Nexperia USA Inc. BZT52-B16X, Zener Diode 16 V 590 mW ±1.88% Surface Mount SOD-123

USA flag PCB logo #logo #USA #flag

Connector Header Through Hole 4 position 0.100" (2.54mm) UART header 1x4 2.54mm Single-row, through-hole male pin header with 4 positions and 2.54 mm pitch. Designed for board-to-wire or board-to-board interconnect applications such as UART interfaces. Mechanical Specifications Number of Positions: 4 Number of Rows: 1 Pitch: 2.54 mm (0.100") Mounting Style: Through Hole Mounting Angle: Straight (Vertical) Contact Gender: Male (Pin) Termination Type: Solder Pin Housing Material: Polybutylene Terephthalate (PBT) Housing Color: Black Electrical Specifications Current Rating: 4.3 A – 6.3 A (per pin, depending on conditions) Voltage Rating: 450 VAC – 550 VAC Contact Resistance: (Typical for series, not specified exact) Insulation Resistance: (Not specified) Material & Plating Contact Material: Phosphor Bronze Contact Plating: Gold Flammability Rating: UL94 V-0 Environmental & Compliance RoHS Compliance: Yes Country of Origin: USA Packaging Packaging Type: Bulk Factory Pack Quantity: 1 Series Information Series: TSW (Samtec Pin Strip Header Series) Product Type: Headers & Wire Housings Typical Applications UART / Serial communication headers Microcontroller programming interfaces General-purpose 2.54 mm interconnects Prototyping and development boards #commonpartslibrary #connector

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

2022-04-25 IRM-10-12 IPC 7351B 21.5 mm MEAN WELL USA

DHVQFN16 Nexperia USA 74HC Series 6 V 3-State Surface Mount 8-Bit Serial Shift Register - DHVQFN-16 DHVQFN16-16 Nexperia USA Inc. None https://www.snapeda.com/parts/74HC595BQ,115/Nexperia/view-part/?ref=snap 74HC595BQ,115 https://www.snapeda.com/api/url_track_click_mouser/?unipart_id=43259&manufacturer=Nexperia USA&part_name=74HC595BQ,115&search_term=74hc595bq115 In Stock https://www.snapeda.com/parts/74HC595BQ,115/Nexperia/view-part/?ref=eda

Official status tracker for Olive Young Promo Code 2026: OYLUXE7. Verified active for February 2026. Save up to 20% on Global orders (USA, UK, Canada, Australia).

QFP50P1200X1200X160-64N LQFP-64 NXP Semiconductors NXP USA None MK22FN1M0VLH12 ARM® Cortex®-M4 Kinetis K20 Microcontroller IC 32-Bit 120MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) Not in stock Aliases: undefined

USB Connectors USA2AD-04BS1YN10HF USB-A-TH_USA2AD-04BS1YN10HF LCSC Part Number: C717658 JLCPCB Part Class: Extended Part Manufactured by DLK(德力康)

Aluminum Electrolytic Capacitors - Leaded USA0J101MDD CAP-TH_BD6.3-P2.50-D1.0-FD LCSC Part Number: C250982 JLCPCB Part Class: Extended Part Manufactured by Nichicon(尼吉康)

ARM® Cortex®-M0+ STM32G0 Microcontroller IC 32-Bit Single-Core 64MHz 32KB (32K x 8) FLASH 8-SOIC The STM32G031J6M6 is a compact, low-power 32-bit microcontroller from STMicroelectronics, based on the Arm® Cortex®-M0+ core running at up to 64 MHz. It belongs to the STM32G0 series, designed for cost-sensitive and energy-efficient embedded applications. This MCU integrates essential peripherals, memory, and system functions into a small package (8-pin SOIC), making it suitable for consumer electronics, industrial control, appliances, and IoT devices where space and power efficiency are critical. Key Features Core & Performance 32-bit Arm Cortex-M0+ CPU Up to 64 MHz clock frequency Memory Protection Unit (MPU) for improved reliability and security 💾 Memory 32 KB Flash memory (program storage) 8 KB SRAM Flash protection (read/write protection, secure area) Peripherals & Interfaces Communication: I2C (2x) SPI (2x) / I2S USART (2x) + Low-power UART 12-bit ADC (up to ~2.5 MSps, multiple channels) DMA controller (5 channels) Timers: Advanced PWM timer (motor control capable) General-purpose timers (16-bit & 32-bit) Low-power timers Watchdog timers RTC (Real-Time Clock) with VBAT backup Power & Efficiency Operating voltage: 1.7 V to 3.6 V Multiple low-power modes: Sleep, Stop, Standby, Shutdown Optimized for low energy consumption (battery-powered designs) I/O & Package Up to 44 GPIOs (depending on package) 6 GPIOs available in the 8-pin (J6M6) package 5V-tolerant I/O pins (select pins) Compact SOIC-8 package#commonpartslibrary #integratedcircuit #microcontroller

Tactile Switch SPST-NO Top Actuated Surface Mount. The PTS636 series is a small 6.0 x 3.5 form factor in SMT version with 3 different heights and 4 available actuation forces, ideal for general usage applications. It also included ground pin options on 2.5 mm height version.

Battery Holder (Open) 9V 1 Cell PC Pin 9V battery holder through hole The BH9VPC is a through-hole, printed circuit board–mount battery holder designed to accommodate a single standard 9 V (PP3) battery. It provides a secure mechanical enclosure and reliable electrical interface for powering electronic assemblies directly from a PCB. The holder is constructed from durable insulating material with integrated metal contacts to ensure stable retention and consistent electrical connection during operation. Its form factor supports straightforward integration into compact designs while maintaining ease of battery replacement. Engineering Specification: The component is intended for through-hole mounting using PC pins that provide both mechanical stability and electrical connection to the circuit board. It supports one 9 V battery with standard snap terminal interface internally routed to PCB pins. The housing material is typically molded plastic with good mechanical strength and electrical insulation properties suitable for general electronic applications. Contact terminals are metal, commonly nickel-plated or equivalent, to ensure low contact resistance and corrosion resistance over repeated battery insertions. The holder is designed for vertical mounting orientation relative to the PCB, with a compact footprint suitable for space-constrained layouts. It provides sufficient retention force to secure the battery under normal handling and vibration conditions encountered in consumer and light industrial electronics. The operating characteristics are aligned with typical 9 V battery usage, supporting low to moderate current applications depending on battery capability. The part is compatible with standard wave soldering processes used in through-hole assembly. It is intended for use in ambient environmental conditions typical of indoor electronic equipment and is not inherently sealed against moisture or contaminants. The design allows easy manual insertion and removal of the battery without specialized tools, supporting maintenance and replacement in field applications. #commonpartslibrary #batteryholder

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 14KB (8K x 14) FLASH 40-PDIP The PIC16F877A-I/P is a high-performance 8-bit microcontroller from Microchip Technology, based on a Harvard architecture with separate program and data memory buses. It is designed for a wide range of embedded applications requiring reliable processing, multiple communication interfaces, and analog capability. The device integrates Flash program memory, EEPROM data storage, and numerous peripherals including ADC, timers, serial communication modules, and PWM functions. Packaged in a 40-pin PDIP form factor, it is widely used in industrial automation, consumer electronics, and educational development systems. Core Features 8-bit PIC microcontroller architecture Harvard architecture with RISC instruction set Operating frequency up to 20 MHz Single-cycle instruction execution (except branches) Memory Program Memory: 8K words (Flash) Data Memory (RAM): 368 bytes EEPROM Data Memory: 256 bytes I/O Features Up to 33 programmable I/O pins Multiple input/output ports (PORTA, PORTB, PORTC, PORTD, PORTE) High current sink/source capability on selected pins Analog Features 10-bit Analog-to-Digital Converter (ADC) Up to 8 analog input channels Programmable voltage reference Timers and Control Three timers (Timer0, Timer1, Timer2) Capture/Compare/PWM (CCP) modules Watchdog Timer (WDT) Power-on Reset (POR) and Brown-out Reset (BOR) Communication Interfaces USART (Universal Synchronous/Asynchronous Receiver/Transmitter) SPI (Serial Peripheral Interface) I²C (Inter-Integrated Circuit) via MSSP module Electrical Characteristics Operating Voltage: 4.0V to 5.5V Operating Temperature Range: -40°C to +85°C (Industrial grade) Low power consumption modes available Package Information Package Type: PDIP (Plastic Dual Inline Package) Pin Count: 40 pins Mounting Type: Through-hole Applications Industrial control systems Embedded automation Consumer electronics Sensor interfacing and data acquisition Educational and prototyping platforms #commonpartslibrary #integratedcircuit #microcontroller

2 Position Board Side/Socket - Closed 5.08mm Pitch Right-Angle Pin The WJ2EDGRC-5.08-02P-14-00A is a 2-position pluggable terminal block (screw-type connector) with a 5.08 mm pitch, commonly used for PCB power and signal connections. It is part of the EDGRC series designed for reliable wire-to-board connectivity in industrial, automation, and power electronics applications. It allows secure cable termination using screw clamps and is designed for easy plug-in/out mating with a corresponding header on a PCB. Key Features Type: Pluggable terminal block (female plug) Pin count: 2 positions Pitch: 5.08 mm Connection method: Screw clamp / rising cage clamp Mounting style: Through-hole (mates with PCB header) Wire termination: Suitable for solid and stranded wires High reliability contact design for stable electrical connection Detachable plug-in design for easy maintenance and replacement High current capability (typical for 5.08 mm pitch terminal blocks) Industrial-grade insulation material for durability and safety Wide usage: Power supply input, motor control, industrial I/O, and general PCB wiring #CommonPartsLibrary #Connector #Terminal block

Espressif’s ESP8266EX delivers highly integrated Wi-Fi SoC solution to meet users’ continuous demands for efcient power usage, compact design and reliable performance in the Internet of Things industry. With the complete and self-contained Wi-Fi networking capabilities, ESP8266EX can perform either as a standalone application or as the slave to a host MCU. ESP8266EX integrates antenna switches, RF balun, power amplier, low noise receive amplier, lters and power management modules. TheQFN50P500X500X80-33N

Wio-E5-LE module has a single-core STM32WLE5JC chip, Cortex M4 MCU, and SX126X. It uses 84% less power for transmission compared to the Wio-E5. The ultra-low power consumption of the Wio-E5-LE makes it very energy efficient, this power-saving design makes the Wio-E5-LE well-suited for applications needing minimal power usage.

LED Driver IC 16 Output Linear PWM Dimming 25mA 5.5V 28-TSSOP PCA9685PW,118 is a 16-channel, 12-bit PWM LED controller with an I²C interface designed for LED dimming, RGB/RGBA lighting, and servo motor control applications. It provides independent PWM control for up to 16 outputs, allowing precise brightness or position control while minimizing MCU GPIO usage. The device supports Fast-mode Plus I²C communication up to 1 MHz and operates from a 2.3 V to 5.5 V supply range. It is commonly used in robotics, LED backlighting, automation systems, and PWM expansion modules for microcontrollers such as Arduino, ESP32, and Raspberry Pi. Key Features 16 independent PWM output channels 12-bit PWM resolution (4096 steps) Programmable PWM frequency from approximately 24 Hz to 1526 Hz I²C Fast-mode Plus compatible interface up to 1 MHz Six hardware address pins allowing up to 62 devices on one I²C bus Programmable open-drain or totem-pole outputs Output capability: 25 mA sink current 10 mA source current Internal 25 MHz oscillator with optional external clock input Individual programmable LED ON/OFF timing for reduced EMI and current surges Supports software reset and group addressing (All Call/Sub Call) 5.5 V tolerant inputs and outputs Operating voltage range: 2.3 V to 5.5 V Package: 28-pin TSSOP (PW suffix) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #LEDdriver

MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2

Mainstream Arm Cortex-M0+ MCU with 32 Kbytes of Flash memory, 6 Kbytes RAM, 48 MHz CPU, 2x USART, timers, ADC, comm. I/F, 2-3.6V #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32C0

Power Switch/Driver 1:1 N-Channel 1.35A 28-WQFN (4x5) The TPS274160 device is a smart high-side switch with four integrated 160-mΩ NMOS power FETs and a chargepump to drive the gates. The device offers robust protection and diagnostic features to drive various loads (inductive, capacitive, and resistive) such as low wattage bulbs, LEDs, relays, solenoids, heaters, and sub-modules. The part enables flexible, multi-channel output configurations through paralleling channels and is in a very small WQFN package to enable usage in space constrained applications. The device is protected against short circuit events and over-temperature events, safely shutting off the output during fault events. The device also implements an external adjustable current limiting feature. This feature improves the reliability of the system by reducing inrush current when driving large capacitive loads and minimizing overload current thereby eliminating system supply brown out condition. The device also integrates diagnostic features like output current monitoring (version B) and open load detection to enable improved intelligence in modules and to enable predictive maintenance functionality. • Quad-channel 160-mΩ smart high-side switch • Wide DC operating voltage range: 5 V to 36 V – 50-V absolute maximum voltage • Accurate adjustable current limiting (250 mA to 4 A) • Intelligent diagnostic features – TPS274160A: Open-drain fault output – TPS274160B: Analog current sense – Open-load or short to supply detection in the off-state • Robust protection features – Short-circuit protection – Inductive load flyback clamp – Undervoltage lockout (UVLO) protection – Loss of GND protection • Excellent ESD protection on VS and OUT pins – ±8/±15 kV IEC 61000-4-2 ESD contact/air discharge • Available in small and 28-pin leadless QFN packages • Functional Safety-Capable – Documentation available to aid functional safety system design 2 Applications • Digital output modules • Standalone remote I/O • Motor drives • Solenoid or valve drive #TexasInstruments #TPS274160BRLHR #HighSideSwitch #SmartSwitch #IndustrialAutomation #PowerManagement #LoadDriver #CurrentLimiting #ProtectionIC #IndustrialControl #RemoteIO #SolenoidDriver #MotorDrive #EmbeddedSystems #ElectronicsDesign

ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) # STM32H573ZIT6 ## General Description The STM32H573ZIT6 is a high-performance microcontroller from STMicroelectronics based on the Arm Cortex-M33 core. It is designed to deliver advanced processing capability, enhanced security, and extensive peripheral integration for industrial, medical, consumer, communications, and embedded control applications. The device combines powerful computational performance with low-power operation, making it suitable for real-time control, edge computing, human-machine interfaces, industrial automation, IoT gateways, motor control systems, and secure connected devices. Integrated security features, high-speed memory architecture, and comprehensive communication interfaces enable the development of robust and scalable embedded solutions. ## Key Features ### Processing Architecture * Arm Cortex-M33 processor core * TrustZone security architecture * Digital signal processing capabilities * Floating-point computation support * Optimized real-time processing performance ### Memory Resources * Embedded Flash memory * Integrated SRAM architecture * Error correction capability for enhanced reliability * High-speed memory access structure ### Security Features * Secure boot functionality * Hardware cryptographic accelerators * Secure firmware update support * Memory protection mechanisms * Tamper detection capabilities * Trusted execution environment * Secure key management support ### Communication Interfaces * USART and UART communication interfaces * SPI serial communication interfaces * I²C communication interfaces * CAN FD connectivity * USB connectivity support * Ethernet interface capability * SDMMC memory card interface * Flexible external communication options ### Analog Features * High-performance analog-to-digital conversion * Digital-to-analog conversion capability * Analog comparators * Precision signal acquisition support ### Timer and Control Functions * Advanced control timers * General-purpose timers * PWM generation capability * Encoder interface support * Motor-control functionality * Real-time clock integration ### Power Characteristics * Low-power operating modes * Dynamic power optimization * Battery-powered application support * Efficient performance-to-power ratio ### Package Characteristics * LQFP package construction * Surface-mount technology compatibility * Industrial-grade mechanical design * Suitable for automated assembly processes ### Application Areas * Industrial Automation Systems * Motor Control Equipment * Human-Machine Interfaces * Smart Energy Systems * Medical Electronics * IoT Gateways * Secure Embedded Devices * Industrial Networking Equipment * Building Automation Systems * Consumer Electronics * Data Acquisition Systems * Edge Computing Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial and Commercial Application Support ## Manufacturer STMicroelectronics ## Product Family STM32H5 Series High-Performance Microcontrollers #STM32H573ZIT6 #STM32H5 #STMicroelectronics #CortexM33 #Microcontroller #EmbeddedSystems #IndustrialAutomation #SecureMCU #IoT #EdgeComputing #MotorControl #EmbeddedDesign #ElectronicsEngineering #FirmwareDevelopment #IndustrialElectronics

Enclosed AC DC Converters 2 Output 15V 340mA, 340mA 80 ~ 305 VAC Input The RAC10-K/277 series are highly efficient PCB-Mount power conversion modules with ultra-low energy losses even in light load conditions. Built for worldwide usage, the AC/DC units cover an enhanced mains input range of 85VAC up to 305VAC and come with international safety certifications for both industrial and household standards. These AC/DC modules offer fully protected single or dual outputs as well as EMC Class B compliance without the need of any external components. The 140% peak power capability makes the RAC10-K/277 series suitable for inductive, high start-up current or nonlinear loads. With a full load temperature range of -40°C to +65°C, they are ideal for always on and standby mode operations in process automation, IoT and smart building applications. Input voltage: 85 VAC to 305 VAC (wide-range, including 277 VAC industrial lines) Output: Dual output (±15 V DC) Power rating: 10 Watts Isolation: Fully isolated AC to DC conversion Encapsulation: Fully sealed/potted module for safety and reliability #CommonPartsLibrary #power-supply #RAC10-15

1000 pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1808 (4520 Metric) ## Engineering Specification ## General Description The **C4520X7R3D102K130KE** is a TDK multilayer ceramic chip capacitor designed for high-voltage surface-mount applications. It uses X7R dielectric material and is suitable for circuits requiring stable ceramic capacitance, compact PCB mounting, and reliable high-voltage performance. The component is commonly used in power supplies, filtering circuits, coupling circuits, snubber networks, voltage multiplier circuits, and general electronic assemblies requiring a high-voltage MLCC solution. ## Device Identification Manufacturer Part Number: **C4520X7R3D102K130KE** Manufacturer: **TDK Corporation** Product Series: **C Series** Device Category: **Passive Electronic Component** Device Type: **Multilayer Ceramic Chip Capacitor** Capacitor Type: **Surface-Mount MLCC** Application Grade: **Commercial Grade** ## Functional Description The device functions as a fixed-value ceramic capacitor for energy storage, noise suppression, coupling, decoupling, and filtering applications. It is designed to provide capacitance in a compact surface-mount package while supporting high-voltage operation. The X7R dielectric provides usable capacitance stability across a wide operating temperature range, making the component suitable for many general-purpose and power-related electronic designs. ## Electrical Description The capacitor has a nominal capacitance of **1000 pF** with **±10% tolerance** and a rated voltage of **2000 V DC**. It uses **X7R dielectric characteristics**, making it suitable for applications where moderate capacitance stability and high-voltage capability are required. The device should be operated within the manufacturer’s specified electrical limits to maintain reliability and performance. ## Mechanical Description The component is supplied in a **C4520 metric package**, equivalent to **EIA 1808** chip size. It is designed for surface-mount PCB installation using reflow soldering. The package includes soft termination construction, which helps reduce mechanical stress on the ceramic body and solder joints during board flexing or thermal cycling. ## Material and Construction Description The device is constructed as a multilayer ceramic capacitor using ceramic dielectric layers and internal electrode structures. The soft termination design improves board-level reliability by helping absorb mechanical strain between the PCB and capacitor body. This construction is useful in applications where vibration, thermal expansion, or board bending may affect component reliability. ## Mounting and Assembly Description The capacitor is intended for surface-mount assembly using reflow soldering. PCB land pattern, solder paste volume, component placement, and reflow profile should follow TDK recommendations. Proper spacing, voltage clearance, and creepage considerations should be applied because the component is used in high-voltage circuits. ## Application Suitability The **C4520X7R3D102K130KE** is suitable for high-voltage filtering, DC blocking, coupling, decoupling, power supply circuits, snubber circuits, inverter circuits, lighting equipment, industrial electronics, measurement equipment, and general PCB assemblies requiring a compact high-voltage ceramic capacitor. ## Design Considerations The design should account for rated voltage, capacitance tolerance, DC bias behavior, temperature characteristics, insulation resistance, soldering conditions, mechanical stress, board flex, creepage distance, and clearance distance. For high-voltage applications, PCB layout should provide adequate spacing and avoid contamination paths that may reduce insulation performance. The capacitor should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #capacitor #ceramiccapacitor #mlcc #tdk #tdkcapacitor #cseries #c4520 #x7r #highvoltagecapacitor #smdcapacitor #surfacemount #passivecomponent #electronicparts #electronicscomponents #pcbdesign #hardwaredesign #powersupply #filteringcircuit #snubbercircuit #decouplingcapacitor #industrialelectronics #componentlibrary #engineeringparts #electronicsengineering

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering