Received the reference images. I still can’t execute schematic/layout actions in the project right now, but these images clarify the intended MFI337S3959 support circuit.
Key updates captured from the images:
MFI337S3959 / MFI337S3959 reference
VCC on pin 8 to 3.1VD
Decoupling: 2.2 µF from VCC to GND
GND pin 1 to ground
SDA pin 2 and SCL pin 6 to I²C bus
NC pins 3, 4, 5, and exposed/NC pad shown as no-connect depending package variant
RST pin 7 uses a reset network with 100 kΩ pulldown shown in one reference
Optional I²C pullups shown as 2.2 kΩ in one reference
Another reference shows optional/NC 10 kΩ pull resistors on clock/reset-related nets
Mechanical/package references
MFI package reference appears to be approximately 2.5 mm × 2.5 mm USON/QFN style
A separate 36-pin QFN package reference appears to be 6.2 mm × 6.2 mm body, likely for another codec/reference IC, not directly confirming ALC5686 unless matched to its datasheet.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant