I’ll lock the Tier-3 production baseline to Toradex Verdin iMX95 and update the architecture/design/checklist files so the review gates reference that module specifically.

Updated the production baseline to Toradex Verdin iMX95 across:

The checklist now requires Verdin-specific gates: exact Verdin iMX95 SKU, Toradex datasheet/carrier guide, Verdin connector footprint and mechanical model, Toradex power requirements, thermal guidance, and confirmation of Ethernet/PTP, TPM, Wi-Fi/BT, and NVMe implementation before schematic capture.

I’ll create a Verdin iMX95 bring-up and procurement checklist from the updated gates, covering documents to obtain, parts to order, first-power validation, secure boot, Ethernet/PTP, NVMe, thermal, and sealed-node tests.

Created Verdin iMX95 Bring-Up and Procurement Checklist.

It covers procurement, Toradex documentation gates, carrier-side part selection, pre-schematic release criteria, first-article power-up, BSP boot, TPM/ATECC security validation, NVMe, Ethernet/PTP, wireless, thermal testing, and production-lock checks. Critical next gate: select the exact Toradex Verdin iMX95 SKU before schematic capture.