Part Review and Datasheet Verification

Current terminals are still unspecified; I’m applying the datasheet-derived metadata now.
Metadata and the three safe terminal names are updated; I’m running the part review checks now.
Updated all 28 terminals with datasheet-derived Pin Type and short Pin Description values, and normalized ENV_SCL_, SA0/H_MOSI_, and H_SDA/H_MISO/TX_ by removing trailing underscores.
Open items:
  • Part review checks were queried after the update, but no component review check entries were returned for this part project.
  • I verified directly in the schematic that the updated pin metadata and normalized names are present.
Suggested next steps:
  1. If you want, I can also update the earlier bno085-part-review document with the completed fixes.
  2. Run a visual footprint/land-pattern check against the datasheet package drawing.
Update docs and verify
Update review document
Check footprint geometry
Run all checks
Improve part properties
ENV_SDA
Pin Number
16
BOOTN
Pin Number
4
H_SDA/H_MISO/TX
Pin Number
20
H_INTN
Pin Number
14
VDD
Pin Number
3
PS1
Pin Number
5
RESV_NC_9
Pin Number
24
H_SCL/SCK/RX
Pin Number
19
CAP
Pin Number
9
RESV_NC_4
Pin Number
12
SA0/H_MOSI
Pin Number
17
RESV_NC_5
Pin Number
13
RESV_NC_7
Pin Number
22
GND_2
Pin Number
25
RESV_NC_2
Pin Number
7
H_CSN
Pin Number
18
CLKSEL0
Pin Number
10
XIN32
Pin Number
27
ENV_SCL
Pin Number
15
NRST
Pin Number
11
RESV_NC_6
Pin Number
21
RESV_NC_3
Pin Number
8
PS0/WAKE
Pin Number
6
RESV_NC_1
Pin Number
1
GND_1
Pin Number
2
VDDIO
Pin Number
28
RESV_NC_8
Pin Number
23
XOUT32/CLKSEL1
Pin Number
26

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BNO085 Part Review
Reviewed project part data
Project: BNO085 jEhG
Published Part UID: e53be3b8-8326-46cb-aca8-8277dfcc8424
Current project properties:
BOM status: no BOM items are present because this is a published part project made from terminal/pad definitions rather than a board assembly.
Official datasheet source
The Datasheet URL was already set. I verified it points to the official CEVA BNO08X/BNO080/BNO085 datasheet PDF, so no property update was required.
Key datasheet specs
  • Device family: BNO08X, including BNO085/BNO086
  • Function: 9-axis SiP IMU with accelerometer, gyroscope, magnetometer, ARM Cortex-M0+, and CEVA SH-2 firmware
  • Package: 28-pin Land Grid Array (LGA)
  • Dimensions: 3.8 mm × 5.2 mm × 1.1 mm
  • VDD: 2.4 V to 3.6 V sensor supply
  • VDDIO: 1.7 V to 3.6 V digital/core I/O supply; pin table also describes 1.65 V to 3.6 V
  • Operating temperature: -40 °C to +85 °C
  • Host interfaces: I²C, SPI, UART, UART-RVC
  • I²C: 7-bit address 0x4A/0x4B selected by SA0, up to 400 kHz
  • SPI: 4-wire slave, mode 3 / CPOL=1, CPHA=1, listed clock frequency 3 MHz
  • UART-SHTP: 3 Mbit/s, 8 data bits, 1 stop bit, no parity
  • CAP pin: external 100 nF to GND
  • 32 kHz clock option: external 32.768 kHz clock/crystal on XIN32/XOUT32; CEVA recommends 50 ppm tolerance and 12.5 pF load crystal
  • Typical BNO085 6/9-axis sensor fusion at 100 Hz: VDDIO 3.50 mA, VDD 7.50 mA, total 35.25 mW
Datasheet pin table cross-check

Table


PinDatasheet name / functionProject terminalResult
1RESV_NC, no connectRESV_NC_1Match
2GNDGND_1Match
3VDDVDDMatch
4BOOTNBOOTNMatch
5PS1PS1Match
6PS0/WAKEPS0/WAKEMatch
7RESV_NC, no connectRESV_NC_2Match
8RESV_NC, no connectRESV_NC_3Match
9CAP, 100 nF to GNDCAPMatch
10CLKSEL0CLKSEL0Match
11NRSTNRSTMatch
12RESV_NC, no connectRESV_NC_4Match
13RESV_NC, no connectRESV_NC_5Match
14H_INTNH_INTNMatch
15ENV_SCLENV_SCL_Minor naming mismatch: trailing underscore
16ENV_SDAENV_SDAMatch
17SA0/H_MOSISA0/H_MOSI_Minor naming mismatch: trailing underscore
18H_CSNH_CSNMatch
19H_SCL/SCK/RXH_SCL/SCK/RXMatch
20H_SDA/H_MISO/TXH_SDA/H_MISO/TX_Minor naming mismatch: trailing underscore
21RESV_NC, no connectRESV_NC_6Match
22RESV_NC, no connectRESV_NC_7Match
23RESV_NC, no connectRESV_NC_8Match
24RESV_NC, no connectRESV_NC_9Match
25GNDGND_2Match
26XOUT32/CLKSEL1XOUT32/CLKSEL1Match
27XIN32XIN32Match
28VDDIOVDDIOMatch
Symbol and pin-description findings
  • Pin count is correct at 28 terminals.
  • Pin numbering aligns with the datasheet for all 28 pins.
  • Terminal names mostly match the datasheet.
  • Minor naming mismatches: ENV_SCL_, SA0/H_MOSI_, and H_SDA/H_MISO/TX_ include a trailing underscore not present in the datasheet names. This may be intentional Flux naming to avoid syntax/special-character conflicts, but it is not exact datasheet text.
  • All terminal Pin Type properties are currently Unspecified. The datasheet provides electrical direction/type information, so pin types could be improved:
    • Inputs: VDD, VDDIO, GND, BOOTN, PS1, PS0/WAKE, CLKSEL0, NRST, SA0/H_MOSI, H_CSN, XIN32
    • Outputs: H_INTN, XOUT32/CLKSEL1
    • Bidirectional: ENV_SCL, ENV_SDA, H_SCL/SCK/RX, H_SDA/H_MISO/TX
    • NC: RESV_NC pins
  • Pin descriptions are not populated as explicit Pin Description properties on the terminals; adding them would make the part easier to audit and use.
Footprint findings
  • Layout has 28 pad nodes, matching the 28-pin LGA package.
  • The footprint is named as the default footprint for the published part and includes fab/silk/text shapes.
  • The current layout inspection did not expose pad geometry, pitch, or body dimensions, so I could verify pad count but not fully validate the land pattern dimensions against the datasheet package drawing.
Mismatches / open issues
  1. Pin Type properties are all Unspecified — should be updated to match datasheet direction/type.
  2. Pin Description properties are absent — recommended to add datasheet-based descriptions for each terminal.
  3. Minor terminal-name differences — trailing underscores on pins 15, 17, and 20.
  4. Footprint geometry not fully verifiable from available layout output — pad count matches; mechanical dimensions/land pattern should be checked visually or with a footprint geometry export if available.
Recommendation
The part is broadly correct for MPN, manufacturer, datasheet URL, 28-pin LGA pin count, and pin-number mapping. The next quality step is to enrich the terminal metadata with datasheet-based Pin Type, Pin Description, and possibly normalized pin names if Flux allows those names without syntax issues.
  • Reviewed project part data

  • Official datasheet source

  • Key datasheet specs

  • Datasheet pin table cross-check

  • Symbol and pin-description findings

  • Footprint findings

  • Mismatches / open issues

  • Recommendation

Documents

  • BNO085 Part Review

Assets

kicad_mod

BNO085

BNO085.kicad_modFootprint
BNO085

BNO085

BNO085 Symbol.svgDefault
BNO085-thumb.png

BNO085-thumb.png

BNO085-thumbThumbnail
stp

BNO085

BNO085.stp3D Model

BNO085

BNO085 thumbnail
Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output
The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications.
Key Features
9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries
Applications
Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems

Properties

BNO085

CEVA

Sensor

U

parametric-v1

Pricing & Availability

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