Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

16 Bit Digital to Analog Converter 1 40-VQFN (6x6) The DAC81416RHAT is a precision, low-power, multi-channel digital-to-analog converter designed for high-accuracy industrial and instrumentation applications. It integrates sixteen independently programmable voltage-output DAC channels with internal precision reference support, output buffering, and flexible serial communication capability. The device is optimized for systems requiring deterministic analog signal generation, high linearity, low drift, and stable long-term performance. Typical applications include automated test equipment, process control, programmable logic controllers, data acquisition systems, and closed-loop control platforms. The device supports high-resolution output generation with monotonic behavior and excellent channel-to-channel matching. Integrated diagnostic and protection features improve system reliability in harsh operating environments. The architecture is intended for dense analog output designs where low power consumption, compact footprint, and precision accuracy are critical. Engineering Specification Manufacturer: Texas Instruments Device Type: Multi-Channel Precision Voltage Output Digital-to-Analog Converter Package Type: VQFN Mounting Type: Surface Mount Channel Configuration: Sixteen independent DAC output channels DAC Resolution: High-resolution precision architecture suitable for industrial control and instrumentation systems Output Type: Buffered voltage output Interface Type: SPI-compatible serial interface Reference Support: Internal reference with external reference capability Power Supply Operation: Single-supply analog and digital operation Output Characteristics: Rail-to-rail capable buffered analog outputs with low glitch energy and fast settling behavior Linearity Performance: High integral and differential linearity with monotonic output behavior across full operating range Noise Performance: Low output noise and low temperature drift for precision signal generation Update Capability: Simultaneous and asynchronous channel update support Calibration Features: Integrated gain and offset correction support Diagnostic Features: Communication integrity monitoring and fault detection capability Industrial Features: Designed for precision automation, process control, programmable instrumentation, and multi-channel analog control systems Temperature Range: Industrial operating temperature range Protection Features: Robust serial interface handling and stable output drive architecture for industrial environments Applications: Industrial automation, programmable power control, automated test equipment, data acquisition systems, instrumentation, and closed-loop analog control platforms #commonpartslibrary #integratedcircuit #analog #digital #converter

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 6.25Hz ~ 200Hz 12-LGA (2.2x2.3) The ADXL367BCCZ-RL7 is an ultra-low power, three-axis MEMS accelerometer developed by Analog Devices for motion sensing applications requiring extremely low energy consumption and high measurement stability. The device integrates precision acceleration sensing, embedded motion detection capabilities, and intelligent power management features within a compact surface-mount package suitable for portable and battery-operated systems. The accelerometer supports both I²C and SPI digital communication interfaces, enabling flexible integration with embedded processors, microcontrollers, and sensor hubs. Its architecture is optimized for continuous motion monitoring while maintaining exceptionally low current consumption, making it ideal for wearable electronics, asset tracking devices, medical monitoring equipment, industrial sensing systems, and Internet of Things platforms. The device incorporates embedded activity, inactivity, and wake-up detection functions that allow host processors to remain in low-power states until significant motion events occur. Integrated FIFO buffering and programmable interrupt functionality reduce processor overhead and improve overall system efficiency. The ADXL367BCCZ-RL7 is designed for robust operation across a wide operating temperature range and maintains high measurement accuracy with low noise and excellent long-term stability. The compact LGA package enables dense PCB layouts for space-constrained designs. Key Features Motion Sensing Three-axis digital accelerometer Selectable acceleration measurement ranges High-resolution motion detection Low noise sensing architecture Integrated temperature sensor Power Management Ultra-low power operation optimized for battery-powered systems Multiple operating and standby modes Autonomous motion-triggered wake-up capability Efficient duty-cycling support Digital Interfaces Supports SPI communication Supports I²C communication Programmable interrupt outputs Embedded FIFO data buffering Embedded Detection Functions Activity detection Inactivity detection Motion-triggered interrupt generation Autonomous wake-up monitoring Mechanical and Environmental Compact LGA surface-mount package High shock tolerance Wide operating temperature capability Suitable for portable and industrial environments Electrical Characteristics Supply Requirements Low-voltage digital supply operation Optimized for low-current embedded systems Stable operation across supported voltage range Sensor Performance High sensitivity stability Low offset drift Low output noise density Configurable output data rates Communication and Control Supported Interfaces SPI serial interface I²C serial interface Programmability Configurable measurement ranges Adjustable output data rates Programmable interrupt mapping FIFO configuration support Package Information Package Type LGA surface-mount package Mounting PCB surface mount compatible Suitable for automated assembly processes Typical Applications Wearable electronics Health and fitness monitoring Portable instrumentation Asset and condition monitoring Industrial sensing systems IoT sensor nodes Motion-activated devices Battery-powered embedded systems #commonpartslibrary #integratedcircuit #accelerometer #sensor