Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

Welcome to your new project. Imagine what you can build here.

Welcome to your new project. Imagine what you can build here.

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

The FDB1D7N10CL7 is an N-Channel Shielded Gate POWERTRENCH® MOSFET manufactured by ON Semiconductor. This advanced MOSFET leverages ON Semiconductor's POWERTRENCH process, incorporating Shielded Gate technology to deliver minimized on-state resistance and superior switching performance with a high-quality soft body diode. The component features a maximum drain-to-source voltage (VDS) of 100 V and can handle continuous drain currents up to 268 A at 25°C. It boasts a low RDS(on) value of 1.7 mΩ at a gate-to-source voltage (VGS) of 12 V and drain current (ID) of 100 A, making it highly efficient for power management applications. Key applications include industrial motor drives, power supplies, automation, battery-operated tools, solar inverters, and energy storage systems. The FDB1D7N10CL7 is housed in a robust D2PAK7 (TO-263 7 LD) package and is designed to withstand a wide range of operating temperatures from -55°C to +175°C.

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

The IPB017N10N5LF is a high-performance N-channel MOSFET from Infineon's OptiMOS™ 5 Linear FET series, designed specifically for hot-swap and e-fuse applications. This 100 V component, housed in a D2-PAK 7pin package (PG-TO 263-7), features exceptionally low on-resistance (RDS(on)) and a wide safe operating area (SOA), making it ideal for demanding power management tasks. The device is rated for a continuous drain current of up to 180 A (silicon limited) and 314 A (package limited), with a maximum pulsed drain current of 720 A. It supports gate-source voltages ranging from -20 V to 20 V and is 100% avalanche tested, ensuring robust performance under extreme conditions. The IPB017N10N5LF is RoHS compliant, Pb-free, and halogen-free, adhering to environmental standards. Key electrical characteristics include a maximum RDS(on) of 1.7 mΩ at VGS=10 V and a gate threshold voltage range of 2.5 V to 4.1 V. This MOSFET is suitable for applications requiring high efficiency and reliability, supported by its qualification according to JEDEC standards.

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick