Power net portal is a special schematic object used to define a power or ground net. Power ports allow you to conveniently indicate a power net at any location in the design. Power nets of the same designator automatically connect throughout your design #portal #power
A generic fixed inductor for rapid developing circuit topology. *You can now change the footprint and 3D model at the top level anytime you want. This is the power of #generics
For the VQFN (Very Thin Quad Flat No-Lead) package, especially for a 16-VQFN (3x3) like the BQ25504RGTT from Texas Instruments, you'll typically follow a standardized footprint. However, it's crucial to consult the datasheet or package specifications for precise dimensions. Here's a general guide for creating a 16-VQFN footprint:
Pad Size: Check the datasheet for recommended land patterns. Typically, for a VQFN package, the pads might be around 0.3 to 0.5 mm in width and 1 to 1.5 mm in length.
Pitch: The pitch, or distance from the center of one pad to the center of the next pad, is important. For a 16-VQFN, it's commonly around 0.5 mm.
Thermal Pad (also known as an Exposed Pad or EPAD): This package usually includes a large central pad used for thermal dissipation. The dimensions of this pad are crucial and can be found in the datasheet. For a 3x3 VQFN, this might be approximately 2.2 x 2.2 mm, but this can vary.
Stencil Design: For the solder paste application, the stencil openings should align with the pads. The thermal pad may require a segmented or "window-pane" solder paste design to avoid excessive solder and potential shorting.
Creating this footprint in Flux, you'd follow these steps:
Pads for Pins: Create pads for each of the 16 pins using the dimensions specified in the datasheet. Ensure they are properly spaced according to the specified pitch.
Placement: Arrange these pads in a quad formation around the center of the footprint area, corresponding to the 4 sides of the VQFN package.
Thermal Pad: Add a central pad for the thermal pad (EPAD). Its size should meet the datasheet's recommendations.
Silkscreen and Assembly Layers: Include outlines on the silkscreen and assembly layers indicating the component's orientation. This often includes a dot or notch marking pin 1.
Fabrication Notes: On the fabrication layer, include any special instructions for the PCB manufacturer regarding the thermal pad, such as the use of thermal vias for improved heat dissipation.
Please, ensure to verify the precise measurements from the BQ25504RGTT datasheet for the most accurate dimensions. If you need assistance with specific measurements from the datasheet, feel free to ask!
10mo
Hey, I'm copilot! I can help you with all kinds of stuff in your project. Reac...
Hey, I'm copilot! I can help you with all kinds of stuff in your project. Reach me at any time by tagging me on comments or in the chat with my handle, @copilot.
1y
Someone is typing...
Passive Components
Resistor Power Rating
Beta
Checks that the power traveling across a given resistor is under its rating with 50% headroom.