Memory
Seeed Studio XIAO RP2040
The Seeed Studio XIAO RP2040 is as small as the Seeed Studio XIAO SAMD21 but it's more powerful. On one hand, it carries the powerful Dual-core RP2040 processor that can flexible clock running up to 133 MHz which is a low-power microcontrollers. On the Seeed Studio XIAO RP2040 there is also 264KB of SRAM, and 2MB of on-board Flash memory which can provide more program to save and run. On the other hand, this little board has good performance in processing but needs less power. All in all, it is designed in a tiny size as small as a thumb(20x17.5mm) and can be used for wearable devices and small projects. #RP2040 #PICO #XIAO #SeedStudio
451 Uses
12 Stars
RP2350A
The RP2350, developed by Raspberry Pi Ltd, represents a significant advancement in the field of microcontrollers, building upon the foundation laid by its predecessor, the RP2040. This component is designed to cater to a wide range of applications requiring dual-core processing capabilities, with the option to switch between Dual Cortex-M33 or Hazard3 processors operating at up to 150 MHz. It features an extensive 520 kB of on-chip SRAM distributed across 10 independent banks, alongside 8 KB of one-time-programmable (OTP) storage. External memory interfaces are well-supported, with provisions for up to 16 MB of external QSPI flash/PSRAM, and an additional 16 MB accessible via an optional second chip-select, facilitating extensive code and data storage options. Security features are robust, including options for boot signing enforced by on-chip mask ROM, with key fingerprints stored in OTP, and hardware mitigations against fault injection attacks. The RP2350 also boasts a comprehensive set of peripherals, including 2x UARTs, 2x SPI controllers, 2x I2C controllers, 24x PWM channels, and a USB 1.1 controller with PHY for host and device support, among others. Programmable IO (PIO) state machines enhance its flexibility, enabling the implementation of custom peripherals. For developers, the RP2350 offers low-power operation modes and a built-in boot ROM that supports direct boot from external flash or OTP, serial boot from USB or UART, and secure boot with code signature enforcement. The device is available in QFN-60 (7x7 mm) and QFN-80 (10x10 mm) packages, with or without built-in flash, catering to diverse application requirements. This microcontroller is a compelling choice for sophisticated projects that demand high performance, extensive memory and peripheral support, and advanced security features.
25 Uses
2 Stars
MGM210LA22JIF
MGM210LA22JIF devices are PCB modules for Zigbee, Thread, Bluetooth and multiprotocol (Zigbee + Bluetooth) connectivity built around the EFR32MG21 Wireless Gecko Series 2 SoC and designed and optimized for the unique needs of smart LED lightbulbs. Delivering unparalleled RF performance and energy consumption compliance with CA Title 20, the module also offers a powerful and energy-efficient MCU core, 1024 kB of flash memory to enable future-proofing capabilities and over-the-air firmware updates with a dedicated core for enhanced security features. With its extended temperature rating and form factor, the device is suitable for enclosed operation in lightbulb housings. #CommonpartLibrary #Module #EFR32MG21 #arduino-matter
25 Uses
2 Stars
TinyFPGA-A-Schematic
The schematic for TinyFPGA A-Series boards are tiny bare-bones FPGA boards created by Luke Valenty https://github.com/tinyfpga - Tiny, just 1.2 by 0.7 inches - Low power 3.3 volt operation - 18 user IOs (21 with JTAGEN) - 1200 4-input look-up tables - 10 kilobits distributed RAM - 64 kilobits dedicated RAM - 64 kilobits user flash memory - 1 SPI Hard-IP - 2 I2C Hard-IPs - 1 PLL Hard-IP - Built-in flash configuration memory programmable via JTAG
2 Stars
SoM with AMD Zynq™ 7030-1I incl. Heat Spreader
The Trenz Electronic TE0745-03-71I31-AK are industrial-grade SoC modules integrating a AMD/Xilinx Zynq™ 7030, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips. This module is identical with TE0745-03-71I31-A except the mounted heat spreader. All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants. All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options. #Module #part
5 Uses
1 Star
CH32X035F7P6
The CH32X035/X033 series, developed by WCH, encompasses industrial-grade microcontrollers based on the QingKe RISC-V core. These microcontrollers, including models such as the CH32X035R8T6, CH32X035C8T6, CH32X035G8U6, CH32X035G8R6, CH32X035F8U6, CH32X035F7P6, and CH32X033F8P6, are equipped with integrated USB and PD PHY, supporting USB Host and Device functionalities, as well as PDUSB and Type-C fast charging capabilities. The series features a programmable protocol I/O controller, two groups of operational amplifiers (OPA), three groups of comparators (CMP), four USARTs, I2C, SPI, multiple timers, a 12-bit ADC, and 14-channel capacitive touch-key interfaces, among other peripherals. These microcontrollers offer a comprehensive suite of features, including a 32-bit QingKe RISC-V4C core with support for the RV32IMAC instruction set, fast interrupt handling, and low-power modes, making them suitable for a wide range of embedded applications. With a robust memory architecture comprising 20KB SRAM and 62KB CodeFlash, alongside various power management and security features, the CH32X035/X033 series is designed to deliver high performance and flexibility for industrial applications.
3 Uses
1 Star
