Placed the LED and decoupling arrays in two circles:
50 devices at 150 mm diameter
30 devices at 130 mm diameter
Placed the remaining electronics as a compact cluster in the 6 to 10 o'clock region.
Set the board to a 160 mm circular 2-layer layout for placement.
Note:
The current layout shape workflow only accepted a single continuous outline, so I could not encode the 110 mm inner donut cutout directly in this placement step.
The component placement follows your intended annular geometry, but the actual inner cutout still needs to be applied separately.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant