Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Raspberry Pi Pico 2 W features 2.4GHz 802.11n wireless LAN and Bluetooth 5.2, giving you even more flexibility in your IoT or smart product designs and expanding the possibilities for your projects. And equipped with the RP2350, a cutting-edge, high-performance microcontroller designed with enhanced security and versatility in mind. #raspberrypi #newpico #pipico2 #pipico #rp2350 #shield #pipico2W #wifi #bluetooth