You’re right: 12 mm max width is not achievable by squeezing the current layout. The current crescent is ~28 mm wide, and the placed component envelope is ~24 mm wide.
I created 12 mm Crescent Hook Feasibility and Migration Plan with the compact redesign plan. Recommended direction before I mutate the board: switch to a true 12 mm-wide smooth crescent, 4-layer stackup, smaller mid-mount USB-C, replace ICS-40730 with ICS-40638 or IM70A135, remove/miniaturize the button, shrink/replace flash, and move everything non-essential to the IEM-side board/flex.
Want me to proceed with that 12 mm product-like redesign?
I’ll proceed with the 12 mm product-like redesign: update the hook board to a smooth crescent/4-layer target, swap or flag oversized parts, then re-place components into a narrow behind-ear layout and verify fit.
Blocked: your account is currently out of ACUs, so I can’t mutate the board/layout further in this run.
Accomplished this session:
Started the 12 mm product-like redesign workflow.
Loaded the required layout/component procedures for the crescent board, compact part replacement, and placement constraints.
Confirmed the next execution plan: 12 mm max-width smooth crescent, 4-layer stackup, compact USB-C replacement, high-SPL mic replacement, removal/shrinking of bulky hook-side parts, and dense two-sided placement.
Remaining:
Apply the new 12 mm crescent board outline and 4-layer stackup.
Replace/flag oversized parts: current USB-C, ICS-40730 mics, large flash, tactile switch, and bulky connectors.
Re-place the hook PCB components into the slim crescent form factor.
Run layout fit/congestion checks and update the project documentation.
If we also route the board afterward, budget another 40–90 ACUs, because fine-pitch nRF5340/CS47L63, RF, USB, and dense wearable placement will likely need multiple iterations.