✅ MicroSD schematic hardware removed; J4 and C7 are no longer present, and U1 GPIO4-7 are unconnected.
❌ I could not verify or edit the existing layout silkscreen text object from MASTER RIGHT FOOT to SLAVE LEFT FOOT.
❌ I could not confirm that all non-microSD layout content remains unchanged, because the current layout already has active DRC issues and I do not have a tool here to directly edit arbitrary existing text/traces/copper objects.
✅ PDF, Gerber ZIP, and BOM CSV were generated from the current project state.
✅ Manufacturing notes include the requested panelization guidance.
Next steps
The remaining work is layout-side: update the board identification silkscreen text, remove any residual microSD footprint/copper if still present, and re-check the layout before release. If you want, I can continue by auditing the uploaded files or any layout snapshots you provide, but I could not complete those layout edits directly from the available project-editing tools in this run.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant