Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Connector Header Through Hole 6 position 0.100" (2.54mm) The 640456-6 is a 6-position, single-row wire-to-board header connector from TE Connectivity (AMP series), designed for reliable power and signal connections in a wide range of electronic applications. It features a 2.54 mm pitch and through-hole mounting for strong mechanical retention and ease of assembly. The connector is commonly used with matching crimp housings and terminals, providing a secure and serviceable interconnect solution for PCB-based systems. Key Features 6-position (1x6) header connector 2.54 mm pitch spacing Through-hole mounting (THT) Vertical (top-entry) orientation Friction-lock compatible with mating housings Tin-plated contacts for good conductivity and corrosion resistance Durable thermoplastic housing Mechanical Characteristics Mounting Type: Through Hole Orientation: Vertical (Top Entry) Pitch: 2.54 mm Number of Positions: 6 Row Configuration: Single row Mating Type: Friction fit with compatible housing Termination Type: Solder tails Electrical Characteristics Rated Current: Up to 3 A per contact (depending on wire gauge) Rated Voltage: 250 V AC/DC Contact Resistance: ≤ 20 mΩ (initial) Insulation Resistance: ≥ 1,000 MΩ Dielectric Withstanding Voltage: 1,000 VAC Material Specifications Housing: Thermoplastic, UL94V-0 rated Contacts: Copper alloy Contact Plating: Tin over nickel Environmental Specifications Operating Temperature Range: -40°C to +105°C Storage Temperature: -40°C to +105°C Packaging Information Packaging Type: Bulk or tray (varies by supplier) RoHS Compliant: Yes Lead-Free: Yes Compatible Components Mating Housing: TE Connectivity compatible crimp housings (e.g., AMP series) Crimp Terminals: соответствующие crimp contacts for 2.54 mm systems Typical Applications PCB interconnects Consumer electronics Industrial control systems Power and signal distribution Prototyping and development boards #CommonPartsLibrary #Connector #Header #Male-pins #MTA-100

This ground symbol behaves identically to the most popular ground symbol https://www.flux.ai/jharwinbarrozo/ground due to the "Part Type" property being set to "Ground." This means changing the designator has no effect on electrical connectivity. If you are trying to use a ground symbol for separate grounds (e.g. analog ground), please use this part https://www.flux.ai/nico/ground-portal or fork the part and change the "Part Type" property to "Portal". The corresponding docs page can be found [here](https://docs.flux.ai/tutorials/working-with-ground--basics--multiple-grounds--and-ground-fill-m)

Seeed Studio XIAO ESP32C3 adopts new RISC-V architecture, supporting both Wi-Fi and BLE wireless connectivity. For Internet of Things applications, you will find it is flexible and suitable for all kinds of IoT scenarios. #SeeedStudio #xiao

Tactile Switch SPST-NO Top Actuated Surface Mount The FSM1LP is a surface-mount tactile (momentary) switch manufactured by TE Connectivity under the ALCOSWITCH series. It is a low-profile, top-actuated pushbutton switch designed for compact PCB applications requiring reliable user input. This switch operates as a momentary SPST-NO (Single Pole Single Throw – Normally Open) device, meaning it only conducts when pressed and returns to open when released. Key Features Switch Type Tactile momentary (OFF–(ON)) pushbutton Contact Configuration SPST-NO (Normally Open) Mounting Type Surface Mount (SMD) with gull-wing leads Actuation Style Top-actuated round button Electrical Rating 50 mA @ 24 VDC Operating Force Approximately 1.57 N (~160 gf) Low Profile Design Compact height (~3–3.5 mm typical), suitable for slim devices Mechanical Life Around 100,000 cycles Contact Material Copper alloy with silver plating for reliable conductivity Compact Size Typically ~6 × 6 mm footprint RoHS Compliant Lead-free and environmentally compliant tactile switch momentary 4 pin smd #CommonPartsLibrary #Switch

Connector Header Through Hole 6 position 0.100" Pin Header 1x06 2.54mm PinHeader 1x6 2.54mm The TSW-106-07-G-S is a through-hole vertical header designed for board-to-board and board-to-wire interconnection in electronic systems. It is part of a precision connector series known for high reliability, consistent mechanical alignment, and excellent electrical performance. The component is commonly used in applications requiring modular connectivity, prototyping flexibility, and secure signal routing between printed circuit boards or peripheral interfaces. Its design supports repeated mating cycles while maintaining stable contact integrity, making it suitable for both development and production environments. Functional Description This component functions as a single-row header that provides a direct electrical interface between a printed circuit board and a mating connector or cable assembly. It enables straightforward signal or power routing through plated pins that are soldered into the PCB. The vertical orientation allows perpendicular mating, supporting compact and efficient board layouts. The connector is designed to ensure proper alignment and retention during mating, reducing the risk of intermittent connections. Electrical Characteristics The header supports low-voltage signal transmission and moderate current levels typical of board-level interconnects. It offers low contact resistance to maintain signal integrity and efficient current flow. The contact system is designed to provide consistent electrical performance across repeated insertions, ensuring reliability in both signal and power applications. Mechanical Characteristics The component features a robust insulating housing that maintains pin alignment and structural integrity during handling and operation. The contact pins are fabricated from conductive material and plated to enhance durability, conductivity, and مقاومت to corrosion. The through-hole mounting style provides strong mechanical anchoring to the printed circuit board, improving resistance to mechanical stress and vibration. The design supports reliable mating with compatible connectors and ensures long service life. Environmental Characteristics The TSW-106-07-G-S is constructed using materials that provide stable performance under typical environmental conditions encountered in electronic assemblies. It is designed to withstand standard temperature ranges and environmental stresses such as humidity and mechanical handling, maintaining electrical and mechanical reliability over time. Applications This header is widely used in embedded systems, industrial electronics, development platforms, communication equipment, and general-purpose PCB interconnect applications. It is especially suited for designs requiring modular connectivity, easy assembly, and dependable signal transfer. Summary The TSW-106-07-G-S from Samtec is a reliable through-hole header solution that combines mechanical durability with stable electrical performance. Its straightforward design, compatibility with standard interconnect systems, and suitability for a wide range of applications make it a common choice for board-level connectivity in modern electronic designs. #CommonPartsLibrary #Connector #Header #TSW

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount The ESP32-S3-WROOM-1U-N16R8 is a high-performance embedded module designed for IoT and edge computing applications, featuring integrated wireless connectivity and enhanced processing capabilities. Processor: Dual-core Xtensa LX7, up to 240 MHz Wireless Connectivity: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth LE 5.0 Memory Configuration (N16R8): 16 MB Flash memory 8 MB PSRAM Antenna Type: U.FL connector for external antenna (“1U” variant) Indicates support for an external antenna via U.FL connector Allows improved RF performance and flexible antenna placement #commonpartslibrary #rf #wireless #transceiver #module

2 Position Board Side/Socket - Closed 5.08mm Pitch Right-Angle Pin The WJ2EDGRC-5.08-02P-14-00A is a 2-position pluggable terminal block (screw-type connector) with a 5.08 mm pitch, commonly used for PCB power and signal connections. It is part of the EDGRC series designed for reliable wire-to-board connectivity in industrial, automation, and power electronics applications. It allows secure cable termination using screw clamps and is designed for easy plug-in/out mating with a corresponding header on a PCB. Key Features Type: Pluggable terminal block (female plug) Pin count: 2 positions Pitch: 5.08 mm Connection method: Screw clamp / rising cage clamp Mounting style: Through-hole (mates with PCB header) Wire termination: Suitable for solid and stranded wires High reliability contact design for stable electrical connection Detachable plug-in design for easy maintenance and replacement High current capability (typical for 5.08 mm pitch terminal blocks) Industrial-grade insulation material for durability and safety Wide usage: Power supply input, motor control, industrial I/O, and general PCB wiring #CommonPartsLibrary #Connector #Terminal block

2 Position Wire to Board Terminal Block Horizontal with Board 0.200" speaker terminal block 2 pin 5.08mm AK300/3 KF301-2P 5.08mm The 277-1247-ND connector is an electronic interconnect component intended for establishing reliable electrical connections between conductors or between a conductor and a printed circuit assembly. It is designed for ease of installation, secure retention, and consistent electrical performance in low- to moderate-power applications. The connector supports efficient wiring configurations while maintaining mechanical stability and minimizing contact resistance. It is suitable for use in prototyping, industrial assemblies, and general-purpose electronic systems where dependable connectivity and repeatable termination are required. Engineering Specification The connector shall provide a stable electrical interface capable of maintaining low contact resistance under specified operating conditions. It shall be constructed from materials that ensure adequate conductivity, corrosion resistance, and mechanical durability over its intended service life. The housing shall be fabricated from an insulating material with sufficient ताप resistance and dielectric strength to prevent electrical leakage or shorting during normal operation. The contact mechanism shall support secure wire or terminal engagement, preventing accidental disconnection due to vibration or handling. The connector shall accommodate compatible wire gauges within its rated range and ensure proper clamping or retention without causing conductor damage. Electrical ratings shall align with standard low-voltage applications, including defined limits for current and voltage handling. Mechanical dimensions shall conform to manufacturer-defined tolerances to ensure compatibility with mating components or mounting interfaces. The connector shall be designed for straightforward installation using common tools or manual insertion methods, depending on its termination style. Environmental performance shall include resistance to typical ambient conditions such as humidity and moderate temperature variation, without degradation of electrical or mechanical properties. The connector shall meet applicable industry standards for safety and performance where relevant. #CommonPartsLibrary #Connector #COMBICON MKDSN

2 Position Wire to Board Terminal Block Horizontal with Board 0.100" (2.54mm) Through Hole 1725656 – PCB-mounted screw terminal block designed for secure wire-to-board connections in industrial, control, automation, instrumentation, and power distribution applications. Features a screw-clamp termination system that provides reliable electrical contact and strong wire retention under vibration and demanding operating conditions. The through-hole construction offers enhanced mechanical stability, making it suitable for long-term field installations and high-reliability electronic assemblies. Designed to simplify wiring, maintenance, and system integration while ensuring dependable signal and power connectivity. #TerminalBlock #ScrewTerminal #WireToBoard #IndustrialElectronics #PowerDistribution #AutomationSystems #ControlPanels #ThroughHoleConnector #PCBConnector #ReliableConnectivity #connector #Terminalblock #tht

Seeed Studio XIAO ESP32C3 adopts new RISC-V architecture, supporting both Wi-Fi and BLE wireless connectivity. For Internet of Things applications, you will find it is flexible and suitable for all kinds of IoT scenarios. #SeeedStudio #xiao

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering