Current state: the project is still empty, so nothing has been added yet — no schematic, components, nets, or layout.
What I would build next for your node:
Core: a low-power dual-radio MCU with 2.4 GHz Wi‑Fi + BLE 5.x, most likely an ESP32-C6 or ESP32-S3 class device depending the exact sleep/current and firmware tradeoff you want.
Sensor: a digital temperature/RH sensor such as SHT4x or HDC302x, connected over I2C.
Power input: USB-C receptacle configured as 5 V sink default with CC pulldowns.
Protection/power path: input fuse or eFuse, reverse-current/reverse-polarity protection, OVP/UVLO/OCP-capable front end sized for 0.5–3 A source compatibility, then a regulated 3.3 V rail for the MCU and sensor.
Consumer-use details: ESD protection on USB-C, proper decoupling throughout, RF keepout/antenna considerations, and a clean schematic that can pass review before layout.
What remains to be done:
Choose the exact MCU/module and sensor from datasheets.
Calculate the full power budget and size the USB-C protection and regulator path correctly.
Create the schematic with all support parts, decoupling, bootstraps, pull-ups, and protection.
Verify the design against datasheets and review checks.
Then move to PCB layout, placement, and routing after your confirmation.
One important design decision still open:
If you want the fastest, lowest-risk path, I’d use a certified RF module rather than a bare MCU + RF matching network.
If you want the lowest BOM cost and smallest board, a bare chip solution is possible but more RF-sensitive.
Recommended starting architecture:
USB-C 5 V sink
USB ESD + protected power-path IC/eFuse
3.3 V regulator
ESP32-class Wi‑Fi/BLE device
I2C temperature/humidity sensor
Optional status LED and programming/debug header
If you want, I can next turn this into a concrete part-by-part schematic plan with recommended components and rail/current targets.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant