Connector Header Through Hole 22 position 0.100" (2.54mm) PinHeader_1x22_P2.54mm_Vertical General Description The TSW-122-07-G-S is a through-hole vertical pin header manufactured by Samtec. It is part of the TSW series, designed for board-to-board or wire-to-board interconnections. This component features a single-row configuration with standard 2.54 mm pitch spacing, making it widely compatible with common prototyping and production PCB designs. It is commonly used in embedded systems, development boards, and general-purpose electronic assemblies requiring reliable and cost-effective connectivity. Key Features Single-row vertical pin header Through-hole mounting style Standard 2.54 mm pitch spacing Tin-plated contacts for reliable electrical connection Black thermoplastic insulator housing Designed for board-to-board or cable interfacing Compatible with standard mating connectors and sockets Electrical Characteristics Current rating suitable for signal-level and low-power applications Contact resistance designed for stable electrical performance Insulation resistance suitable for typical PCB environments Mechanical Characteristics Number of positions: twenty-two Row configuration: single row Mounting type: through-hole Orientation: vertical Contact material: copper alloy Contact plating: tin Housing material: high-temperature thermoplastic Environmental Characteristics Operating temperature range suitable for industrial and commercial electronics RoHS compliant Designed for durability under normal handling and soldering conditions Applications Microcontroller and development boards Prototyping platforms Board-to-board interconnections Embedded systems General electronic assemblies #commonpartslibrary #connector #header

The NEO-6M-0-001 is a compact GPS receiver module based on the high-performance u-blox 6 positioning engine. It features a 50-channel GPS receiver with fast satellite acquisition and precise positioning (about ±2.5 m) and supports standard GPS communication protocols like NMEA and u-blox UBX. The module typically operates from 2.7 V to 3.6 V, communicates via UART/SPI/I²C interfaces, and is widely used in navigation, tracking, and embedded projects where reliable global positioning data is needed. #module

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSQ-110-03-T-D is a through-hole dual-row socket strip receptacle connector manufactured by Samtec, designed for board-to-board and pin header mating applications using the industry-standard pitch spacing that has been dominant in through-hole PCB interconnect design for decades. It belongs to Samtec's SSQ series, a family of square-post socket strip connectors that accept standard square-pin headers and are widely used across prototyping, instrumentation, test and measurement, embedded systems, industrial control, and general-purpose PCB stacking applications. As a socket strip of the receptacle gender, the SSQ-110-03-T-D is intended to receive a mating male pin header, creating a reliable and separable board-to-board or wire-to-board connection. The dual-row configuration provides a higher contact density within a given board length than a single-row socket, which is why dual-row socket strips in this pitch class are extensively used in applications such as microcontroller and single-board computer expansion connectors, module-to-baseboard interfaces, and other designs where a significant number of signal, power, or ground connections must be made across a single separable connector interface. The connector features square solder tails for through-hole PCB mounting, with the "-T" suffix in the part number designating the square post tail style, which provides a well-defined mechanical footprint and reliable solder joint formation in wave solder and hand-solder assembly processes. The "-D" suffix indicates the dual-row configuration. Contact material is phosphor bronze, a widely used spring-contact alloy chosen for its combination of good electrical conductivity, excellent spring properties that maintain consistent contact force across many mating cycles, and resistance to stress relaxation over time. The contacts are finished with matte tin plating over nickel underplate, providing a solderable, cost-effective contact surface suitable for the majority of general-purpose signal and low-power applications for which this connector class is typically used. The insulator body is molded from black liquid crystal polymer, a high-performance engineering thermoplastic that offers the high dimensional stability, excellent electrical insulation properties, and high-temperature resistance needed to withstand wave soldering and reflow-adjacent thermal exposure during PCB assembly. The material also carries a UL94 V-0 flammability rating, reflecting its self-extinguishing behavior in the event of an ignition source, which is required or preferred in many end-product regulatory compliance frameworks. The SSQ series is widely used in conjunction with Samtec's TSW series male pin headers as a complementary mating pair, and the connector is compatible with a broad range of standard square-pin headers from other manufacturers that conform to the same pitch and pin geometry, making it a versatile choice for general-purpose through-hole header applications. Spec Sheet Identification Part Number: SSQ-110-03-T-D Series: SSQ Manufacturer: Samtec, Inc. Connector Type / Configuration Type: Socket strip receptacle Gender: Female (receptacle) Row Configuration: Dual row Orientation: Straight, vertical Mounting Method: Through-hole, solder tail Contact & Material Properties Contact Material: Phosphor bronze Contact Finish — Mating Zone: Matte tin over nickel Contact Finish — Post/Tail: Tin Contact Type: Forked socket, square post acceptance Post/Tail Style: Square solder tail Mechanical Specifications Contact Pitch: Standard pitch class, widely used through-hole spacing Profile Height: Standard SSQ series mated height class Insulator Color: Black Insulator Material: Liquid crystal polymer (LCP) Flammability Rating: UL94 V-0 Body Orientation: Straight Electrical Ratings Current Rating Per Contact: Mid-range per-pin current class Voltage Rating: High AC and DC voltage rating class for general-purpose signal use Mating Cycles: Rated for repeated mate/unmate cycles Environmental & Qualification Operating Temperature Range: Extended range, suitable for industrial environments RoHS Compliance: Yes Export Classification: EAR99 Mating Compatibility Mates With: Samtec TSW series male pin headers and compatible standard square-pin headers from other manufacturers Application Note: Suitable for board-to-board stacking, module-to-baseboard interfaces, SBC expansion connectors, and general-purpose through-hole header applications Packaging Supply Format: Bulk packaging #SSQ110 #Samtec #SocketStrip #DualRowConnector #ThroughHoleConnector #PCBReceptacle #PinHeader #BoardToBoard #FemaleSockets #PhosphorBronze #LCP #UL94V0 #EmbeddedSystems #Prototyping #InstrumentationConnector #GeneralPurposeConnector #ConnectorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PCBDesign #CommonPartsLibrary #Connector #Header #Receptacle #Female-Socket #SSQ

ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign

Enclosed AC DC Converters 1 Output 5V 600mA 85 ~ 264 VAC, 120 ~ 370 VDC Input The RAC03-05SK is a compact, encapsulated AC/DC power supply module manufactured by RECOM Power. It is designed for PCB mounting and provides a regulated 5V DC output from a wide AC input range. This module is suitable for low-power industrial, IoT, and household applications requiring reliable isolated power conversion. It features high efficiency, short-circuit protection, and meets international safety standards. Key Specifications Electrical Characteristics Input Voltage Range: 85 – 305 VAC / 120 – 430 VDC Nominal Input Voltage: 100 – 240 VAC Output Voltage: 5 VDC Output Current: 600 mA (max) Output Power: 3 W Efficiency: ~72% (typical) Ripple & Noise: ≤ 100 mVp-p Isolation Voltage: 4000 VAC (input to output) Protection Features Continuous short-circuit protection Overcurrent protection Overvoltage protection Environmental Characteristics Operating Temperature Range: -40°C to +80°C Storage Temperature Range: -40°C to +85°C Humidity: Up to 90% RH (non-condensing) Mechanical Characteristics Mounting Type: Through-hole PCB Package Type: Encapsulated module Dimensions: Approx. 34.8 × 22.5 × 15 mm Weight: ~20 g Safety & Compliance Certified to IEC/EN/UL 62368-1 Reinforced insulation Class II design (no earth connection required) CE compliant Applications Industrial control systems Smart home devices IoT modules Embedded electronics Standby power supplies Manufacturer Information Manufacturer: RECOM Power Series: RAC03-K Part Number: RAC03-05SK #commonpartslibrary #powersupply #acdc #converter

9 Position D-Sub Receptacle, Female Sockets Connector 2311765-1 is a 9-position right-angle D-Sub receptacle connector from the TE Connectivity AMPLIMITE HD-20 series. It is designed for wire-to-board signal applications and features through-hole PCB mounting with an integrated boardlock and 4-40 screwlock for secure mechanical retention. The connector is commonly used in industrial equipment, communication systems, embedded controllers, and other electronic devices requiring a reliable D-Sub interface. Key Features 9-position D-Sub receptacle (female) Right-angle through-hole PCB mounting AMPLIMITE HD-20 series 2-row configuration 2.77 mm (0.109") contact pitch Boardlock for improved PCB retention 4-40 screwlock for secure mating Maximum contact current: 3 A per contact Glass-filled PBT housing Operating temperature: -55°C to +85°C Ideal for signal transmission in industrial and embedded applications. #CommonPartsLibrary #Connector #TEConnectivity #AMPLIMITE #DSub #RightAngleConnector #PCBConnector #ThroughHole #WireToBoard #SignalConnector #ElectronicComponents #EmbeddedSystems

ECP5 Field Programmable Gate Array (FPGA) IC 197 1990656 44000 256-LFBGA #CommonPartsLibrary #IntegratedCircuit #Embedded #FPGAs #ECP5 #LFE5U-45

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.5GHz 448-FBGA (17x17) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microprocessor #LS1028

6-axis IMU (inertial measurement unit) with high-g accelerometer, embedded AI, and sensor fusion for high-end applications, car crash detection Accelerometer, Gyroscope, Magnetometer, 6 Axis Sensor I2C, SPI Output #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducer #Motion-Sensor #IMUs #LSM6

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 14KB (8K x 14) FLASH 44-TQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16F877

ARM® Cortex®-M4 STM32F3 Microcontroller IC 32-Bit Single-Core 72MHz 64KB (64K x 8) FLASH 48-LQFP (7x7) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #STM32F303

Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-VQFN (3.5x5.5) The LM5148RGYR specification defines the engineering requirements for a synchronous buck controller integrated circuit designed for high-efficiency DC-DC power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable voltage regulation, efficient power management, and long-term operational stability in industrial, automotive, telecommunications, and embedded electronic systems. The device is intended for use in high-performance power supply designs requiring wide input voltage capability, precise output voltage regulation, and high-current conversion efficiency. It controls external power MOSFETs to implement synchronous buck converter topologies suitable for distributed power architectures, industrial automation equipment, networking infrastructure, battery-powered systems, and embedded control applications. Engineering Requirements The controller shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure stable switching performance, low power consumption, and reliable long-term operation. The device shall maintain consistent functionality under specified operating voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate pulse-width modulation control, stable output voltage regulation, fast transient response, and reliable gate drive capability for external synchronous power MOSFETs. The controller shall maintain predictable switching performance during startup, shutdown, overload, and dynamic load conditions while supporting efficient power conversion. The integrated control architecture shall provide robust regulation, protection features, and compensation capability to ensure stable converter operation across varying input voltages and output load conditions. The device shall maintain operational integrity during power sequencing and fault recovery without compromising system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical performance and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #BuckController #DCDCConverter #PowerManagement #SynchronousBuck #PowerElectronics #EmbeddedSystems #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

ARM® Cortex®-M7 STM32F7 Microcontroller IC 32-Bit Single-Core 216MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #STM32F722

Connector Header Through Hole 6 position 0.100" (2.54mm) The PEC06SAAN is a compact, low-cost incremental rotary encoder manufactured by Bourns. It is designed for user interface applications requiring precise rotational input, such as volume controls, menu navigation, and position sensing. This encoder provides reliable quadrature output signals and is suitable for through-hole PCB mounting. Its robust mechanical design ensures long operational life and consistent performance in consumer and industrial electronics. Key Features Incremental (relative) rotary encoder Compact, space-saving design Through-hole mounting configuration Quadrature output (A and B channels) Optional integrated push switch (depending on variant) Detent and non-detent options available High reliability with long rotational life RoHS compliant Electrical Characteristics Supply voltage: Typically 5 VDC (logic-level output) Output type: Digital quadrature (A/B signals) Contact resistance: ≤ 100 mΩ Insulation resistance: ≥ 100 MΩ @ 250 VDC Dielectric strength: 300 VAC for 1 minute Mechanical Characteristics Rotation type: Incremental Number of pulses per revolution (PPR): Typically 6 to 24 (variant dependent) Detent positions: Variant dependent Rotational torque: 10 to 70 gf·cm (typical range) Shaft length: Varies by suffix (e.g., 15 mm typical) Shaft type: Knurled or D-cut (variant dependent) Mounting type: Through-hole PCB Terminal type: PC pins Environmental Specifications Operating temperature range: −30°C to +70°C Storage temperature range: −40°C to +85°C Humidity: Up to 85% RH (non-condensing) Mechanical Life Rotational life: Up to 30,000 cycles (typical) Physical Dimensions Body size: Approximately 12 mm × 11 mm × 5 mm (excluding shaft) Shaft diameter: Typically 6 mm Pin pitch: Standard 2.54 mm Applications Consumer electronics (audio controls, appliances) Industrial control panels Embedded systems and microcontroller interfaces Automotive user interfaces Instrumentation and test equipment #commonpartslibrary #connector #header

Charger IC Lithium Ion 16-VQFN (3x3) The BQ24075RGTR is a standalone linear charger and power-path management integrated circuit developed by Texas Instruments for single-cell lithium-ion and lithium-polymer battery applications. The device is designed for portable and space-constrained electronic systems requiring efficient battery charging, USB compatibility, and simultaneous system power delivery. The integrated dynamic power-path management architecture enables the system load to be powered while independently charging the battery. The charger supports operation from either a USB power source or an external adapter and includes programmable charging and input current limiting functions for optimized power management. The device incorporates multiple protection and monitoring features including thermal regulation, overvoltage protection, reverse current protection, battery temperature monitoring, and safety timers. The BQ24075RGTR also provides battery disconnect capability through the SYSOFF control function, making it suitable for low-power and portable embedded designs. Typical applications include portable consumer electronics, handheld instruments, wearable devices, wireless accessories, battery-powered IoT equipment, medical portable systems, and embedded rechargeable products. Device Features Standalone single-cell lithium-ion and lithium-polymer battery charger Integrated power-path management architecture Simultaneous battery charging and system power support USB-compatible input current limiting Programmable fast-charge current capability Dynamic power management for unstable or limited input sources Battery temperature monitoring through external thermistor input Integrated thermal regulation and protection mechanisms Reverse current, short-circuit, and input overvoltage protection Programmable safety timers for pre-charge and fast-charge modes Charging status and power-good indication outputs Battery disconnect functionality through SYSOFF control Compact surface-mount VQFN package implementation Electrical Characteristics Designed for single-cell lithium-ion or lithium-polymer batteries Fixed battery regulation voltage suitable for standard single-cell charging Supports USB and external adapter input operation Linear charging topology Wide operating temperature range for portable and industrial applications Programmable input current limit for USB compliance and adapter compatibility Package Information Package Type: VQFN Pin Configuration: Sixteen-pin package Mounting Style: Surface mount Package Dimensions: Compact three-millimeter square footprint Functional Overview The BQ24075RGTR manages power distribution between the external input source, the system load, and the rechargeable battery. When external power is present, the device prioritizes powering the system while charging the battery according to programmable charging parameters. Dynamic power management prevents excessive loading of weak USB or adapter sources by automatically reducing charging current when necessary. Thermal regulation circuitry continuously monitors device temperature and adjusts charging operation to maintain safe operating conditions. Additional integrated protection functions ensure reliable operation during fault conditions such as input overvoltage, battery temperature abnormalities, reverse current flow, and output short circuits. #commonpartslibrary #integratedcircuit #powermanagement

Portenta H7 RA ARM® Cortex®-M0+ MCU 32-Bit Embedded Evaluation Board #Portenta #EvaluationBoard #Arduino #template #part

STM32H5 Series 2 MB Flash 640 kB RAM 250 MHz 32-Bit Microcontroller - LQFP-100 #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 85K Logic Cells 667MHz 400-CSPBGA (17x17) #CommonPartsLibrary #IntegratedCircuit #Embedded #SoC

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit Tri-Core 240MHz 8MB (8M x 8) FLASH 289-LFBGA (14x14) ## Engineering Specification ## General Description The **S32K358GHT1MJBST** is an NXP Semiconductors **S32K3 series automotive microcontroller** designed for high-performance embedded control applications in automotive, industrial, and electrically harsh environments. It is built around an **Arm Cortex-M7 architecture** and provides high processing capability, large embedded flash memory, automotive-grade qualification, security support, and a broad set of communication interfaces. The device is suitable for body control, gateway systems, vehicle networking, motor control, domain control, safety-related embedded systems, and general-purpose automotive electronic control units. ## Device Identification Manufacturer Part Number: **S32K358GHT1MJBST** Manufacturer: **NXP Semiconductors** Product Family: **S32K3** Device Category: **Integrated Circuit** Device Type: **Automotive Microcontroller** Core Architecture: **Arm Cortex-M7** Processing Class: **Thirty-Two-Bit MCU** Qualification: **Automotive Grade, AEC-Q100** ## Functional Description The device functions as a high-performance automotive microcontroller for embedded control and communication systems. It provides processing resources for real-time control, communication management, diagnostics, security handling, and system-level application logic. The microcontroller is designed for scalable automotive platforms where software reuse, safety capability, and peripheral integration are important. ## Core and Processing Description The **S32K358GHT1MJBST** uses an Arm Cortex-M7 based processing architecture with tri-core capability and high-speed operation. The core architecture supports digital signal processing, floating-point operation, interrupt handling, and real-time embedded software execution. This makes the device suitable for control systems that require strong computing performance and deterministic response. ## Memory Description The device includes large embedded flash memory for application firmware storage and integrated RAM for runtime operation, data buffering, communication stacks, and control algorithms. The memory architecture is suitable for complex embedded applications requiring large program space, diagnostics, bootloader support, and over-the-air update capability. ## Security and Safety Description The microcontroller includes hardware security support through **HSE-B security** and is intended for automotive applications where secure boot, cryptographic services, protected firmware operation, and system integrity are important. The S32K3 family also supports automotive safety-oriented development through features such as error correction, monitoring, and diagnostic capability. ## Communication and Interface Description The device supports multiple embedded communication interfaces suitable for vehicle and industrial networks. Supported interface types include CAN, Ethernet, I²C, SPI, UART, LIN, QSPI, SAI, SENT, and FlexIO. These interfaces allow the device to communicate with sensors, actuators, transceivers, memory devices, network controllers, and other electronic control units. ## Analog and Peripheral Description The microcontroller includes analog-to-digital conversion capability, timers, watchdog functions, direct memory access, serial audio support, and general-purpose input and output resources. These peripherals support sensing, control, timing, supervision, communication, and system management functions in embedded hardware designs. ## Electrical Description The device is designed for automotive low-voltage operation and supports use across a wide supply voltage range. It is intended for applications requiring reliable operation in automotive and industrial temperature environments. Proper power supply design, decoupling, reset control, clock configuration, and grounding should follow the manufacturer’s hardware design recommendations. ## Package and Mechanical Description The **S32K358GHT1MJBST** is supplied in a **surface-mount LFBGA package** with a compact ball-grid-array footprint. The package is intended for dense printed circuit board layouts requiring careful routing, controlled assembly process, thermal management, and proper solder joint reliability. ## Mounting and Assembly Description The component is intended for automated surface-mount PCB assembly using BGA-compatible manufacturing processes. PCB layout should follow the recommended footprint, ball escape routing, power-plane design, decoupling capacitor placement, thermal design, and inspection requirements for high-density automotive microcontroller assemblies. ## Application Suitability The device is suitable for automotive electronic control units, body control modules, gateway controllers, vehicle networking systems, motor control platforms, battery-related control systems, industrial controllers, safety-oriented embedded systems, and high-performance general-purpose control applications. ## Design Considerations The design should account for supply voltage range, clocking requirements, flash and RAM usage, thermal limits, package routing density, communication interface requirements, EMC performance, boot configuration, security provisioning, debugging access, software safety requirements, and compliance with automotive design guidelines. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #automotivemcu #nxp #nxpsemiconductors #s32k3 #s32k358 #s32k358ght1mjbst #armcortexm7 #cortexm7 #thirtytwobit #automotiveelectronics #aecq100 #hsesecurity #canfd #ethernet #vehicleelectronics #embeddedhardware #embeddeddesign #ecu #gatewaycontroller #bodycontrolmodule #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

The TPS3839G33DBZT is an ultra-low-power voltage supervisor designed to monitor system supply rails and provide reliable reset signaling for microcontrollers, processors, FPGAs, and other digital systems. The device continuously supervises the supply voltage and asserts a reset output when the monitored voltage falls below the factory-programmed threshold, ensuring proper system startup, shutdown, and fault recovery. Its low quiescent current makes it particularly suitable for battery-powered, portable, and energy-efficient applications where power consumption is critical. The device features a precision voltage monitoring architecture with a fixed reset threshold optimized for nominal logic supply rails. It provides a stable reset output with an internally defined reset timeout period, eliminating the need for external timing components. The compact package and robust noise immunity make it ideal for embedded systems, industrial controls, consumer electronics, IoT devices, medical equipment, and wireless communication platforms. Key Features Ultra-low quiescent current operation Precision fixed-voltage supervision Factory-programmed reset threshold for logic supply monitoring Active-low reset output Internal reset timeout delay High threshold accuracy over temperature Fast response to undervoltage conditions Push-pull reset output configuration No external components required for operation Compact surface-mount package Wide operating temperature range High reliability and low power consumption Applications Microcontroller reset generation Embedded control systems Battery-powered electronics Industrial automation equipment IoT and wireless sensor nodes Portable medical devices Consumer electronics Data acquisition systems Power management subsystems Communication and networking equipment Electrical Characteristics Fixed supply voltage monitoring Precision undervoltage detection Low operating current Integrated reset timing circuitry Stable reset assertion during power-up and brownout conditions Noise-tolerant voltage supervision Reliable operation across specified temperature range Package Information Surface-mount package Compact footprint for space-constrained designs RoHS-compliant construction Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powersupervisor #voltagesupervisor #resetcontroller #powermanagement #embeddedsystems #microcontroller #lowpower #batterypowered #industrialelectronics #iot #electronicsdesign #semiconductor #texasinstruments

Buzzers Transducer, Externally Driven Piezo 3 V 3mA 4kHz 70dB @ 3V, 10cm Surface Mount Solder Pads The CMT-1603-SMT-TR is a compact, surface-mount piezoelectric buzzer transducer designed for applications requiring an externally driven audible indicator. Featuring a low-profile 16 × 16 mm package, it delivers reliable single-tone sound output with low current consumption, making it suitable for portable electronics, industrial equipment, consumer devices, medical instruments, and embedded systems where PCB space is limited. Key Features: Piezoelectric buzzer transducer (externally driven) Surface-mount (SMT) package with solder pad terminals Compact 16 × 16 × 2.8 mm low-profile design Low current consumption (~3 mA typical) Resonant frequency of 4 kHz Sound pressure level of 70 dB @ 3 V, 10 cm Rated voltage: 3 V Maximum input voltage: 25 Vp-p Single-tone acoustic output Operating temperature range: −30°C to +70°C Tape-and-reel (TR) packaging for automated assembly RoHS compliant #Hashtags: #PiezoBuzzer #AudioTransducer #SurfaceMount #SMTBuzzer #ExternallyDriven #LowProfile #LowCurrent #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #MedicalDevices #RoHS #commonpartslibrary #audio #buzzer

Battery Battery Monitor IC Lithium Ion 9-DSBGA The BQ27220YZFR is a highly integrated single-cell battery fuel gauge IC developed for rechargeable lithium-ion and lithium-polymer battery applications. The device utilizes Texas Instruments’ Impedance Track™ algorithm to provide highly accurate battery capacity measurement, state-of-charge estimation, runtime prediction, and battery health monitoring across varying load and temperature conditions. The device is designed for compact portable electronics, wearable devices, IoT products, handheld instruments, and low-power embedded systems requiring precise battery monitoring and extended operating life. The BQ27220YZFR supports system-side fuel gauging without requiring battery pack-side electronics, simplifying battery integration and reducing overall system cost. The fuel gauge continuously monitors battery voltage, current, and temperature to estimate available capacity, remaining runtime, full charge capacity, and state-of-health information. Integrated low-power operation enables ultra-low standby current consumption suitable for always-on battery-powered products. Communication with the host processor is implemented through a standard I²C interface, allowing configuration access, telemetry reporting, and battery parameter monitoring. The device also integrates protection and alert functionality through programmable interrupt outputs and battery condition monitoring features. The BQ27220YZFR is optimized for use with single-cell lithium-based chemistries and supports learning cycles for adaptive battery characterization over product lifetime. Internal data flash memory stores battery profile information and calibration parameters to improve long-term gauging accuracy. The device is supplied in a compact lead-free wafer chip-scale package suitable for space-constrained PCB designs and portable electronics requiring minimal footprint and low-profile assembly. Electrical Characteristics Device Type Single-cell battery fuel gauge and battery monitor IC Battery Chemistry Support Lithium-ion and lithium-polymer rechargeable batteries Input Voltage Range Supports single-cell battery operation Fuel Gauging Method Impedance Track™ algorithm Communication Interface I²C serial interface Measurement Functions Battery voltage monitoring Battery current monitoring Battery temperature monitoring State-of-charge estimation Remaining capacity calculation Full charge capacity estimation State-of-health reporting Runtime prediction Power Consumption Ultra-low operating current for portable applications Temperature Monitoring External thermistor support Host Alert Features Interrupt and alert reporting capability Data Storage Integrated nonvolatile configuration memory Calibration Features Automatic learning and battery characterization support Protection Monitoring Battery condition and system monitoring functions Package Type DSBGA wafer chip-scale package Mounting Style Surface mount Operating Temperature Range Industrial temperature operation suitable for portable electronics Functional Features High-accuracy fuel gauging over battery lifetime Adaptive battery modeling and aging compensation Low-power operation for battery-powered systems Integrated battery profiling capability Real-time remaining runtime estimation Automatic battery learning cycles Compact PCB footprint for portable devices System-side implementation without smart battery pack requirement Programmable battery alert functionality Support for low-power embedded processors and mobile systems Optimized for wearable and IoT applications RoHS compliant and lead-free package construction #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

MSP430 CPUXV2 MSP430F5xx Microcontroller IC 16-Bit 25MHz 256KB (256K x 8) FLASH 100-LQFP (14x14) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #MSP430F5438

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) Absolute 10-WFLGA The BMP581 is a high-precision digital barometric pressure sensor designed for altitude tracking, environmental monitoring, navigation, weather sensing, and industrial measurement applications. It integrates a MEMS pressure sensing element with a low-noise analog front end and digital signal processing to deliver highly accurate pressure and temperature measurements over a wide operating range. The device supports low-power operation, making it suitable for portable, battery-powered, and always-on sensing systems. The sensor communicates through standard digital interfaces and includes configurable sampling, filtering, and interrupt features for flexible system integration. Its compact package enables use in space-constrained embedded designs such as wearables, mobile devices, drones, smart home systems, IoT devices, and industrial instrumentation. Engineering Specification Device Type Digital barometric pressure and temperature sensor Manufacturer Bosch Sensortec Pressure Measurement High-resolution absolute pressure measurement with integrated temperature compensation Temperature Measurement Integrated digital temperature sensing for environmental monitoring and pressure compensation Pressure Range Wide atmospheric pressure sensing range suitable for altitude and environmental applications Interface Support I²C and SPI digital communication interfaces Supply Voltage Low-voltage operation optimized for embedded and portable systems Power Consumption Ultra-low power modes with configurable performance and sampling settings Measurement Features Oversampling support with programmable output data rate and internal filtering Accuracy High absolute and relative pressure accuracy for precise altitude estimation and environmental sensing Noise Performance Low-noise sensor architecture for stable pressure readings and improved altitude resolution Interrupt Features Configurable interrupt generation for data-ready and threshold-based events FIFO Support Integrated FIFO buffering for efficient sensor data management Operating Temperature Industrial temperature operating capability for consumer and industrial environments Package Type Compact surface-mount package optimized for small PCB footprint designs Applications Altitude tracking, indoor navigation, weather stations, drones, wearable electronics, IoT sensing, HVAC systems, industrial monitoring, and portable devices #CommonPartsLibrary #Sensor #Transducer #PressureSensor