Part Data Review and Validation

flux

0:58

Evalu.

Analyzing the schematic.

Reviewing the bill of materials.

Analyzing the PCB layout.

Looking for "part description, ordering information, package type, package designation, and pin count" in datasheet

Looking for "special features and product highlights" in datasheet

Looking for "absolute maximum ratings" in datasheet

Looking for "recommended operating conditions" in datasheet

Looking for "electrical characteristics" in datasheet

Looking for "pin configuration and function descriptions" in datasheet

Looking for "package information mechanical dimensions for the BCPZ package" in datasheet

Assess.

Review.

I reviewed the part project end-to-end.
Step 1-2 status
  • The part already has a datasheet URL set in project properties: Datasheet
  • Because a datasheet URL was already present, there was no need to search the web or update properties.
Part metadata summary

Project metadata

FieldValue
DescriptionSingle-Ended Input, Quad, Simultaneous Sampling, 16-Bit/14-Bit/12-Bit, SAR ADC
ManufacturerAnalog Devices
MPNAD7386-4BCPZ
DatasheetDatasheet

Datasheet package / ordering metadata

FieldValue
FamilyAD7386-4 / AD7387-4 / AD7388-4
Orderable partAD7386-4BCPZ
Other order codesAD7386-4BCPZ-RL, AD7386-4BCPZ-RL7
Package24-lead LFCSP
Package designationCP-24-25
Body size4 mm x 4 mm
Package height0.55 mm nominal, 0.60 mm max
Lead pitch0.50 mm BSC
Exposed padPresent, must be connected to GND
Electrical summary

Special features

FeatureValue
ADC typeQuad simultaneous-sampling SAR ADC
Input typeSingle-ended analog inputs
Resolution family16-bit / 14-bit / 12-bit
Max throughput4 MSPS
OversamplingOn-chip oversampling, 2-bit resolution boost
AlertOut-of-range indicator
Reference2.5 V internal reference available
Logic interface supplySeparate logic supply supports 1.65 V to 3.6 V
Temperature range-40 C to +125 C

Recommended operating conditions

ParameterValue
VCC3.0 V to 3.6 V
VLOGIC1.65 V to 3.6 V
External VREF at REFIO2.5 V to 3.3 V
Sample rateUp to 4 MSPS
Ambient temperature-40 C to +125 C

Absolute maximum ratings

ParameterRating
VCC to GND-0.3 V to +4 V
VLOGIC to GND-0.3 V to +4 V
Analog input to GND-0.3 V to VREF + 0.3 V, or VCC + 0.3 V
Digital input to GND-0.3 V to VLOGIC + 0.3 V
Digital output to GND-0.3 V to VLOGIC + 0.3 V
REFIO to GND-0.3 V to VCC + 0.3 V
Input current except supplies+-10 mA
Operating temperature-40 C to +125 C
Storage temperature-65 C to +150 C
Max junction temperature150 C
Pb-free reflow260 C

Key electrical characteristics from the datasheet

ParameterValue
Resolution16 bits
Conversion rate, single-channel pair4 MSPS typ
Conversion rate, alternating channels2 MSPS typ
No missing codes16 bits
DNL-0.99 / +-0.6 / +1.0 LSB
INL, external reference-7 / +-4 / +7 LSB
INL, internal reference+-3 LSB typ
Gain error, external reference 3.3 V-0.08 / +-0.005 / +0.08 % FS
Offset error, external reference-1 / +-0.07 / +0.1 mV
Dynamic range, VREF = 3.3 V86 dB typ
SNR, VREF = 3.3 V84.7 dB typ
SNR, VREF = 2.5 V internal81.7 dB typ
SNR with OSR = 892 dB typ
SFDR-103 dB typ
THD-100 dB typ
SINAD, VREF = 3.3 V84.5 dB typ
IVCC normal mode45 mA typ
Total power dissipation191 mW typ
Pin description summary

Datasheet pin map

PinNameDatasheet function
1, 5, 14, 16GNDGround reference points
2VLOGICLogic supply, decouple to GND with 1 uF
3REGCAPInternal regulator decoupling, 1 uF to GND, 1.9 V typ
4VCCMain supply, decouple to GND with 1 uF
6, 7AIND1, AIND0ADC D analog inputs
8, 9AINC1, AINC0ADC C analog inputs
10, 11AINB1, AINB0ADC B analog inputs
12, 13AINA1, AINA0ADC A analog inputs
15REFCAPBand-gap reference decoupling, 0.1 uF to GND, 2.5 V typ
17REFIOReference input/output, 2.5 V to 3.3 V external reference allowed, 1 uF decoupling required
18CSActive-low chip select
19SDOASerial data output A
20SDOBSerial data output B
21SDISerial data input
22SCLKSerial clock input
23SDOCSerial data output C
24SDOD/ALERTSerial data output D or alert output
EPADExposed padMust be connected to GND
Package dimensions

Mechanical data

ParameterValue
Package codeCP-24-25
Package style24-Lead LFCSP
Body4.10 / 4.00 / 3.90 mm square
Height0.60 / 0.55 / 0.50 mm
Lead pitch0.50 mm BSC
Terminal width0.30 / 0.25 / 0.20 mm
Exposed pad size0.60 / 0.50 / 0.40 mm square
Coplanarity0.08 mm
Cross-check: symbol and footprint vs datasheet

What matches

CheckResultNotes
MPNPassProject MPN matches datasheet orderable part
Package familyPassFootprint is a 4 mm x 4 mm, 0.50 mm pitch 24-lead QFN/LFCSP style with center pad
Lead countPassDatasheet says 24 leads plus exposed pad; project footprint has 25 pads total
Pin numberingPassSymbol pin numbers 1-25 align with footprint pad numbering 1-25
Signal namingPassSignal names align with datasheet names
Center pad presencePassFootprint includes pad 25 for the exposed pad

Issues and risks

SeverityFindingWhy it matters
MediumThe exposed pad is represented as pin 25 named GND_5 instead of EPADElectrically this is likely fine if tied to ground, but it is semantically different from the datasheet and can confuse users, reviews, and reuse of the part
MediumAll symbol pins are typed as UnspecifiedThis will not break fabrication directly, but it weakens ERC and can hide connection mistakes in downstream designs
LowFootprint asset name is generic QFN-style (QFN50P400X400X60-25N-D) while datasheet package is LFCSP CP-24-25Geometry appears consistent, so this is not an immediate failure risk, but package naming mismatch can cause ordering/review confusion if someone assumes strict package naming
LowI could not verify paste-mask segmentation, courtyard policy, or assembly land pattern intent beyond the raw footprint definition returnedThese details can affect assembly yield on small exposed-pad packages, though no obvious fatal mismatch was visible
Bottom line
  • No obvious fatal symbol-to-footprint mismatch was found.
  • The part appears largely consistent with the datasheet for:
    • AD7386-4BCPZ
    • 24-lead 4 mm x 4 mm LFCSP
    • 0.50 mm pitch
    • exposed pad present
  • The main cleanup item is to rename/document pin 25 as the exposed pad function and assign proper pin electrical types.

Highest-priority corrections

PriorityRecommended correction
1Rename or document pad/pin 25 explicitly as EPAD/GND
2Set correct pin types for supplies, grounds, inputs, outputs, and digital pins
3Optionally align package naming in properties with CP-24-25, 24-lead LFCSP to reduce ambiguity
If you want, I can next turn this into a concise part QA checklist or a fix list for the part definition.
Create fix list
Run part review
Check footprint details
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    stp

    AD7386-4BCPZ

    AD7386-4BCPZ.stp3D Model
    AD7386-4BCPZ

    AD7386-4BCPZ

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    kicad_mod

    AD7386-4BCPZ

    QFN50P400X400X60-25N-D.kicad_modFootprint

    AD7386-4BCPZ

    AD7386-4BCPZ thumbnail
    16 Bit Analog to Digital Converter 8 Input 4 SAR 24-LFCSP (4x4) #CommonPartsLibrary #IntegratedCircuit #ADC

    Properties

    AD7386-4BCPZ

    Analog Devices

    Integrated Circuit

    analog.com/AD7386-4/datasheet

    IC

    creativecommons.org/licenses/by/4.0/

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