Test Plan Development for Project

1:38

Running design review.

Reviewing the bill of materials.

Analyzing the schematic.

Analyzing the PCB layout.

Refining answer requirements.

Clarifying design state issues.

Comprehensive Test Plan - Flux Capacitor Project V1.1

This test plan is based on the project’s current state: a 75-component / 20-net schematic, a 2-layer PCB, and a 50 mm x 60 mm rectangular layout with 10 mm corner radius. Current automated checks show no missing footprints and no airwires, but there are 31 floating-pin ERC errors, so verification should treat schematic cleanup as part of test readiness. For project analysis, it is important to document the design as it exists now and use concrete values and observed behavior, not assumptions

1) Test Scope In scope

Power-path behavior
Logic/control behavior
LED output behavior
Switch/input behavior
Programming/interface behavior
PCB manufacturability and basic physical robustness
Thermal rise under steady operation
Environmental robustness for storage and light functional operation
Pre-production validation and regression retest

Out of scope

Regulatory certification
Long-term field reliability modeling
EMC pre-compliance beyond basic functional sanity checks
Any performance claim requiring specs not yet defined in the project description

2) Test Objectives Primary objectives

Confirm the board powers up safely and repeatably
Verify all intended outputs and inputs function correctly
Confirm the PCB can be assembled, programmed, and operated without electrical faults
Detect latent issues related to floating nodes, unstable power, solder defects, or thermal stress
Establish pass/fail criteria suitable for prototype bring-up and later production screening

Secondary objectives

Build a reusable regression checklist
Identify design weak points before additional spins
Improve confidence in reliability across supply, temperature, and handling variation

3) Requirements to Validate

Functional requirements

ID	Requirement	Validation Method
F1	Board powers on from intended source without damage	Bring-up, current monitoring
F2	Logic/control section starts consistently	Power-cycle and programming tests
F3	Visual outputs behave as intended	Functional output test
F4	User input/switching changes behavior correctly	Input stimulus test
F5	Programming/debug interface is usable	Interface/programming test
F6	All intended nets are electrically continuous	Continuity and resistance checks

Non-functional requirements

ID	Requirement	Validation Method
N1	No excessive current draw in idle or active states	Power profiling
N2	No component exceeds safe operating temperature in normal use	Thermal test
N3	PCB survives normal handling and installation	Mechanical inspection and stress
N4	Board remains functional after environmental exposure	Environmental test
N5	Assembly is manufacturable and repeatable	DFM/assembly inspection
N6	Design is free of unresolved critical ERC/DRC issues before release	Review gate

4) Test Environment Setup

Bench equipment

Equipment	Purpose
Bench power supply with current limit	Safe bring-up
Digital multimeter	Voltage, continuity, resistance
Oscilloscope	Supply stability, switching, signal timing
Logic analyzer	Digital behavior and interface timing
IR camera or thermocouple	Thermal characterization
ISP/programming tool	Programming and verification
Magnification microscope	Solder and assembly inspection
ESD-safe workstation	Safe handling
Environmental chamber if available	Temperature/humidity stress

Board setup

Test at room ambient first: 23 C to 27 C
Use current-limited supply for first power-up
Record board revision, firmware version, and any rework status
If multiple prototypes exist, assign serial IDs and test all units

Pre-test readiness gates

No airwires
No missing footprints
ERC floating-pin issues reviewed and either resolved or formally waived
Firmware image frozen for test campaign
Power input polarity and expected supply range documented

5) Test Categories and Detailed Test Cases

A. Electrical Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
E-01	Visual pre-power inspection	Inspect polarity, solder bridges, tombstones, connector orientation, damaged pads	No visible assembly defects	Pass if no defect likely to cause short/open
E-02	Power-to-ground resistance	Measure input rail to ground before power-up	Finite resistance, not near-short	Pass if resistance is consistent with design and not indicative of a short
E-03	First power-up current limit	Power with low current limit and monitor current	No latch-up, no sudden overcurrent	Pass if current stays below set safe threshold and board remains stable
E-04	Steady-state input current	Measure current after startup	Stable, repeatable current draw	Pass if within expected operating window defined during characterization
E-05	Rail voltage accuracy	Measure all supply nodes	Rails within tolerance	Pass if each rail is within +/- 5% of target unless tighter limit is later defined
E-06	Power-cycle repeatability	Cycle power 50 times	Reliable startup every cycle	Pass if zero failed boots
E-07	Brownout behavior	Ramp supply down/up slowly	Predictable reset or shutdown	Pass if no latch-up, corruption, or excessive current
E-08	Output continuity	Validate each output path electrically	All expected paths connected	Pass if continuity matches schematic intent
E-09	Idle ripple/noise	Probe supply rails with scope	No abnormal ripple/oscillation	Pass if ripple is stable and no sustained oscillation is observed
E-10	Input debounce/stability	Toggle switch/input repeatedly	Clean response, no chatter-induced malfunction	Pass if no missed or false events beyond agreed limit
E-11	LED channel validation	Exercise all visible outputs one by one and in pattern mode	Correct channels activate with correct polarity	Pass if every channel behaves correctly
E-12	Fault current check	Test safe response to brief abnormal operating condition where practical	No catastrophic failure	Pass if board recovers and no damage occurs

B. Communication & Interface Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
I-01	Programming interface connectivity	Connect programmer and detect target	Target is recognized reliably	Pass if detection succeeds on 3/3 attempts
I-02	Firmware flash and verify	Program image and verify contents	Successful write/verify	Pass if verify is clean with zero retries required beyond normal tool behavior
I-03	Reset/programming sequence	Test reset entry and reprogram cycle	Consistent programming access	Pass if repeated programming succeeds
I-04	Interface signal integrity	Check clock/data lines during programming	Clean levels, no stuck lines	Pass if levels meet logic thresholds and transactions complete
I-05	Recovery after interrupted programming	Interrupt one programming cycle safely, then retry	Board remains recoverable	Pass if successful reflash restores operation

C. Functional Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
F-01	Basic startup behavior	Apply power and observe behavior	Intended startup sequence occurs	Pass if startup result matches defined behavior every time
F-02	Normal operating mode	Run intended primary function for 30 min	Stable operation	Pass if no reset, lockup, or visible malfunction
F-03	User interaction	Operate switch through all expected states	Device responds correctly	Pass if all states are reachable and repeatable
F-04	Output pattern endurance	Run output sequence continuously for 4 hr	No drift or failure	Pass if functionality remains correct throughout
F-05	Simultaneous activity stress	Drive outputs while exercising inputs/programming-safe functions	No interference or unstable behavior	Pass if no missed events, resets, or corrupted operation

D. Thermal Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
T-01	Room-temperature thermal map	Run normal mode for 30 min and capture temperatures	Hotspots identified, stable temperatures	Pass if no component exceeds its rated temperature limit
T-02	Worst-case power thermal run	Operate in highest-current realistic condition for 1 hr	Temperature reaches steady state safely	Pass if junction/case estimates remain below rated limits with margin
T-03	Enclosure-like airflow restriction	Repeat thermal run with reduced airflow if enclosure is planned	Predictable temperature rise	Pass if still below allowable limit
T-04	Hot restart	Run hot, power-cycle, restart	Normal restart from warm condition	Pass if startup remains reliable

E. Mechanical Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
M-01	Dimensional inspection	Measure board outline and key clearances	PCB matches fabrication intent	Pass if critical dimensions are within fab tolerance
M-02	Connector/programmer mating	Insert and remove cable/programmer repeatedly	No pad lift, no intermittent contact	Pass if 20 cycles complete without damage
M-03	Switch actuation life screening	Actuate switch repeatedly	Stable mechanical function	Pass if no sticking or intermittent response after 200 cycles
M-04	Handling robustness	Gentle manual handling and fixture mounting	No cracked joints or detached parts	Pass if post-test inspection and function are clean
M-05	Battery/contact retention if applicable	Check retention/contact pressure during movement	Reliable contact	Pass if no unintended disconnect

F. Environmental Testing

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
ENV-01	Cold functional test	Test at low ambient, e.g. 0 C or project target	Board starts and runs	Pass if full functionality is maintained
ENV-02	Hot functional test	Test at high ambient, e.g. 50 C or project target	Board starts and runs	Pass if full functionality is maintained
ENV-03	Thermal cycling	Cycle between low/high ambient 10 times	No latent failures	Pass if function before/after is identical
ENV-04	Humidity exposure	Expose to moderate humidity soak if available	No corrosion-related or leakage-related malfunction	Pass if behavior remains normal after stabilization
ENV-05	ESD handling check	Basic controlled ESD handling evaluation	No permanent damage from normal handling exposure	Pass if no reset or failure outside acceptable handling limits

G. Manufacturing / Reliability Gate Tests

TC ID	Test Case	Procedure	Expected Outcome	Pass/Fail Criteria
R-01	Schematic/layout review gate	Review open ERC/DRC findings	No unresolved critical issues	Fail if critical review issues remain unresolved
R-02	Assembly repeatability	Test multiple assembled units	Similar current, voltages, and function	Pass if unit-to-unit spread is acceptable
R-03	Burn-in	Operate for 12 hr to 24 hr	No infant mortality failures	Pass if unit remains fully functional
R-04	Regression after rework	Retest repaired units	No degradation after rework	Pass if all prior critical tests still pass

6) Edge Cases to Include

Edge Case	Why It Matters
Minimum input voltage at startup	Finds brownout sensitivity
Maximum allowed input voltage	Verifies safe margin
Rapid power toggling	Finds reset or latch-up issues
Power applied with switch active	Checks startup-state handling
Programming attempt during unusual board state	Checks recovery robustness
Cold start after long unpowered storage	Reveals weak contacts or startup issues
Long-duration operation	Reveals thermal drift and intermittent faults
Multiple outputs active simultaneously	Finds aggregate current issues
Open or intermittent external connection	Checks fault tolerance

7) Automation Strategy What to automate first

Power-cycle testing
Rail-voltage logging
Current-consumption logging
Functional output sequence verification
Programmer connect/flash/verify loops
Regression result capture

Suggested automation stack

Layer	Recommendation
Instrument control	Python with SCPI for PSU, DMM, scope
Functional sequencing	USB relay / GPIO test controller
Result logging	CSV or SQLite with per-board serial number
Regression	One-button script for bring-up and flash verification
Reporting	Auto-generated pass/fail summary and trend plots

Automation priorities

Safe power-up script with current-limit enforcement
Repeated startup and flash verification
Current/voltage trend logging over time
Thermal logging during endurance tests

8) Risks and Failure Modes

Risk	Likely Effect	Mitigation
Floating nodes already seen in ERC	Unpredictable logic or false failures	Resolve or document before formal test
Unknown current budget	Overstress during bring-up	Use current-limited supply and characterize gradually
Thermal hotspots on dense LED/output regions	Reduced life or intermittent behavior	IR scan under worst-case load
Connector or battery contact intermittency	Random resets	Mechanical retention and contact testing
Incomplete requirements definition	Ambiguous pass/fail outcomes	Freeze measurable acceptance criteria before signoff
Prototype-only workmanship variation	False negatives	Test more than one assembled board

9) Recommended Pass/Fail Flow Prototype bring-up gate

E-01 through E-06
I-01 through I-03
F-01 through F-03

Functional qualification gate

All electrical, interface, and functional cases
T-01 and T-02
M-01 and M-02

Reliability gate

Burn-in
Thermal cycling
Repeated power-cycle testing
Multi-unit comparison

A board should not advance to reliability testing until:

No critical shorts/overcurrent behavior exist
Rail measurements are stable
Programming is repeatable
Open critical ERC findings are dispositioned

10) Recommendations to Improve Test Coverage

Recommendation	Benefit
Define explicit nominal and min/max supply limits	Makes power tests objective
Add a current budget table	Enables meaningful pass/fail thresholds
Add labeled test points on key rails/signals in next revision	Faster debug and production screening
Resolve current floating-pin findings before final validation	Reduces ambiguous failures
Document intended LED behavior/state table	Makes output testing deterministic
Create a golden-board reference dataset	Enables unit-to-unit comparison
Run at least 3 boards through the same plan	Better confidence in repeatability
Add a simple automated production smoke test	Shortens future screening time

11) Minimal First-Pass Test Sequence for This Project

If you want the fastest practical first validation pass, do this:

Visual inspection and resistance-to-ground check
Current-limited first power-up
Measure all rails
Verify programming interface works
Run basic functional/output test
Power-cycle 50 times
Run 30 min thermal soak
Recheck function
Review and resolve the existing floating-pin ERC issues
Repeat on at least one more assembled unit

12) Suggested Deliverables

Deliverable	Purpose
Test matrix spreadsheet	Track status by case and by unit
Bring-up checklist	Safe first-power procedure
Automated bench script	Repeatable regression
Thermal image set	Document hotspots
Final validation report	Signoff evidence

If you want, I can turn this into a production-ready test matrix table with columns for owner, priority, setup, measured values, status, and notes.

Create test matrix

Tailor to this board

Add measurable limits

Focus on ERC issues

30 days

do you know what this project do?

vasy_skral

@copilot do you know what this project do?

copilot

Based on the provided project context and components, this project appears to be a conceptual representation of the Flux Capacitor from the "Back to the Future" movie series. The list of components includes a microcontroller, an array of LEDs, resistors, capacitor, connectors, and switches. It does not contain the actual time travel functionality that the movie Flux Capacitor has, as time travel is not currently possible with known science and technology. Instead, this project seems to be an electronic representation of the Flux Capacitor, possibly for decorative, educational, or hobbyist purposes.

vasy_skral

Can you write me a Arduino code that will create running light effect with this LEDs?

copilot

Certainly! The following Arduino code creates a running light effect for the LEDs connected to the ATtiny13 microcontroller present in your project. Since the ATtiny13 has a limited number of GPIO pins, I've assumed that PB0 (LED1, LED2, LED3), PB1 (LED4, LED5, LED6), PB2 (LED7, LED8, LED9), and PB3 (LED10, LED11, LED12) pins are used to control the LED groups.

Cpp
#include 
#include 

// LED pins on ATtiny13
#define LED1_PIN PB0
#define LED2_PIN PB1
#define LED3_PIN PB2
#define LED4_PIN PB3

void setup() {
  // Set LED pins as outputs
  DDRB |= (1 << LED1_PIN) | (1 << LED2_PIN) | (1 << LED3_PIN) | (1 << LED4_PIN);
}

void loop() {
  // Turn ON the LED groups one by one with a small delay
  PORTB |= (1 << LED1_PIN);
  _delay_ms(100);
  PORTB &= ~(1 << LED1_PIN);

  PORTB |= (1 << LED2_PIN);
  _delay_ms(100);
  PORTB &= ~(1 << LED2_PIN);

  PORTB |= (1 << LED3_PIN);
  _delay_ms(100);
  PORTB &= ~(1 << LED3_PIN);

  PORTB |= (1 << LED4_PIN);
  _delay_ms(100);
  PORTB &= ~(1 << LED4_PIN);
}

int main() {
  setup();
  while(1) {
    loop();
  }
  return 0;
}

This code sets up the ATtiny13's GPIO pins as outputs and then creates a running light effect by turning on and off the LED groups sequentially with a small delay between each transition. Please note that you might need to adjust the delay time to suit your desired running light speed.

Someone is typing...

