Interface ICs
An interface IC is a type of integrated circuit that is designed to facilitate communication between two devices or systems. These devices are commonly used in electronic systems to enable the transfer of data and control signals between different components or subsystems. Some common use cases for interface ICs include connecting microcontrollers to peripherals such as sensors or displays, linking multiple processors together in a network, and enabling communication between devices using different communication protocols. Flux.ai has the world's largest community-driven public library of interface ICs, with footprints, symbols, datasheets, and simulation models. This library is a valuable resource for engineers and designers who need access to accurate and up-to-date information on these important components. Whether you are working on a new design project or simply looking to learn more about interface ICs, Flux.ai is an excellent resource to help you find the information you need.
STM32MP257FAI3
MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2
35 Uses1 StarsBME280
Humidity, Pressure, Temperature 0 ~ 100% RH I²C, SPI ±3% 1 s Surface Mount BME280 I2C breakout module The BME280 integrates three sensors—temperature, relative humidity, and pressure—along with a high-performance digital interface. It communicates via I²C or SPI, making it easy to interface with microcontrollers like Arduino, ESP32, and STM32. It is designed for low power consumption, making it suitable for battery-powered applications such as portable weather stations and smart home devices. Key Features Environmental Sensing Measures: Temperature Relative Humidity Barometric Pressure Enables altitude estimation based on pressure readings High Accuracy Temperature: ±1.0°C (typical) Humidity: ±3% RH (typical) Pressure: ±1 hPa (typical) Low Power Consumption Typical current: ~0.6 µA (sleep mode) ~3.6 µA (measurement mode) Ideal for battery-operated devices Communication Interfaces Supports: I²C (up to 3.4 MHz) SPI (3-wire / 4-wire) Easy integration with most microcontrollers Compact Package Small footprint: 2.5 × 2.5 × 0.93 mm LGA package Suitable for space-constrained designs Built-in Features Factory-calibrated coefficients stored in NVM Configurable oversampling and filtering Integrated ADC for high-resolution measurements #commonpartslibrary #sensor #humidity #pressure
317 Uses1 Stars
