IEEE 802.3bt Type 4 Power over Ethernet (PoE) Powered Device Module – High-power isolated PoE Powered Device (PD) module for IP cameras, wireless access points, LED lighting, digital signage, industrial automation, access control, IoT gateways, and embedded networking applications. Fully compliant with IEEE 802.3bt Type 4, it accepts a 36 V to 57 V PoE input and delivers up to 85 W output power with selectable 12 V or 24 V regulated outputs and an adjustable output voltage. Features a high-efficiency isolated DC-DC converter (up to 89%), 1.5 kV input-to-output isolation, integrated PD detection and classification, low output ripple and noise, and comprehensive overload, thermal, and short-circuit protection. Designed to minimize external components for simplified PoE implementation, it is housed in a compact through-hole DIL module (70 × 35 × 17 mm) and operates over a −40°C to +85°C temperature range. #Silvertel #AG5800 #PoEPoweredDevice #IEEE8023bt #PowerOverEthernet #PDModule #IsolatedDCDC #IndustrialEthernet #IPCamera #LEDLighting #EmbeddedPower #EmbeddedSystems

Accelerometer X, Y, Z Axis ±3g 1.6kHz (X,Y), 550Hz (Z) 16-LFCSP-LQ (4x4) The ADXL335BCPZ is a small, thin, low-power, complete 3-axis accelerometer with signal-conditioned voltage outputs. It measures acceleration with a minimum full-scale range of ±3 g. The device outputs analog voltages proportional to acceleration in each of the three orthogonal axes (X, Y, and Z). The accelerometer is designed for low power consumption and high resolution, making it suitable for mobile devices, tilt sensing, motion detection, and vibration monitoring. It operates over a wide temperature range and requires minimal external components, enabling easy integration into compact systems. Functional Overview The ADXL335 uses a capacitive sensing structure to detect acceleration. Changes in acceleration result in differential capacitance changes, which are converted into voltage outputs through an internal signal conditioning circuit. Each axis provides an independent analog output that can be directly interfaced with ADC inputs of microcontrollers or other processing units. Bandwidth for each axis can be adjusted using external capacitors, allowing flexibility depending on application requirements. Electrical Characteristics Supply Voltage Range: 1.8 V to 3.6 V Supply Current: Typical: 350 µA Measurement Range: ±3 g Sensitivity (Typical): 300 mV/g Zero-g Bias Level: Approximately mid-supply voltage Bandwidth: User-selectable via external capacitors Typical range: X, Y axes: up to 1600 Hz Z axis: up to 550 Hz Output Characteristics Output Type: Analog voltage (ratiometric to supply voltage) Number of Axes: Three (X, Y, Z) Output Noise: Low noise suitable for precision motion sensing Cross-Axis Sensitivity: Typically ±1% Mechanical Characteristics Package Type: 16-lead LFCSP (Lead Frame Chip Scale Package) Dimensions: Approximately 4 mm × 4 mm × 1.45 mm Mounting: Surface mount Environmental Specifications Operating Temperature Range: −40°C to +85°C Shock Survivability: Up to 10,000 g Interface Requirements External Components: Requires capacitors for bandwidth setting (one per axis) Output Interface: Direct analog output compatible with ADC inputs Applications Mobile devices and handheld electronics Tilt and orientation sensing Vibration monitoring systems Gaming and motion input devices Industrial instrumentation Wearable electronics Key Features Low power consumption Compact form factor High resolution analog outputs User-adjustable bandwidth Wide operating temperature range Simple integration with minimal external components #commonpartslibrary #sensor #transducer #motionsensor #accelerometer

ARM® Cortex®-M0+ - Microcontroller IC 32-Bit Dual-Core 133MHz External Program Memory 56-QFN (7x7) Alternative MPN #SC0914(7) #SC0914(13) #RaspberryPi #Raspberry #Pi #RPi #Pico

The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications. This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D. Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash) #module #ESP32 #16MB

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

RF Module, ESP32 SoC, Wi-Fi 802.11b/g/n, Bluetooth, BLE, 32-bit, 2.7-3.6V, external antenna #RF #WiFi #BLE #ESP32 #commonpartslibrary