Functional Groups

Assets

DS90UB953-Q1-thumb.png

DS90UB953-Q1-thumbThumbnail

stp

DS90UB953TRHBRQ1

RHB0032P.stp3D Model

DS90UB953TRHBRQ1

DS90UB953TRHBRQ1 DS90UB953TRHBRQ1_0_1 Symbol.svgDefault

kicad_mod

DS90UB953TRHBRQ1

RHB32_TEX.kicad_modFootprint

Project Name

DS90UB953-Q1

Description

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar

The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications.

Functional Description

The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation.

Electrical Characteristics

The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication.

Mechanical Characteristics

The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems.

Environmental Characteristics

The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components.

Materials and Construction

The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.

Properties

Manufac… Number

DS90UB953-Q1

Manufac…er Name

Texas Instruments

Part Type

Integrated Circuit

Datasheet URL

ti.com/lit/gpn/ds90ub953-q1

Designator Prefix

License

creativecommons.org/licenses/by/4.0/

Symbol Style

parametric-v1

Pricing & Availability

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adrian95 / DS90UB953-Q1

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