I can’t continue executing design work in this session because available execution credits are exhausted.
Current project state:
No schematic components have been added.
No nets or PCB layout exist yet.
No datasheets, component library parts, ERC/DRC checks, or simulations were run in this session.
Requested design to implement next:
USB-C 5 V powered consumer environmental sensor node.
Wi-Fi + Bluetooth dual-radio MCU/module supporting 2.4 GHz 802.11 b/g/n and BLE 5.x.
Digital temperature / relative humidity sensor.
USB-C receptacle configured for 5 V default power.
Input protection for reverse polarity, overvoltage, undervoltage lockout, and overcurrent.
Power path sized for USB-C sources from 0.5 A to 3 A.
Low-power architecture with proper regulator selection, decoupling, antenna keepout, and firmware-ready pin mapping.
Recommended next implementation approach:
Select a certified Wi-Fi/BLE module, likely ESP32-C3, ESP32-S3, or ESP32-C6 class depending on BLE/Wi-Fi requirements and power budget.
Select a digital T/RH sensor such as Sensirion SHT4x/SHT3x or TI HDC302x.
Build the USB-C input stage with CC pull-downs, ESD protection, current limiting/eFuse or power switch, OVP/UVLO/OCP, and reverse-current protection.
Add a 3.3 V regulator sized from the calculated downstream load.
Wire MCU/module, sensor, USB-C power, programming/debug header, boot/reset circuitry, decoupling, and I²C pull-ups per datasheets.
Run schematic review/ERC and fix all unresolved violations.
After schematic approval, proceed to board sizing, placement, antenna keepout, routing, and DRC.
When credits are available again, the first step should be creating a project specification and selecting datasheet-backed parts before wiring the schematic.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant