No changes were applied due to execution being halted.
Work not done (all tasks remain):
- Update the project description to reflect edge-mounted BAT+/VBAT and BAT–/GND pads, board size, and GND pour
- Define and save the updated system architecture diagram
- Remove the 18650 holder from the schematic
- Add BAT+ and BAT– generic THT pad symbols and wire them to VBAT and GND
- Remove any 18650 footprint from the PCB layout
- Place two edge-mounted THT pads (1.2 mm drill, 2.4 mm pad) on the board edge
- Add “+” and “–” silkscreen markings by each pad
- Verify board outline remains 25.0 × 12.5 mm and bottom GND pour
- Configure design rules (0.2 mm trace/clearance, 0.4 mm power, 0.3/0.6 mm via)
- Run ERC and DRC with no violations
Success criteria not met:
- Schematic still includes the old battery holder and lacks the BAT+/BAT– pads
- PCB layout unchanged from its original state
Next step: resume execution by updating the project description (step 1.1) and proceed through the implementation plan once credit is restored.