Part Data Review and Verification
Thought for 2 mins 23 sec
Part audit: Molex 5051102091
1) Available part information
2) Datasheet URL check
Electrical characteristics
Absolute maximum ratings
Materials and plating
Pin / terminal description
Package / recommended PCB layout dimensions
4) Symbol and footprint cross-check
Cross-check results
Issues that could matter
Table
| Field | Value |
|---|---|
| Manufacturer | Molex |
| MPN | 5051102091 |
| Part type | Connector |
| Project description | Easy-On FFC/FPC Connector, 0.50 mm pitch, FD19 series, right-angle, bottom contact, 1.90 mm height, 20 circuits, gold over nickel plating |
| Designator prefix | J |
| Schematic symbol contents | 20 signal terminals + 2 fitting-nail terminals |
| Footprint contents | 20 signal pads + 2 mounting/fitting-nail pads |
| 3D model asset | 5051102091.stp |
| Footprint asset | 5051102091.kicad_mod |
The part already has an official Molex datasheet URL set in project properties:
Because a valid official URL is already present, no web lookup or replacement was needed.
3) Datasheet metadata summary
Overview
Table
| Item | Datasheet value |
|---|---|
| Series | FD19 / 505110 |
| Connector type | Easy-On FFC/FPC connector |
| Circuits | 20 |
| Pitch | 0.50 mm |
| Orientation | Right-angle |
| Contact position | Bottom contact |
| Mated height | 1.90 mm |
| Packaging | Embossed package |
| Compliance/features | RoHS, halogen free, locking actuator |
Table
| Parameter | Datasheet value |
|---|---|
| Current rating | 0.5 A |
| Voltage rating | 50 V |
| Contact resistance | 40 mΩ max |
| Insulation resistance | 100 MΩ min |
| Dielectric withstanding voltage | 250 V AC for 1 minute |
This connector datasheet does not present a semiconductor-style Absolute Maximum Ratings table. The relevant published limits are the connector ratings above plus temperature/mechanical limits below.
Recommended operating conditions / use conditions
Table
| Parameter | Datasheet value |
|---|---|
| Operating temperature | -40 C to +105 C |
| Applicable FPC/FFC thickness | 0.30 mm +0.04 / -0.03 |
| Also seen in series drawing | 0.30 mm +0.04 / -0.03 to 0.35 mm +0.04 / -0.03 |
| Recommended base film thickness | 25 um |
| Recommended conductor thickness | 35 um or 50 um |
| Mating cycles | 20 cycles |
Table
| Item | Datasheet value |
|---|---|
| Housing | LCP, glass filled, UL94V-0, beige |
| Actuator | PA, glass filled, UL94V-0, black |
| Terminal material | Phosphor bronze |
| Fitting nail material | Phosphor bronze |
| Contact area plating | Gold, 0.05 um minimum |
| Solder tail plating | Gold |
| Terminal underplate | Nickel, 1.0 um minimum |
| Fitting nail plating | Tin, 1.0 um minimum |
| Fitting nail underplate | Nickel, 1.0 um minimum |
Table
| Item | Datasheet finding |
|---|---|
| Signal contacts | 20 signal contacts |
| Mechanical tabs | 2 fitting nails / mounting pads |
| Numbering | Single row of 20 contacts plus 2 fitting nails |
| Pin 1 orientation | Not cleanly recoverable from text extraction alone |
The official drawing text extraction is incomplete, but the following values were recoverable for the 20-circuit 5051102091 variant:
Table
| Category | Datasheet value |
|---|---|
| Recommended PCB layout A | 10.5 mm |
| Recommended PCB layout B | 13.1 mm |
| Recommended PCB layout C | 9.5 mm |
| Recommended PCB layout D | 14.7 mm |
| Embossed package A | 10.9 mm |
| Embossed package B | 14.9 mm |
| Embossed package C | 16 mm |
| Pitch | 0.50 ±0.05 mm |
Table
| Check | Result | Notes |
|---|---|---|
| Contact count | Pass | Symbol and footprint both represent 20 contacts. |
| Fitting nails / mounting pads | Pass | Symbol includes 2 fitting-nail terminals and footprint includes 2 larger pads. |
| Pitch consistency | Pass | Footprint uses 0.50 mm contact spacing, matching the datasheet. |
| Bottom-contact / right-angle type | Pass | Project metadata matches datasheet description. |
| Height / product family | Pass | Project description matches the Molex part overview. |
| Footprint pad topology | Pass | Single fine-pitch signal row plus two larger mechanical pads is consistent with the datasheet. |
| Pin numbering orientation | Needs manual visual check | I could not conclusively verify pin 1 left/right orientation from machine-extracted drawing text alone. This is the main residual risk. |
| Plating metadata wording | Minor metadata mismatch | Project description says gold over nickel plating, but the drawing is more specific: fitting nails are tin over nickel, while signal contacts are gold over nickel. Not a footprint failure, but metadata could be more precise. |
-
Highest-risk item: contact numbering orientation.
If the footprint is mirrored relative to the official Molex drawing, the cable pinout would be reversed even though pad count and pitch are correct. That can cause:- incorrect board function
- apparent assembly success but electrical failure
- wrong mating orientation in-system
-
Minor documentation issue: plating description is simplified in the project metadata.
That is unlikely to cause board failure, but it could cause ordering ambiguity if this part project is reused downstream as a purchasing reference.
- The part project looks mostly consistent with the Molex documentation.
- I do not see an obvious count, pitch, or mounting-pad mismatch that would immediately cause a manufacturing failure.
- The one item I would still treat as must-verify is the pin 1 / contact-row orientation against the official drawing image, because that is the classic failure mode for bottom-contact FFC connectors.
If you want, I can continue with a stricter follow-up pass focused only on the pin-1 orientation and footprint mirroring risk.
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