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2452796-1 Part Review

Source status

Project MPN: 2452796-1
Manufacturer: TE Connectivity
Existing project Datasheet URL before review: Mouser-hosted PDF ENG_CD_2390874_A1-3395045.pdf
Issue found: that PDF extraction identifies TE Connectivity 9-2390874-4, not 2452796-1.
Correct official source used for review: TE Connectivity customer drawing C-2452796 Rev C, NANO SIM CARD CONNECTOR — HINGE TYPE.
I updated the project Datasheet URL property to the official TE customer drawing URL.

Key specs from official TE drawing

Table

Item	Datasheet value
Manufacturer	TE Connectivity
MPN	2452796-1
Title / description	Nano SIM card connector — hinge type
Card type	Nano SIM / 4FF
Product spec referenced	108-140327
Units	mm
Connector terminal count shown	10 total land pads/terminals
SIM contacts	C1, C2, C3, C5, C6, C7
Card detect	SW, with C5/GND as the other switch side
Ground / shell pads	Nos. 8–10 = GND
Switch function	Without card: open; card inserted: closed
Contact pitch	1.27 mm
Signal pad size	0.8 mm × 1.0 mm, 6 places
Side/shell pad size	1.3 mm × 1.8 mm, 4 places
Recommended PCB layout tolerance	±0.05 mm
Keepout note	Cross-hatched areas: no pattern and via hole in this area
Materials	Thermoplastic resin housing/slider UL94V-0 black; copper alloy contacts; stainless steel shell
Finish	Au plating 0.076 µm min at contact area; gold flash at soldering areas

Datasheet pin/contact table

Table

Connector no.	Datasheet pin name	Datasheet description	Project terminal found
1	C1	Vcc of SIM	VCC, Pin Number C1
2	C2	RST of SIM	RST, Pin Number C2
3	C3	CLK of SIM	CLK, Pin Number C3
4	C5	GND of SIM	GND, Pin Number C5
5	C6	Vpp of SIM	VPP, Pin Number C6
6	C7	I/O of SIM	I/O, Pin Number C7
7	SW	Detection switch	DETECTION_SWITCH, Pin Number SW1
8	GND	Ground	GROUND_1, Pin Number G1
9	GND	Ground	GROUND_2, Pin Number G2
10	GND	Ground	GROUND_3, Pin Number G3

SIM card C4 and C8 are explicitly N/A in the drawing; no project pads are needed for them.

Schematic symbol review

Matches

The symbol has 10 terminal elements, matching the 10 connector land pads/terminals in the TE drawing.
The six SIM contacts are present: VCC/C1, RST/C2, CLK/C3, GND/C5, VPP/C6, and I/O/C7.
Three shell/ground terminals are present: GROUND_1/G1, GROUND_2/G2, GROUND_3/G3.
A card-detect terminal is present.

Mismatches / issues

Card-detect pin number mismatch
- Datasheet: connector no. 7, pin name SW / S/W.
- Project: DETECTION_SWITCH has Pin Number SW1.
- Recommendation: use SW or connector number 7 consistently. The official drawing does not show SW1.
Ground pad numbering differs from datasheet convention
- Datasheet: connector nos. 8–10 are GND pads.
- Project: ground shell pads are numbered G1, G2, G3.
- This is understandable for readable pad labels, but if strict manufacturer numbering is desired, use 8, 9, 10 as Pin Number and keep the designators as GROUND_1/2/3 or GND_8/9/10.
Pin Type properties are all Unspecified
- Recommended mappings:
  - VCC/C1: Power In
  - RST/C2: Input
  - CLK/C3: Input
  - GND/C5: Ground
  - VPP/C6: Power In or Passive/Unspecified depending on intended SIM usage
  - I/O/C7: Bi-Directional
  - SW: Passive or Output/Unspecified depending on symbol convention for mechanical switch contact
  - Ground shell pads: Ground
Pin Description properties are missing
- Suggested short descriptions:
  - VCC: SIM supply
  - RST: SIM reset
  - CLK: SIM clock
  - GND: SIM ground
  - VPP: SIM programming voltage
  - I/O: SIM data I/O
  - DETECTION_SWITCH: Card detect switch
  - GROUND_1/2/3: Shell ground

Footprint review

Matches

Project footprint has 10 SMD pads, matching the official drawing.
SIM signal pad sizes match the drawing: 0.8 mm × 1.0 mm.
SIM signal pad x-order matches the recommended PCB layout: C1, C5, C2, C6, C3, C7.
Signal pad pitch is 1.27 mm, matching the drawing.
Side/shell pad size matches the drawing: 1.3 mm × 1.8 mm.
The footprint contains pads corresponding to SW and three ground/shell pads.

Mismatches / issues

Coordinate Y orientation appears flipped relative to the KiCad source vs extracted Flux pad nodes
- The embedded KiCad footprint lists signal pads at y = -6.75 mm and G1/SW1 at y = +6.25 mm.
- Flux computed pad nodes show the same geometry with opposite Y signs for individual pad nodes.
- This may be a coordinate-system import/display transform rather than a real footprint error, because the embedded KiCad asset itself looks consistent.
Ground pad labels use G1/G2/G3, while TE drawing identifies connector nos. 8–10 as GND
- Electrically acceptable if documented, but strict datasheet numbering would be clearer as 8/9/10 or GND_8/GND_9/GND_10.
No explicit keepout/no-pattern regions were found as PCB keepout objects
- TE drawing calls out cross-hatched areas as “NO PATTERN AND VIA HOLE IN THIS AREA.”
- The current footprint has copper pads and silkscreen/fab geometry, but I did not see dedicated keepout zones represented in the layout node list.

Property review

Table

Property	Current project value	Review
Manufacturer Name	TE Connectivity	Matches official source
Manufacturer Part Number	2452796-1	Matches official source
Designator Prefix	J	Appropriate for connector
Datasheet URL	Updated to TE official customer drawing	Corrected from mismatched Mouser PDF
Description	SIM Card Connectors, 4FF SIM Compatible Card, 7 Position, 7 Loaded Positions, Signal, -40 85 C	Mostly consistent with TE product-page summary, but the customer drawing itself shows 10 PCB land pads including shell/ground pads and switch terminal
Package or Case Code	Not set	Recommend adding a package/footprint descriptor such as “Nano SIM hinge connector, SMD, 10-pad”
Part Type	Not set at project level	Recommend adding “Connector” if the part metadata supports it

Overall conclusion

The part is mostly consistent with the official TE Connectivity drawing: MPN/manufacturer match, symbol pin count matches the 10 connector land pads, and the footprint pad sizes/order match the recommended PCB layout. The main issues are metadata/detail issues: the previous datasheet link was for the wrong part, DETECTION_SWITCH uses SW1 instead of datasheet SW/connector no. 7, all symbol terminals have Pin Type = Unspecified, pin descriptions are missing, shell grounds use G1/G2/G3 instead of datasheet connector nos. 8–10, and the manufacturer keepout/no-pattern zones are not represented as explicit keepouts.

Source status
Key specs from official TE drawing
Datasheet pin/contact table
Schematic symbol review
Matches
Mismatches / issues
Footprint review
Matches
Mismatches / issues
Property review
Overall conclusion