Schematic symbol: 10 terminals (no nets defined yet)
Footprint asset: 43045-10YY_181920.kicad_mod (embedded in project)
Datasheet URL presence
A Datasheet URL is already set on the part. No change required.
Datasheet scan and metadata extraction
Attempted to extract from the set URL and multiple official Molex PDFs; the documents are not machine-readable through the tools (image/scan or blocked), so tables and figures could not be text-extracted.
Authoritative document links (official Molex), should be used for the required specs:
Because the above PDFs are not text-parsable by the tools, I cannot quote exact electrical characteristics, absolute maximums, recommended operating conditions, pin descriptions, or package dimensions verbatim here. If you want, I can switch the Datasheet property to one of the “pdm_docs” links above and retry extraction, or you can upload those PDFs here so I can read them directly.
Cross-check: symbol and footprint vs datasheet expectations
Findings from your project symbol and footprint (from your embedded footprint asset):
Pin count and solder tabs
Symbol includes 10 terminals, matching “10 Circuits.”
Footprint asset includes 12 pads total:
Signal pads: 1–10
Solder tab pads: 11 and 12 (mechanical hold-downs), consistent with “with Solder Tab.”
Pin numbering and orientation
Footprint pad centers (from asset) show top row pads 1–5 at y = +4.7 mm and bottom row pads 6–10 at y = −4.7 mm with x = 6, 3, 0, −3, −6 mm. This indicates a 3.00 mm horizontal column pitch and a 2×5 grid, which aligns with Micro-Fit 3.0 family expectations.
Pin 1 marker is present on silkscreen near the top-right (triangle strokes around ~x=8.5, y≈4.2), consistent with pad 1 at x=+6 mm, y=+4.7 mm.
Pad sizes from the footprint asset
Signal pads (1–10): 1.27 mm × 2.54 mm (rectangular SMT tails).
Solder tabs (11–12): 1.65 mm × 3.43 mm (rectangular), located at x = ±9.885 mm, y = 0, rotated 90°.
PCB footprint spacing (from the footprint asset)
Horizontal pitch between adjacent pads in each row is 3.00 mm (x: 6 → 3 → 0 → −3 → −6).
Vertical spacing between the two signal rows is 9.40 mm (y: +4.7 to −4.7).
Items pending datasheet verification (cannot be confirmed without readable sales drawing text)
Exact land pattern dimensions and tolerances, including paste aperture guidance.
Any recommended PCB thickness, peg/hole dimensions (if applicable to this variant), and courtyard.
Official row-to-row spacing and tail geometry callouts as listed on the sales drawing.
Electrical ratings (current per circuit, voltage, dielectric withstanding, contact/insulation resistance) from the Product Specification.
Mismatches and risks to flag
Symbol vs. footprint: No functional mismatch detected. The symbol’s 10 terminals correspond to footprint pads 1–10. Solder tabs are correctly present in the footprint (pads 11–12) and are typically not represented in the symbol.
Manufacturing risk items pending verification against the sales drawing:
Confirm the row-to-row spacing (9.40 mm in the current footprint) and signal pad sizes (1.27 mm × 2.54 mm) match the land pattern in the sales drawing for 43045-1018 specifically.
Confirm solder tab pad sizes (1.65 mm × 3.43 mm) and positions (±9.885 mm, y=0) match the drawing.
Confirm any recommended PCB thickness and keepouts/courtyard are satisfied.
What I can do next for you
If you want me to replace the current Datasheet property with a working Molex link (PS or SD) and re-run the extraction automatically, I can do that and then produce a fully populated table of:
Electrical characteristics
Absolute maximum and recommended operating conditions (if applicable to connectors in the PS)
Pin descriptions/numbering conventions
Mechanical/package dimensions and full PCB land pattern callouts
Alternatively, upload the PDFs (PS-43045-001 and SD-430451018) directly into this chat; I will parse them and finalize the verification.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant