High precision Balanced Modulator/Demodulator, 2 MHz, SOIC-20W modulator demodulator SOIC*7.5x12.8mm*P1.27mm*

RF IC Modulator/Demodulator FM 300MHz 14-SOIC #CommonPartsLibrary #IntegratedCircuit #RF Modulator #Demodulator #MC1496

RF Demodulator IC 450MHz ~ 2.8GHz 56-WFQFN Exposed Pad, CSP #commonpartslibrary #integratedcircuit #rf #demodulator

RF Demodulator IC 400MHz ~ 4GHz 24-WFQFN Exposed Pad #CommonPartsLibrary #IntegratedCircuit #RF #Demodulator #LTC5585

RF Demodulator IC 40MHz ~ 500MHz 16-WQFN Exposed Pad #CommonPartsLibrary #IntegratedCircuit #RF #Demodulator

Balanced modulator and demodulator 3.5-12V 30mA SIP-9

Infrared remote receiver TSOP36238TT SENSOR-SMD_TSOP36238TR LCSC Part Number: C3151601 JLCPCB Part Class: Extended Part Vishay IR receiver module for remote control systems, integrated PIN photodiode, preamplifier, AGC circuit, band-pass filter and demodulator in one epoxy package, 2.0V to 5.5V supply voltage, low supply current, digital output for direct MCU connection, high immunity to ambient noise from lamps, LCD TV and Wi-Fi, optimized for long-burst IR remote control applications. Search Keywords: Vishay IR receiver module, Vishay remote control IR receiver, Vishay TSOP IR receiver, Vishay TSSP IR receiver, IR receiver module, infrared receiver module, IR remote receiver, demodulating IR receiver, PIN diode preamplifier IR receiver, IR receiver with AGC, long burst IR receiver, 38kHz IR receiver, 36kHz IR receiver, 40kHz IR receiver, 2.0V to 5.5V IR receiver, MCU IR receiver Hashtags: #VishayIRReceiver #VishayTSOP #VishayTSSP #IRReceiver #InfraredReceiver #RemoteControlReceiver #IRRemoteReceiver #DemodulatingIRReceiver #PINPhotodiode #PreamplifierIRReceiver #AGCIRReceiver #LongBurstIRReceiver #38kHzIRReceiver #36kHzIRReceiver #40kHzIRReceiver #MCUInfraredReceiver

RF Modulators / Demodulator NSI1306M25-DSWVR SOP-8_L7.5-W5.9-P1.27-LS11.5-BL LCSC Part Number: C3029749 JLCPCB Part Class: Extended Part Manufactured by NOVOSENSE(纳芯微)

RF Demodulator IC 20MHz ~ 300MHz 32-VFQFN Exposed Pad The CMX973Q5 specification defines the engineering requirements for a radio frequency quadrature modulator integrated circuit designed for digital and analog wireless communication systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate signal modulation, high RF performance, and long-term operational reliability. The device is intended for use in wireless communication equipment, telemetry systems, software-defined radio platforms, digital data transmission equipment, industrial RF systems, and embedded communication applications requiring high-performance I/Q modulation. It provides precise conversion of baseband in-phase and quadrature signals into modulated RF output while maintaining excellent signal integrity, low distortion, and stable operation over a wide range of operating conditions. Engineering Requirements The RF modulator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical characteristics, reliable modulation accuracy, and dependable long-term performance. The device shall maintain stable operation under specified supply voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate in-phase and quadrature signal processing, low phase imbalance, high linearity, low noise, and excellent carrier suppression. The device shall maintain stable RF output characteristics and predictable modulation performance throughout continuous operation while minimizing harmonic distortion and unwanted spurious emissions. The integrated RF architecture shall support efficient signal conversion and reliable interface with external oscillators, filters, and communication circuitry. The device shall preserve signal integrity across the specified operating frequency range while supporting high-quality modulation for digital and analog communication protocols. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, modulation characteristics, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFModulator #QuadratureModulator #WirelessCommunication #RFIC #SignalModulation #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation