SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II
The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering.
As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years.
The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller.
Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components.
Spec Sheet
Identification
Part Number: AS4C32M16SB-7TCN
Device Family: AS4C32M16SB
Manufacturer: Alliance Memory, Inc.
Die Revision: B-die
Functional Classification
Device Type: Synchronous DRAM (SDR SDRAM)
Memory Organization: Multi-bank array architecture
Interface Type: Parallel, clock-synchronous command interface
Refresh Capability: Supports auto-refresh and self-refresh modes
Electrical Characteristics
Supply Voltage: Standard 3.3V-class SDRAM supply rating
Clock Frequency: Mid-range SDR SDRAM clock speed class
Access Timing: Standard SDR SDRAM access time class for its speed grade
Environmental & Qualification
Temperature Grade: Commercial ("C" suffix designation)
RoHS Compliance: Yes
Product Positioning: Long-lifecycle, drop-in replacement memory device
Package
Package Type: Thin Small Outline Package, TSOP-II style
Mounting: Surface mount technology (SMT)
Packaging Format
Supply Format: Tray packaging