LED1

Capacitance

0.1uF

LED9

LED7

LED12

LED10

LED3

LED11

LED2

LED4

LED5

LED6

LED8

PLUTONIUM_239

C_3

SWITCH

VBAT

SWITCH

C_2

C_1

VBAT

C_1

VBAT

C_2

VBAT

C_4

VBAT

C_3

C_4

SW1

Resistance

10kΩ

Resistance

10kΩ

Reviews

Ground
A common return path for electric current. Commonly known as ground.
jharwinbarrozo
20.5M
Net Portal
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
jharwinbarrozo
43.0M
Power Net Portal
Wirelessly connects power nets on schematic. Identical to the net portal, but with a power symbol. Used to organize schematics and separate functional blocks. To wirelessly connect power net portals, give them the same designator. #portal #power
jharwinbarrozo
11.4M
Generic Resistor
A generic fixed resistor ideal for rapid circuit topology development. Its footprint automatically adapts based on the selected package case code—supporting 0402, 0603, 0805, 1203, and many other standard SMD packages, as well as axial horizontal and vertical configurations. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0 ohm, 10 ohm, 100 ohm, 1.0k ohm, 10k ohm, 100k ohm, 1.0M ohm 1.1 ohm, 11 ohm, 110 ohm, 1.1k ohm, 11k ohm, 110k ohm, 1.1M ohm 1.2 ohm, 12 ohm, 120 ohm, 1.2k ohm, 12k ohm, 120k ohm, 1.2M ohm 1.3 ohm, 13 ohm, 130 ohm, 1.3k ohm, 13k ohm, 130k ohm, 1.3M ohm 1.5 ohm, 15 ohm, 150 ohm, 1.5k ohm, 15k ohm, 150k ohm, 1.5M ohm 1.6 ohm, 16 ohm, 160 ohm, 1.6k ohm, 16k ohm, 160k ohm, 1.6M ohm 1.8 ohm, 18 ohm, 180 ohm, 1.8K ohm, 18k ohm, 180k ohm, 1.8M ohm 2.0 ohm, 20 ohm, 200 ohm, 2.0k ohm, 20k ohm, 200k ohm, 2.0M ohm 2.2 ohm, 22 ohm, 220 ohm, 2.2k ohm, 22k ohm, 220k ohm, 2.2M ohm 2.4 ohm, 24 ohm, 240 ohm, 2.4k ohm, 24k ohm, 240k ohm, 2.4M ohm 2.7 ohm, 27 ohm, 270 ohm, 2.7k ohm, 27k ohm, 270k ohm, 2.7M ohm 3.0 ohm, 30 ohm, 300 ohm, 3.0K ohm, 30K ohm, 300K ohm, 3.0M ohm 3.3 ohm, 33 ohm, 330 ohm, 3.3k ohm, 33k ohm, 330k ohm, 3.3M ohm 3.6 ohm, 36 ohm, 360 ohm, 3.6k ohm, 36k ohm, 360k ohm, 3.6M ohm 3.9 ohm, 39 ohm, 390 ohm, 3.9k ohm, 39k ohm, 390k ohm, 3.9M ohm 4.3 ohm, 43 ohm, 430 ohm, 4.3k ohm, 43K ohm, 430K ohm, 4.3M ohm 4.7 ohm, 47 ohm, 470 ohm, 4.7k ohm, 47k ohm, 470k ohm, 4.7M ohm 5.1 ohm, 51 ohm, 510 ohm, 5.1k ohm, 51k ohm, 510k ohm, 5.1M ohm 5.6 ohm, 56 ohm, 560 ohm, 5.6k ohm, 56k ohm, 560k ohm, 5.6M ohm 6.2 ohm, 62 ohm, 620 ohm, 6.2k ohm, 62K ohm, 620K ohm, 6.2M ohm 6.8 ohm, 68 ohm, 680 ohm, 6.8k ohm, 68k ohm, 680k ohm, 6.8M ohm 7.5 ohm, 75 ohm, 750 ohm, 7.5k ohm, 75k ohm, 750k ohm, 7.5M ohm 8.2 ohm, 82 ohm, 820 ohm, 8.2k ohm, 82k ohm, 820k ohm, 8.2M ohm 9.1 ohm, 91 ohm, 910 ohm, 9.1k ohm, 91k ohm, 910k ohm, 9.1M ohm #generics #CommonPartsLibrary
jharwinbarrozo
1.5M
Generic Capacitor
A generic fixed capacitor ideal for rapid circuit topology development. You can choose between polarized and non-polarized types, its symbol and the footprint will automatically adapt based on your selection. Supported options include standard SMD sizes for ceramic capacitors (e.g., 0402, 0603, 0805), SMD sizes for aluminum electrolytic capacitors, and through-hole footprints for polarized capacitors. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF, 10pF, 100pF, 1000pF, 0.01uF, 0.1uF, 1.0uF, 10uF, 100uF, 1000uF, 10000uF 1.1pF, 11pF, 110pF, 1100pF 1.2pF, 12pF, 120pF, 1200pF 1.3pF, 13pF, 130pF, 1300pF 1.5pF, 15pF, 150pF, 1500pF, 0.015uF, 0.15uF, 1.5uF, 15uF, 150uF, 1500uF 1.6pF, 16pF, 160pF, 1600pF 1.8pF, 18pF, 180pF, 1800pF 2.0pF, 20pF, 200pF, 2000pF 2.2pF, 22pF, 220pF, 2200pF, 0.022uF, 0.22uF, 2.2uF, 22uF, 220uF, 2200uF 2.4pF, 24pF, 240pF, 2400pF 2.7pF, 27pF, 270pF, 2700pF 3.0pF, 30pF, 300pF, 3000pF 3.3pF, 33pF, 330pF, 3300pF, 0.033uF, 0.33uF, 3.3uF, 33uF, 330uF, 3300uF 3.6pF, 36pF, 360pF, 3600pF 3.9pF, 39pF, 390pF, 3900pF 4.3pF, 43pF, 430pF, 4300pF 4.7pF, 47pF, 470pF, 4700pF, 0.047uF, 0.47uF, 4.7uF, 47uF, 470uF, 4700uF 5.1pF, 51pF, 510pF, 5100pF 5.6pF, 56pF, 560pF, 5600pF 6.2pF, 62pF, 620pF, 6200pF 6.8pF, 68pF, 680pF, 6800pF, 0.068uF, 0.68uF, 6.8uF, 68uF, 680uF, 6800uF 7.5pF, 75pF, 750pF, 7500pF 8.2pF, 82pF, 820pF, 8200pF 9.1pF, 91pF, 910pF, 9100pF #generics #CommonPartsLibrary
jharwinbarrozo
1.5M
Generic Inductor
A generic fixed inductor suitable for rapid circuit topology development. The footprint automatically adapts based on the selected package, supporting standard SMD sizes (e.g., 0402, 0603, 0805) as well as well-known inductor packages such as SDR1806, PA4320, SRN6028, and SRR1260. Standard inductor values: 1.0 nH, 10 nH, 100 nH, 1.0 µH, 10 µH, 100 µH, 1.0 mH 1.2 nH, 12 nH, 120 nH, 1.2 µH, 12 µH, 120 µH, 1.2 mH 1.5 nH, 15 nH, 150 nH, 1.5 µH, 15 µH, 150 µH, 1.5 mH 1.8 nH, 18 nH, 180 nH, 1.8 µH, 18 µH, 180 µH, 1.8 mH 2.2 nH, 22 nH, 220 nH, 2.2 µH, 22 µH, 220 µH, 2.2 mH 2.7 nH, 27 nH, 270 nH, 2.7 µH, 27 µH, 270 µH, 2.7 mH 3.3 nH, 33 nH, 330 nH, 3.3 µH, 33 µH, 330 µH, 3.3 mH 3.9 nH, 39 nH, 390 nH, 3.9 µH, 39 µH, 390 µH, 3.9 mH 4.7 nH, 47 nH, 470 nH, 4.7 µH, 47 µH, 470 µH, 4.7 mH 5.6 nH, 56 nH, 560 nH, 5.6 µH, 56 µH, 560 µH, 5.6 mH 6.8 nH, 68 nH, 680 nH, 6.8 µH, 68 µH, 680 µH, 6.8 mH 8.2 nH, 82 nH, 820 nH, 8.2 µH, 82 µH, 820 µH, 8.2 mH #generics #CommonPartsLibrary
jharwinbarrozo
15.8k
Terminal
An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.
natarius
RMCF0805JT47K0
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film #forLedBlink
jharwinbarrozo
1.2M
875105359001
10uF Capacitor Aluminum Polymer 20% 16V SMD 5x5.3mm #forLedBlink #commonpartslibrary #capacitor #aluminumpolymer #radialcan
jharwinbarrozo
1.2M
CTL1206FYW1T
Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric) #forLedBlink
jharwinbarrozo
1.1M

Project Name

Flux Capacitor Project V1.1

Description

"This is what makes time travel possible." —Doc Brown In order to travel through time, the vehicle integrated with the flux capacitor needed to be traveling at 88 mph (140.8 km/h), and required 1.21 gigawatts of power (1,210,000,000 watts)

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor	Qty 1
Digi-Key	$1.24–$1.96
LCSC	$3.67
Mouser	$1.90

Controls

Welcome 👋

Flux helps you build PCBs faster with an AI teammate!

Create your account to collaborate, stay updated, fork your own version, and get instant answers from our AI agent.